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Application filed by Hon Hai Prec Ind Co LtdfiledCriticalHon Hai Prec Ind Co Ltd
Priority to TW94138817ApriorityCriticalpatent/TWI358526B/en
Publication of TW200718918ApublicationCriticalpatent/TW200718918A/en
Application grantedgrantedCritical
Publication of TWI358526BpublicationCriticalpatent/TWI358526B/en
Investigating Or Analyzing Materials Using Thermal Means
(AREA)
Die Bonding
(AREA)
Abstract
An apparatus includes a base, a heating device, a heat sink, a control system and an atomic force microscope. The atomic force microscope has a detecting pin. The control system includes a temperature detecting part and a temperature controlling part. The temperature detecting part is connected with the base. The temperature controlling part is simultaneity connected with the heating device and the heat sink. The present invention also provides a method of measuring the structure changes of a heat spreader during variational temperature conditions.
TW94138817A2005-11-042005-11-04Apparatus and method of measuring the structure ch
TWI358526B
(en)