TW200721344A - Body for keeping a wafer, heater unit and wafer prober - Google Patents

Body for keeping a wafer, heater unit and wafer prober

Info

Publication number
TW200721344A
TW200721344A TW095128775A TW95128775A TW200721344A TW 200721344 A TW200721344 A TW 200721344A TW 095128775 A TW095128775 A TW 095128775A TW 95128775 A TW95128775 A TW 95128775A TW 200721344 A TW200721344 A TW 200721344A
Authority
TW
Taiwan
Prior art keywords
wafer
chuck top
heater unit
prober
keeping
Prior art date
Application number
TW095128775A
Other languages
English (en)
Inventor
Katsuhiro Itakura
Masuhiro Natsuhara
Hirohiko Nakata
Original Assignee
Sumitomo Electric Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries filed Critical Sumitomo Electric Industries
Publication of TW200721344A publication Critical patent/TW200721344A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
TW095128775A 2005-08-05 2006-08-04 Body for keeping a wafer, heater unit and wafer prober TW200721344A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005227333A JP2007042958A (ja) 2005-08-05 2005-08-05 ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ

Publications (1)

Publication Number Publication Date
TW200721344A true TW200721344A (en) 2007-06-01

Family

ID=37800646

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128775A TW200721344A (en) 2005-08-05 2006-08-04 Body for keeping a wafer, heater unit and wafer prober

Country Status (3)

Country Link
US (1) US7495460B2 (zh)
JP (1) JP2007042958A (zh)
TW (1) TW200721344A (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3945527B2 (ja) * 2004-11-30 2007-07-18 住友電気工業株式会社 ウェハプローバ用ウェハ保持体およびそれを搭載したウェハプローバ
JP5660753B2 (ja) * 2007-07-13 2015-01-28 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ プラズマエッチング用高温カソード
US9263354B2 (en) * 2014-03-17 2016-02-16 Taiwan Semiconductor Manufacturing Company, Ltd. Pillar structure having cavities
JP6873058B2 (ja) * 2015-06-29 2021-05-19 ヴァリアン セミコンダクター イクイップメント アソシエイツ インコーポレイテッド 基板を保持するための装置
US11280827B2 (en) * 2016-02-29 2022-03-22 Teradyne, Inc. Thermal control of a probe card assembly
WO2017163409A1 (ja) * 2016-03-25 2017-09-28 株式会社日立国際電気 基板支持台、基板処理装置および半導体装置の製造方法
US10161667B1 (en) * 2017-11-15 2018-12-25 Haier Us Appliance Solutions, Inc. Refrigerator appliance having a defrost chamber
CN113053774A (zh) * 2019-12-27 2021-06-29 迪科特测试科技(苏州)有限公司 探测装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1555268A (en) * 1923-05-09 1925-09-29 Westinghouse Electric & Mfg Co Electric air heater
JP3021264B2 (ja) 1993-12-13 2000-03-15 アネルバ株式会社 基板加熱・冷却機構
JP3694985B2 (ja) 1995-06-15 2005-09-14 東芝機械株式会社 気相成長装置
US5820261A (en) 1995-07-26 1998-10-13 Applied Materials, Inc. Method and apparatus for infrared pyrometer calibration in a rapid thermal processing system
US5793019A (en) * 1996-10-23 1998-08-11 Driquik, Inc. Electric infra-red and forced air oven
JP5000803B2 (ja) * 1998-07-14 2012-08-15 デルタ・デザイン・インコーポレイテッド 電子デバイスの速応温度反復制御を液体を利用して広範囲に行うための装置、方法
JP2001033484A (ja) 1999-07-15 2001-02-09 Ibiden Co Ltd ウエハプローバ
US6740853B1 (en) * 1999-09-29 2004-05-25 Tokyo Electron Limited Multi-zone resistance heater
US6761796B2 (en) * 2001-04-06 2004-07-13 Axcelis Technologies, Inc. Method and apparatus for micro-jet enabled, low-energy ion generation transport in plasma processing
JP4127174B2 (ja) 2002-09-27 2008-07-30 住友電気工業株式会社 ウエハー保持体及び半導体製造装置
JP4278046B2 (ja) * 2003-11-10 2009-06-10 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 ヒータ機構付き静電チャック

Also Published As

Publication number Publication date
US20070046307A1 (en) 2007-03-01
JP2007042958A (ja) 2007-02-15
US7495460B2 (en) 2009-02-24

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