TW200725172A - Production method of photoresist liquid and photoresist film obtained by using the same - Google Patents

Production method of photoresist liquid and photoresist film obtained by using the same

Info

Publication number
TW200725172A
TW200725172A TW095130720A TW95130720A TW200725172A TW 200725172 A TW200725172 A TW 200725172A TW 095130720 A TW095130720 A TW 095130720A TW 95130720 A TW95130720 A TW 95130720A TW 200725172 A TW200725172 A TW 200725172A
Authority
TW
Taiwan
Prior art keywords
liquid
photoresist
photoresist liquid
production method
same time
Prior art date
Application number
TW095130720A
Other languages
Chinese (zh)
Other versions
TWI346251B (en
Inventor
Kimitaka Morio
Tomosaburo Aoki
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200725172A publication Critical patent/TW200725172A/en
Application granted granted Critical
Publication of TWI346251B publication Critical patent/TWI346251B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70608—Monitoring the unpatterned workpiece, e.g. measuring thickness, reflectivity or effects of immersion liquid on resist
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Liquid Crystal (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Optical Filters (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

This invention aims to provide a production method of photoresist liquid that can reduce the overall supply cost of photoresist liquid by leaving out the use of an expensive small special-purpose container, which can be directly connected to a nowadays liquid crystal display (LCD) panel production line, at the same time while striving for lowering the transportation cost of photoresist liquid. In the photoresist liquid production method, liquid concentration and/or viscosity in a preparation tank are measured first before applying dilution control by adjusting the inputs of raw material liquid and solvent according to the measurement result and, at the same time, a buffer tank is used to store the photoresist liquid obtained from dilution control for a predetermined period of time so as to allow the photoresist liquid to stabilize.
TW095130720A 2005-09-06 2006-08-21 Production method of photoresist liquid and photoresist film obtained by using the same TW200725172A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005258569A JP2007072138A (en) 2005-09-06 2005-09-06 Method for manufacturing resist liquid and resist film using same

Publications (2)

Publication Number Publication Date
TW200725172A true TW200725172A (en) 2007-07-01
TWI346251B TWI346251B (en) 2011-08-01

Family

ID=37858722

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095130720A TW200725172A (en) 2005-09-06 2006-08-21 Production method of photoresist liquid and photoresist film obtained by using the same

Country Status (4)

Country Link
JP (1) JP2007072138A (en)
KR (1) KR100832058B1 (en)
CN (1) CN1928717A (en)
TW (1) TW200725172A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4704228B2 (en) * 2005-09-06 2011-06-15 東京応化工業株式会社 Resist solution supply device and remodeling kit for obtaining the resist solution supply device
JP5249593B2 (en) * 2008-01-28 2013-07-31 東京応化工業株式会社 Resist solution recovery method
JP5664171B2 (en) * 2010-11-25 2015-02-04 凸版印刷株式会社 Resist adjusting method and resist adjusting apparatus
JP6199686B2 (en) * 2013-10-04 2017-09-20 信越化学工業株式会社 Method for producing resist composition
JP6466650B2 (en) * 2014-04-03 2019-02-06 信越化学工業株式会社 Method for producing resist composition
JP7262601B2 (en) * 2019-09-27 2023-04-21 富士フイルム株式会社 Method for producing radiation-sensitive resin composition, method for forming pattern, method for producing electronic device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2527318B2 (en) * 1986-12-25 1996-08-21 関東化学 株式会社 Method and apparatus for recovering and reusing resist composition
JPH0982602A (en) * 1995-09-12 1997-03-28 Toshiba Corp Resist regeneration and apparatus thereof
KR100236270B1 (en) 1996-11-18 1999-12-15 윤종용 Wafer spin coating system having photoresist spraying check function
JP3559144B2 (en) * 1997-05-23 2004-08-25 大日本スクリーン製造株式会社 Substrate processing equipment
JP3334045B2 (en) * 1999-08-31 2002-10-15 株式会社ヒラノテクシード Coating method and coating device
JP2001170539A (en) * 1999-12-17 2001-06-26 Tokyo Electron Ltd Film-forming apparatus
JP3629407B2 (en) * 2000-05-23 2005-03-16 東京エレクトロン株式会社 Resist coating processing apparatus and resist coating processing method
JP2002023388A (en) * 2000-07-04 2002-01-23 Casio Comput Co Ltd Organic solvent recovering device and pattern forming method using this device
KR100641492B1 (en) * 2002-12-30 2006-10-31 동부일렉트로닉스 주식회사 Photo resister supply device
KR100937703B1 (en) * 2003-03-06 2010-01-20 삼성전자주식회사 Slit coater and photoresist coating device using the same
KR20050068236A (en) * 2003-12-29 2005-07-05 엘지.필립스 엘시디 주식회사 Photoresist supply apparatus
JP4523517B2 (en) * 2005-08-09 2010-08-11 東京エレクトロン株式会社 Coating processing apparatus, coating processing method, and computer-readable storage medium

Also Published As

Publication number Publication date
CN1928717A (en) 2007-03-14
TWI346251B (en) 2011-08-01
KR100832058B1 (en) 2008-05-27
KR20070027447A (en) 2007-03-09
JP2007072138A (en) 2007-03-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees