TW200720322A - Modified polycarbodiimide composition and modified polycarbodiimide - Google Patents

Modified polycarbodiimide composition and modified polycarbodiimide

Info

Publication number
TW200720322A
TW200720322A TW095119181A TW95119181A TW200720322A TW 200720322 A TW200720322 A TW 200720322A TW 095119181 A TW095119181 A TW 095119181A TW 95119181 A TW95119181 A TW 95119181A TW 200720322 A TW200720322 A TW 200720322A
Authority
TW
Taiwan
Prior art keywords
modified polycarbodiimide
composition
modified
polycarbodiimide
solution
Prior art date
Application number
TW095119181A
Other languages
Chinese (zh)
Inventor
Ikuo Takahashi
Hideshi Tomita
Original Assignee
Nisshin Spinning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nisshin Spinning filed Critical Nisshin Spinning
Publication of TW200720322A publication Critical patent/TW200720322A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C08F8/30—Introducing nitrogen atoms or nitrogen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1089—Polyisoimides

Abstract

This invention provides a modified polycarbodiimide composition and a modified polycarbodiimide, wherein the modified polycarbodiimide composition is improved the storage stability in a solution and the reproduced polycarbodiimide after drying has high thermal resistance and adhesion. Thus almost no amine is remained and no metal corrosion is occurred. This invention also provides a modified polycarbodiimide composition consisted of a modified polycarbodiimide solution, wherein the modified polycarbodiimide is obtained from modification of aromatic diisocyanate compound by diisopropylamine.
TW095119181A 2005-11-21 2006-05-30 Modified polycarbodiimide composition and modified polycarbodiimide TW200720322A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005336166A JP2007138080A (en) 2005-11-21 2005-11-21 Modified polycarbodiimide composition and modified polycarbodiimide

Publications (1)

Publication Number Publication Date
TW200720322A true TW200720322A (en) 2007-06-01

Family

ID=38111669

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095119181A TW200720322A (en) 2005-11-21 2006-05-30 Modified polycarbodiimide composition and modified polycarbodiimide

Country Status (4)

Country Link
JP (1) JP2007138080A (en)
KR (1) KR100708503B1 (en)
CN (1) CN1970632A (en)
TW (1) TW200720322A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2760721A1 (en) * 2009-05-15 2010-11-18 Rhein Chemie Rheinau Gmbh Process for preparing carbodiimides
JP5833900B2 (en) * 2011-11-29 2015-12-16 日清紡ホールディングス株式会社 Resin crosslinking agent and aqueous resin composition
JP6849269B2 (en) * 2015-04-06 2021-03-24 日清紡ケミカル株式会社 Modified polycarbodiimide compound, curing agent and thermosetting resin composition
JP6849268B2 (en) * 2015-04-06 2021-03-24 日清紡ケミカル株式会社 Modified polycarbodiimide compound, curing agent and thermosetting resin composition
US11028216B2 (en) 2016-11-18 2021-06-08 Nisshinbo Chemical Inc. Polycarbodiimide copolymer
WO2018146821A1 (en) 2017-02-07 2018-08-16 株式会社有沢製作所 Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed wiring board, and image display device
WO2018147295A1 (en) 2017-02-07 2018-08-16 株式会社有沢製作所 Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed wiring board, and image display device
JP6947468B2 (en) 2017-08-28 2021-10-13 日清紡ケミカル株式会社 Polycarbodiimide compound and thermosetting resin composition
WO2019059393A1 (en) * 2017-09-25 2019-03-28 日清紡ケミカル株式会社 Curing agent for powder paint and powder paint composition including said curing agent for powder paint
JP7226954B2 (en) * 2018-09-28 2023-02-21 積水化学工業株式会社 Resin materials and multilayer printed wiring boards
CN115190901A (en) * 2020-03-27 2022-10-14 旭化成株式会社 Carbodiimide composition, curing agent composition, coating composition, and resin cured product

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3470464B2 (en) * 1994-07-15 2003-11-25 Ｊｓｒ株式会社 Thermosetting resin composition
JPH11197474A (en) * 1998-01-13 1999-07-27 Nitto Denko Corp Gas separation membrane with polycarbodiimide resin layer
JP3569467B2 (en) * 1998-08-26 2004-09-22 日清紡績株式会社 One-pack type epoxy resin composition
DE19901135A1 (en) * 1999-01-14 2000-07-20 Basf Ag Process for the preparation of N-ethyl-diisopropylamine

Also Published As

Publication number Publication date
JP2007138080A (en) 2007-06-07
KR100708503B1 (en) 2007-04-16
CN1970632A (en) 2007-05-30

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