TW200723568A - Shape of mounting metal substrate for led element and led element mounting substrate - Google Patents

Shape of mounting metal substrate for led element and led element mounting substrate

Info

Publication number
TW200723568A
TW200723568A TW095125705A TW95125705A TW200723568A TW 200723568 A TW200723568 A TW 200723568A TW 095125705 A TW095125705 A TW 095125705A TW 95125705 A TW95125705 A TW 95125705A TW 200723568 A TW200723568 A TW 200723568A
Authority
TW
Taiwan
Prior art keywords
led element
recess
shape
substrate
metal
Prior art date
Application number
TW095125705A
Other languages
English (en)
Chinese (zh)
Other versions
TWI345316B (https=
Inventor
Noboru Tanaka
Original Assignee
Noboru Tanaka
Ke Guang Yu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noboru Tanaka, Ke Guang Yu filed Critical Noboru Tanaka
Publication of TW200723568A publication Critical patent/TW200723568A/zh
Application granted granted Critical
Publication of TWI345316B publication Critical patent/TWI345316B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
TW095125705A 2005-12-06 2006-07-13 Shape of mounting metal substrate for led element and led element mounting substrate TW200723568A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005352112A JP2007158086A (ja) 2005-12-06 2005-12-06 Ｌｅｄ素子の実装金属基板の形状及びｌｅｄ素子実装基板。

Publications (2)

Publication Number Publication Date
TW200723568A true TW200723568A (en) 2007-06-16
TWI345316B TWI345316B (https=) 2011-07-11

Family

ID=38242040

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095125705A TW200723568A (en) 2005-12-06 2006-07-13 Shape of mounting metal substrate for led element and led element mounting substrate

Country Status (2)

Country Link
JP (1) JP2007158086A (https=)
TW (1) TW200723568A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100888228B1 (ko) * 2007-06-22 2009-03-12 (주)웨이브닉스이에스피 금속베이스 광소자 패키지 모듈 및 그 제조방법
JP5833850B2 (ja) * 2011-07-08 2015-12-16 シチズン電子株式会社 半導体発光装置及びその製造方法

Also Published As

Publication number Publication date
TWI345316B (https=) 2011-07-11
JP2007158086A (ja) 2007-06-21

Similar Documents

Publication Publication Date Title
CN103104834B (zh) 发光装置
US8231248B2 (en) LED unit
WO2006062763A3 (en) Dual led point-source assembly
JP4505543B2 (ja) 集合型ｌｅｄランプ
WO2014039833A4 (en) Integrated led based illumination device
KR101185523B1 (ko) 일체형 도광판이 구비된 ｌｅｄ 평판조명장치
TW201000819A (en) LED illumination device
EP1965122A1 (en) High power light emitting diode (LED) illumination apparatus
US7699517B2 (en) Light emitting diode based surface lighting device
KR102019499B1 (ko) 발광 소자 및 이를 구비한 조명 시스템
US20060255359A1 (en) Light emitting diode light source model
US8360618B2 (en) LED unit
KR100908030B1 (ko) 유연 박형 ｌｅｄ 조명 패널
KR102098162B1 (ko) 발광소자 패키지
TW200723568A (en) Shape of mounting metal substrate for led element and led element mounting substrate
KR20140049274A (ko) 광원 모듈 및 이를 구비한 조명시스템
US20140119017A1 (en) Light source module incorporating laser light source
TWM584019U (zh) 紫外光發光二極體封裝結構
KR101005080B1 (ko) 대전방지기능을 갖는 엘이디 조명기구 및 그 제조방법
CN201237109Y (zh) Led庭院灯
TW200635080A (en) Method for packaging LED to printed-wiring board, and LED packaging printed-wiring board
TW201344305A (zh) 背光模組及其光源裝置
KR20130107779A (ko) 타일형으로 결합되는 씨오비 엘이디 모듈을 구비한 조명장치
US20140049955A1 (en) Led illumination device
CN206347334U (zh) 一种led平板灯

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees