TW200725137A - Image pickup apparatus and data processing apparatus having the same - Google Patents

Image pickup apparatus and data processing apparatus having the same

Info

Publication number
TW200725137A
TW200725137A TW095147425A TW95147425A TW200725137A TW 200725137 A TW200725137 A TW 200725137A TW 095147425 A TW095147425 A TW 095147425A TW 95147425 A TW95147425 A TW 95147425A TW 200725137 A TW200725137 A TW 200725137A
Authority
TW
Taiwan
Prior art keywords
image pickup
same
data processing
processing apparatus
pickup apparatus
Prior art date
Application number
TW095147425A
Other languages
English (en)
Inventor
Kwang-Hee Lee
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of TW200725137A publication Critical patent/TW200725137A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/026—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using retaining rings or springs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B7/00—Control of exposure by setting shutters, diaphragms or filters, separately or conjointly
    • G03B7/04—Control effected by hand adjustment of a member that senses indication of a pointer of a built- in light-sensitive device, e.g. by restoring point to a fixed associated reference mark
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
TW095147425A 2005-12-19 2006-12-18 Image pickup apparatus and data processing apparatus having the same TW200725137A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050125477A KR100766495B1 (ko) 2005-12-19 2005-12-19 촬상장치 및 이를 구비하는 데이터 처리 장치

Publications (1)

Publication Number Publication Date
TW200725137A true TW200725137A (en) 2007-07-01

Family

ID=38174230

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147425A TW200725137A (en) 2005-12-19 2006-12-18 Image pickup apparatus and data processing apparatus having the same

Country Status (4)

Country Link
US (1) US20070141881A1 (zh)
JP (1) JP2007171950A (zh)
KR (1) KR100766495B1 (zh)
TW (1) TW200725137A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101408655B (zh) * 2007-10-11 2011-07-27 鸿富锦精密工业（深圳）有限公司 镜头模组
KR100964543B1 (ko) * 2008-10-31 2010-06-21 주식회사 하이소닉 소형 카메라모듈용 커버 및 그 제조방법 및 이를 장착한 소형 카메라모듈
SG10201705797UA (en) * 2013-09-10 2017-08-30 Heptagon Micro Optics Pte Ltd Compact opto-electronic modules and fabrication methods for such modules
CN106664358B (zh) * 2014-08-01 2020-06-05 日本电产科宝株式会社 摄像装置、光学设备、电子设备、车辆以及摄像装置的制造方法
JP6657100B2 (ja) * 2014-09-25 2020-03-04 日本電産コパル株式会社 撮像装置、光学機器、電子機器、車両および撮像装置の製造方法
JP6731280B2 (ja) * 2016-05-06 2020-07-29 日本電産コパル株式会社 撮像装置
KR102615941B1 (ko) * 2016-07-29 2023-12-20 삼성전자 주식회사 적외선 차단 필터 및 이를 구비하는 카메라 또는 전자 장치
JP2019020529A (ja) * 2017-07-13 2019-02-07 日本電産コパル株式会社 撮像装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09203838A (ja) * 1996-01-25 1997-08-05 Chiyuugai Oputoronikusu Kk 撮影レンズ構体
JPH10311944A (ja) * 1997-05-14 1998-11-24 Olympus Optical Co Ltd 投光装置
JP2001245217A (ja) * 2000-03-02 2001-09-07 Olympus Optical Co Ltd 小型撮像モジュール
JP4061936B2 (ja) * 2002-03-22 2008-03-19 コニカミノルタホールディングス株式会社 撮像装置
JP2003298888A (ja) * 2002-04-02 2003-10-17 Konica Corp 撮像装置の製造方法
JP4300811B2 (ja) * 2003-02-03 2009-07-22 コニカミノルタホールディングス株式会社 撮像装置及び携帯端末

Also Published As

Publication number Publication date
US20070141881A1 (en) 2007-06-21
KR100766495B1 (ko) 2007-10-15
KR20070064892A (ko) 2007-06-22
JP2007171950A (ja) 2007-07-05

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