TWI311568B - - Google Patents

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Publication number
TWI311568B
TWI311568B TW94138522A TW94138522A TWI311568B TW I311568 B TWI311568 B TW I311568B TW 94138522 A TW94138522 A TW 94138522A TW 94138522 A TW94138522 A TW 94138522A TW I311568 B TWI311568 B TW I311568B
Authority
TW
Taiwan
Application number
TW94138522A
Other languages
Chinese (zh)
Other versions
TW200718725A (en
Inventor
Sheng Chun Ho
Li Ming Chou
Chen Yu Hsieh
Li Chih Yu
Shing Long Chung
Chin Fu Wu
Ming Chuan Chung
Yutia Lin
Original Assignee
Elite Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elite Material Co Ltd filed Critical Elite Material Co Ltd
Priority to TW094138522A priority Critical patent/TW200718725A/en
Publication of TW200718725A publication Critical patent/TW200718725A/en
Application granted granted Critical
Publication of TWI311568B publication Critical patent/TWI311568B/zh

Links

TW094138522A 2005-11-03 2005-11-03 Phosphorus-containing epoxy composition TW200718725A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094138522A TW200718725A (en) 2005-11-03 2005-11-03 Phosphorus-containing epoxy composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094138522A TW200718725A (en) 2005-11-03 2005-11-03 Phosphorus-containing epoxy composition

Publications (2)

Publication Number Publication Date
TW200718725A TW200718725A (en) 2007-05-16
TWI311568B true TWI311568B (en) 2009-07-01

Family

ID=45072449

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094138522A TW200718725A (en) 2005-11-03 2005-11-03 Phosphorus-containing epoxy composition

Country Status (1)

Country Link
TW (1) TW200718725A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103724936A (en) * 2012-10-10 2014-04-16 慧智科技（中国）有限公司 Low-dielectric halogen-free epoxy resin composite with improved impact resistance property
US9394438B2 (en) 2012-12-21 2016-07-19 Elite Material Co., Ltd. Resin composition, copper-clad laminate and printed circuit board for use therewith

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI424021B (en) * 2009-06-30 2014-01-21 Elite Material Co Ltd Thermosetting resin composition and copper clad laminate
CN102656234B (en) 2009-12-25 2015-06-17 日立化成工业株式会社 Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
TWI494340B (en) * 2010-08-02 2015-08-01 Taiwan Union Technology Corp Epoxy resin composition, and prepreg and printed wiring board using the same
TWI417339B (en) * 2011-01-14 2013-12-01 Elite Material Co Ltd Resin composition
CN103540101B (en) * 2012-07-17 2016-01-20 台光电子材料(昆山)有限公司 Non-halogen resin composition and apply its copper clad laminate and printed circuit board (PCB)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103724936A (en) * 2012-10-10 2014-04-16 慧智科技（中国）有限公司 Low-dielectric halogen-free epoxy resin composite with improved impact resistance property
CN103724936B (en) * 2012-10-10 2016-08-03 慧智科技（中国）有限公司 Improve the Halogen-free low dielectric epoxy resin composition of shock resistance
US9394438B2 (en) 2012-12-21 2016-07-19 Elite Material Co., Ltd. Resin composition, copper-clad laminate and printed circuit board for use therewith

Also Published As

Publication number Publication date
TW200718725A (en) 2007-05-16

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