TW200718725A - Phosphorus-containing epoxy composition - Google Patents

Phosphorus-containing epoxy composition

Info

Publication number
TW200718725A
TW200718725A TW094138522A TW94138522A TW200718725A TW 200718725 A TW200718725 A TW 200718725A TW 094138522 A TW094138522 A TW 094138522A TW 94138522 A TW94138522 A TW 94138522A TW 200718725 A TW200718725 A TW 200718725A
Authority
TW
Taiwan
Prior art keywords
phosphorus
containing epoxy
hardener
epoxy composition
weight
Prior art date
Application number
TW094138522A
Other languages
Chinese (zh)
Other versions
TWI311568B (en
Inventor
Sheng-Chun Ho
Li-Ming Chou
Chen-Yu Hsien
Li-Chih Yu
Shing-Long Chung
Chin Fu Wu
Ming Chuan Chung
Yutia Lin
Original Assignee
Elite Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elite Material Co Ltd filed Critical Elite Material Co Ltd
Priority to TW094138522A priority Critical patent/TW200718725A/en
Publication of TW200718725A publication Critical patent/TW200718725A/en
Application granted granted Critical
Publication of TWI311568B publication Critical patent/TWI311568B/zh

Links

Abstract

The present invention relates to a phosphorus-containing epoxy composition comprising : (A) phosphorus-containing epoxy, (B) hardener, (C) one or more types of epoxy, and (D) inorganic filler; wherein on the basis of the total weight of components (A), (B) and (C), the hardener (B) comprises 15% to 30% by weight of benzo oxozine,and 2.5% to 9% by weight of phenylethlylene maleic anhydride. The phosphorus-containing epoxy composition comprising specific ratio of benzo oxozine and phenylethlylene maleic anhydride as hardener which provide flame retarding characteristic and heat-resistance, but also have the properties of high stability on dimension, low moisture absorption, and excellent electric characteristic. It is suitable for the manufacturing of pre-immersing materials, laminated materials, IC packaging materials, copper clad laminate, printed circuits, IC package substrates.
TW094138522A 2005-11-03 2005-11-03 Phosphorus-containing epoxy composition TW200718725A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094138522A TW200718725A (en) 2005-11-03 2005-11-03 Phosphorus-containing epoxy composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094138522A TW200718725A (en) 2005-11-03 2005-11-03 Phosphorus-containing epoxy composition

Publications (2)

Publication Number Publication Date
TW200718725A true TW200718725A (en) 2007-05-16
TWI311568B TWI311568B (en) 2009-07-01

Family

ID=45072449

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094138522A TW200718725A (en) 2005-11-03 2005-11-03 Phosphorus-containing epoxy composition

Country Status (1)

Country Link
TW (1) TW200718725A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417339B (en) * 2011-01-14 2013-12-01 Elite Material Co Ltd Resin composition
TWI424021B (en) * 2009-06-30 2014-01-21 Elite Material Co Ltd Thermosetting resin composition and copper clad laminate
TWI460225B (en) * 2012-07-17 2014-11-11 Elite Electronic Material Kunshan Co Ltd Halogen-free resin composition and the use of its copper foil substrate and printed circuit board
TWI494340B (en) * 2010-08-02 2015-08-01 Taiwan Union Technology Corp Epoxy resin composition, and prepreg and printed wiring board using the same
US10414943B2 (en) 2009-12-25 2019-09-17 Hitachi Chemical Company, Ltd. Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103724936B (en) * 2012-10-10 2016-08-03 慧智科技（中国）有限公司 Improve the Halogen-free low dielectric epoxy resin composition of shock resistance
TWI646142B (en) 2012-12-21 2019-01-01 台光電子材料股份有限公司 Resin composition and copper foil substrate and printed circuit board using same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI424021B (en) * 2009-06-30 2014-01-21 Elite Material Co Ltd Thermosetting resin composition and copper clad laminate
US10414943B2 (en) 2009-12-25 2019-09-17 Hitachi Chemical Company, Ltd. Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
TWI494340B (en) * 2010-08-02 2015-08-01 Taiwan Union Technology Corp Epoxy resin composition, and prepreg and printed wiring board using the same
TWI417339B (en) * 2011-01-14 2013-12-01 Elite Material Co Ltd Resin composition
TWI460225B (en) * 2012-07-17 2014-11-11 Elite Electronic Material Kunshan Co Ltd Halogen-free resin composition and the use of its copper foil substrate and printed circuit board

Also Published As

Publication number Publication date
TWI311568B (en) 2009-07-01

Similar Documents

Publication Publication Date Title
TW200718725A (en) Phosphorus-containing epoxy composition
MY162500A (en) Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board
MY137500A (en) Resin compound for fabricating interlayer dielectric of printed wiring board, resin sheet and resin applied-copper foil for forming insulating layer using the resin compound, and copper-clad laminateusing them
WO2009040921A1 (en) Epoxy resin composition and, produced therewith, prepreg and metal clad laminate
MY160024A (en) Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these
TW200733824A (en) Wiring circuit board
WO2007120203A3 (en) Flame retardant compositions with a phosphorated compound
TW200745195A (en) Insulating material, process for producing electronic part/device, and electronic part/device
TW200635985A (en) Modified phenolic resin and its manufacturing method, epoxy resin composition containing the same, and prepreg impregnated with the composition
SG179001A1 (en) Adhesive film, multilayer circuit board, electronic component and semiconductor device
WO2007100724A3 (en) A halogen-free phosphorous epoxy resin composition
WO2005035456A3 (en) Glass compositions, glass fibers, and methods of inhibiting boron volatization from glass compositions
TW200631977A (en) Non-halogen flame retardant epoxy resin composition, and prepreg and copper-clad laminate using the same
MY167070A (en) Epoxy resin composition, prepreg, metal-clad laminate, printed wiring board and semiconductor device
WO2003061029A3 (en) Organic compositions
TW200745260A (en) Thermosetting resin composition and uses thereof
EP1818350A4 (en) Epoxy resin composition for prepreg, prepreg, and multilayered printed wiring board
WO2009028493A1 (en) Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device
EP2133398A4 (en) Fire-retardant adhesive resin composition, and adhesive film using the same
TW200617100A (en) Epoxy resin composition for copper clad laminate
TW200610775A (en) Curable resin composition and its use
WO2011111964A3 (en) Photosensitive resin composition having excellent heat resistance and mechanical properties, and protective film for a printed circuit board
WO2009034023A3 (en) Flame retardant combinations of hydroxyalkyl phosphine oxides with 1,3,5-triazines and epoxides
TW200710120A (en) Resin compositions, prepregs and laminates
WO2012044029A3 (en) Laminate comprising an epoxy resin and having superior formability, and method for producing same