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Application filed by Ind Tech Res InstfiledCriticalInd Tech Res Inst
Priority to TW94140226ApriorityCriticalpatent/TWI306089B/en
Publication of TW200720201ApublicationCriticalpatent/TW200720201A/en
Application grantedgrantedCritical
Publication of TWI306089BpublicationCriticalpatent/TWI306089B/en
A die for press-molding glass optical elements includes a base material, a removal layer on the base material and a protective layer on the removal layer. An etching process for removing the removal layer is performed when the protective layer is damaged so as to remove the damaged protective layer at the same time.
TW94140226A2005-11-162005-11-16Die for press-molding glass optical element and method of removing protective layer in the same
TWI306089B
(en)
Method for the removal of deposition on an optical element, method for the protection of an optical element, device manufacturing method, apparatus including an optical element, and lithographic apparatus