TW200725180A - Negative resist composition, and resist pattern formation method - Google Patents

Negative resist composition, and resist pattern formation method

Info

Publication number
TW200725180A
TW200725180A TW095134068A TW95134068A TW200725180A TW 200725180 A TW200725180 A TW 200725180A TW 095134068 A TW095134068 A TW 095134068A TW 95134068 A TW95134068 A TW 95134068A TW 200725180 A TW200725180 A TW 200725180A
Authority
TW
Taiwan
Prior art keywords
resist pattern
formation method
resist composition
pattern formation
negative
Prior art date
Application number
TW095134068A
Other languages
Chinese (zh)
Inventor
Ayako Kusaka
Jun Iwashita
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200725180A publication Critical patent/TW200725180A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention provides a negative resist composition that produces a resist pattern of good shape and a resist pattern forming method. This negative resist composition includes an alkali soluble resin component (A), an acid generator component (B) that generates acid on exposure and a cross-linking component (C), wherein the cross-linking component (C) includes an epoxy cross-linking agent.
TW095134068A 2005-09-16 2006-09-14 Negative resist composition, and resist pattern formation method TW200725180A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005270775A JP2007079481A (en) 2005-09-16 2005-09-16 Negative resist composition and resist pattern forming method

Publications (1)

Publication Number Publication Date
TW200725180A true TW200725180A (en) 2007-07-01

Family

ID=37864779

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134068A TW200725180A (en) 2005-09-16 2006-09-14 Negative resist composition, and resist pattern formation method

Country Status (3)

Country Link
JP (1) JP2007079481A (en)
TW (1) TW200725180A (en)
WO (1) WO2007032181A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10961345B2 (en) 2016-03-23 2021-03-30 Eneos Corporation Curable composition and cured product obtained by curing the same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6954898B2 (en) 2016-06-10 2021-10-27 Ｅｎｅｏｓ株式会社 Epoxy compounds, curable compositions containing them, and cured products obtained by curing curable compositions.
JP7161323B2 (en) * 2018-06-26 2022-10-26 東京応化工業株式会社 COMPOSITION, CURED PRODUCT, PATTERN-FORMING METHOD, COMPOUND, POLYMER, AND METHOD FOR MANUFACTURING COMPOUND
JP7376346B2 (en) * 2019-12-25 2023-11-08 東京応化工業株式会社 Curable composition, cured product, (meth)acrylic resin, and compound
JP7517234B2 (en) * 2021-04-09 2024-07-17 信越化学工業株式会社 Photosensitive resin composition, photosensitive resin film, photosensitive dry film, and pattern forming method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1171363A (en) * 1997-06-25 1999-03-16 Wako Pure Chem Ind Ltd Resist composition and formation of pattern with the same and cross-linking agent for resist agent
JP3046574B2 (en) * 1998-02-20 2000-05-29 株式会社東芝 Negative photosensitive composition and pattern forming method using the same
JP3859352B2 (en) * 1998-04-16 2006-12-20 富士通株式会社 Negative resist composition and method for forming resist pattern
JP2000330282A (en) * 1999-05-24 2000-11-30 Nagase Denshi Kagaku Kk Negative radiation sensitive resin composition
JP2004069855A (en) * 2002-08-02 2004-03-04 Shin Etsu Chem Co Ltd Chemically amplified negative resist material and pattern forming method using the same
JP4306267B2 (en) * 2003-02-05 2009-07-29 Ｊｓｒ株式会社 Negative photosensitive resin composition and cured product thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10961345B2 (en) 2016-03-23 2021-03-30 Eneos Corporation Curable composition and cured product obtained by curing the same
TWI739815B (en) * 2016-03-23 2021-09-21 日商捷客斯能源股份有限公司 Hardening composition and hardened product made by hardening

Also Published As

Publication number Publication date
WO2007032181A1 (en) 2007-03-22
JP2007079481A (en) 2007-03-29

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