TW200716267A - Ozonation for elimination of bacteria for wet processing systems - Google Patents
Ozonation for elimination of bacteria for wet processing systemsInfo
- Publication number
- TW200716267A TW200716267A TW095135281A TW95135281A TW200716267A TW 200716267 A TW200716267 A TW 200716267A TW 095135281 A TW095135281 A TW 095135281A TW 95135281 A TW95135281 A TW 95135281A TW 200716267 A TW200716267 A TW 200716267A
- Authority
- TW
- Taiwan
- Prior art keywords
- ozonation
- elimination
- bacteria
- processing systems
- wet processing
- Prior art date
Links
- 241000894006 Bacteria Species 0.000 title 1
- 230000008030 elimination Effects 0.000 title 1
- 238000003379 elimination reaction Methods 0.000 title 1
- 238000006385 ozonation reaction Methods 0.000 title 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 abstract 3
- 239000012530 fluid Substances 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 3
- 239000004065 semiconductor Substances 0.000 abstract 3
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F9/00—Multistage treatment of water, waste water or sewage
- C02F9/20—Portable or detachable small-scale multistage treatment devices, e.g. point of use or laboratory water purification systems
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
- G03F7/422—Stripping or agents therefor using liquids only
- G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/005—Details of cleaning machines or methods involving the use or presence of liquid or steam the liquid being ozonated
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/72—Treatment of water, waste water, or sewage by oxidation
- C02F1/78—Treatment of water, waste water, or sewage by oxidation with ozone
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/02—Non-contaminated water, e.g. for industrial water supply
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2201/00—Apparatus for treatment of water, waste water or sewage
- C02F2201/78—Details relating to ozone treatment devices
- C02F2201/782—Ozone generators
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Water Supply & Treatment (AREA)
- Hydrology & Water Resources (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Clinical Laboratory Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Oxygen, Ozone, And Oxides In General (AREA)
- Apparatus For Disinfection Or Sterilisation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71976905P | 2005-09-23 | 2005-09-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200716267A true TW200716267A (en) | 2007-05-01 |
Family
ID=37836790
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095135281A TW200716267A (en) | 2005-09-23 | 2006-09-22 | Ozonation for elimination of bacteria for wet processing systems |
Country Status (3)
Country | Link |
---|---|
US (2) | US20070068552A1 (zh) |
TW (1) | TW200716267A (zh) |
WO (1) | WO2007038263A2 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007038263A2 (en) * | 2005-09-23 | 2007-04-05 | Applied Materials, Inc. | Ozonation for elimination of bacteria for wet processing systems |
US9068149B2 (en) | 2007-03-14 | 2015-06-30 | Food Safety Technology, Llc | Ozone cleaning system |
US20080293337A1 (en) * | 2007-05-21 | 2008-11-27 | Applied Materials, Inc. | Methods and apparatus for polishing a notch of a substrate by substrate vibration |
US20110030730A1 (en) * | 2008-03-13 | 2011-02-10 | Lynn Daniel W | System for producing and distributing an ozonated fluid |
US20100105291A1 (en) * | 2008-10-24 | 2010-04-29 | Applied Materials, Inc. | Methods and apparatus for polishing a notch of a substrate |
US20100105299A1 (en) * | 2008-10-24 | 2010-04-29 | Applied Materials, Inc. | Methods and apparatus for polishing an edge and/or notch of a substrate |
US10391527B2 (en) * | 2014-02-10 | 2019-08-27 | Magna Closures Inc. | Ozone cleaning system and method of operating same |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4778532A (en) * | 1985-06-24 | 1988-10-18 | Cfm Technologies Limited Partnership | Process and apparatus for treating wafers with process fluids |
US5306500A (en) * | 1988-11-21 | 1994-04-26 | Collagen Corporation | Method of augmenting tissue with collagen-polymer conjugates |
US5611868A (en) * | 1994-12-13 | 1997-03-18 | U. S. Products, Inc. | Fabric cleaner with ozone injection |
JP3575859B2 (ja) * | 1995-03-10 | 2004-10-13 | 株式会社東芝 | 半導体基板の表面処理方法及び表面処理装置 |
WO1998008248A1 (fr) * | 1996-08-20 | 1998-02-26 | Organo Corporation | Procede et dispositif pour laver des composants electroniques ou similaires |
US6701941B1 (en) * | 1997-05-09 | 2004-03-09 | Semitool, Inc. | Method for treating the surface of a workpiece |
US6240933B1 (en) * | 1997-05-09 | 2001-06-05 | Semitool, Inc. | Methods for cleaning semiconductor surfaces |
DE19810948C2 (de) * | 1998-03-13 | 2000-07-20 | Schroff Gmbh | Belüftbarer Elektronikschrank |
US6802984B1 (en) * | 1999-02-19 | 2004-10-12 | Zentox Corporation | Poultry processing water recovery and re-use process |
US6203659B1 (en) * | 1999-03-30 | 2001-03-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method and apparatus for controlling the quality of a photoresist stripper bath |
US20020121290A1 (en) * | 1999-08-25 | 2002-09-05 | Applied Materials, Inc. | Method and apparatus for cleaning/drying hydrophobic wafers |
US6468362B1 (en) * | 1999-08-25 | 2002-10-22 | Applied Materials, Inc. | Method and apparatus for cleaning/drying hydrophobic wafers |
US6758938B1 (en) * | 1999-08-31 | 2004-07-06 | Micron Technology, Inc. | Delivery of dissolved ozone |
AU4308101A (en) * | 1999-12-02 | 2001-06-12 | Cfmt, Inc. | Apparatus for providing ozonated process fluid and methods for using same |
JP3545672B2 (ja) * | 2000-04-21 | 2004-07-21 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
US20040118697A1 (en) * | 2002-10-01 | 2004-06-24 | Applied Materials, Inc. | Metal deposition process with pre-cleaning before electrochemical deposition |
WO2007038263A2 (en) * | 2005-09-23 | 2007-04-05 | Applied Materials, Inc. | Ozonation for elimination of bacteria for wet processing systems |
-
2006
- 2006-09-22 WO PCT/US2006/036971 patent/WO2007038263A2/en active Application Filing
- 2006-09-22 TW TW095135281A patent/TW200716267A/zh unknown
- 2006-09-22 US US11/525,532 patent/US20070068552A1/en not_active Abandoned
-
2008
- 2008-10-12 US US12/249,954 patent/US20090044838A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2007038263A3 (en) | 2007-06-14 |
US20070068552A1 (en) | 2007-03-29 |
WO2007038263A2 (en) | 2007-04-05 |
US20090044838A1 (en) | 2009-02-19 |
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