TW200724281A - Leadless solder alloy composition having high-temperature and deformation tolerance - Google Patents

Leadless solder alloy composition having high-temperature and deformation tolerance

Info

Publication number
TW200724281A
TW200724281A TW094145058A TW94145058A TW200724281A TW 200724281 A TW200724281 A TW 200724281A TW 094145058 A TW094145058 A TW 094145058A TW 94145058 A TW94145058 A TW 94145058A TW 200724281 A TW200724281 A TW 200724281A
Authority
TW
Taiwan
Prior art keywords
temperature
alloy composition
weight percentage
solder alloy
composition
Prior art date
Application number
TW094145058A
Other languages
English (en)
Chinese (zh)
Other versions
TWI296555B (en:Method
Inventor
chuan-sheng Lv
Fei-Yi Hong
Original Assignee
Liu Chuan Sheng
Lin Yong Shan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liu Chuan Sheng, Lin Yong Shan filed Critical Liu Chuan Sheng
Priority to TW094145058A priority Critical patent/TW200724281A/zh
Publication of TW200724281A publication Critical patent/TW200724281A/zh
Application granted granted Critical
Publication of TWI296555B publication Critical patent/TWI296555B/zh

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  • Conductive Materials (AREA)
  • Contacts (AREA)
TW094145058A 2005-12-19 2005-12-19 Leadless solder alloy composition having high-temperature and deformation tolerance TW200724281A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094145058A TW200724281A (en) 2005-12-19 2005-12-19 Leadless solder alloy composition having high-temperature and deformation tolerance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094145058A TW200724281A (en) 2005-12-19 2005-12-19 Leadless solder alloy composition having high-temperature and deformation tolerance

Publications (2)

Publication Number Publication Date
TW200724281A true TW200724281A (en) 2007-07-01
TWI296555B TWI296555B (en:Method) 2008-05-11

Family

ID=45068812

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094145058A TW200724281A (en) 2005-12-19 2005-12-19 Leadless solder alloy composition having high-temperature and deformation tolerance

Country Status (1)

Country Link
TW (1) TW200724281A (en:Method)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI511827B (zh) * 2011-05-27 2015-12-11 Univ Nat Yunlin Sci & Tech Active soft solder filler composition

Also Published As

Publication number Publication date
TWI296555B (en:Method) 2008-05-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees