TW200715603A - Light-emitting diode and method for manufacturing the same - Google Patents

Light-emitting diode and method for manufacturing the same

Info

Publication number
TW200715603A
TW200715603A TW094135569A TW94135569A TW200715603A TW 200715603 A TW200715603 A TW 200715603A TW 094135569 A TW094135569 A TW 094135569A TW 94135569 A TW94135569 A TW 94135569A TW 200715603 A TW200715603 A TW 200715603A
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
separation
manufacturing
substrate
Prior art date
Application number
TW094135569A
Other languages
Chinese (zh)
Other versions
TWI281275B (en
Inventor
Chin-Ming Lin
Original Assignee
Chin-Ming Lin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chin-Ming Lin filed Critical Chin-Ming Lin
Priority to TW94135569A priority Critical patent/TWI281275B/en
Publication of TW200715603A publication Critical patent/TW200715603A/en
Application granted granted Critical
Publication of TWI281275B publication Critical patent/TWI281275B/en

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  • Led Devices (AREA)
  • Dicing (AREA)

Abstract

A light-emitting diode and a method for manufacturing the same are described. In the method for manufacturing the light-emitting diode, a light-emitting diode wafer is provided, wherein the light-emitting diode wafer comprises a substrate and an opto-electronic structure deposed on the substrate, and the light-emitting diode wafer includes a plurality of scribe streets set in the opto-electronic structure. A first cutting process is performed to form a plurality of first separation lanes respectively in the scribe streets. Next, a second cutting process is performed to form a plurality of second separation lanes in a surface of the substrate, wherein the second separation lanes respectively correspond to the first separation lanes, and each of the first separation lanes is separated from the corresponding second separation lane by a predetermined horizontal distance. Then, a break process is performed to apply a stress between the corresponding first separation lane and the second separation lane, so as to divide the light-emitting diode wafer into a plurality of light-emitting diode chips.
TW94135569A 2005-10-12 2005-10-12 Light-emitting diode and method for manufacturing the same TWI281275B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94135569A TWI281275B (en) 2005-10-12 2005-10-12 Light-emitting diode and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94135569A TWI281275B (en) 2005-10-12 2005-10-12 Light-emitting diode and method for manufacturing the same

Publications (2)

Publication Number Publication Date
TW200715603A true TW200715603A (en) 2007-04-16
TWI281275B TWI281275B (en) 2007-05-11

Family

ID=38741684

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94135569A TWI281275B (en) 2005-10-12 2005-10-12 Light-emitting diode and method for manufacturing the same

Country Status (1)

Country Link
TW (1) TWI281275B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104037278A (en) * 2014-06-27 2014-09-10 圆融光电科技有限公司 Method for manufacturing LED chip and LED chip
CN108461237A (en) * 2017-12-31 2018-08-28 广州奥松电子有限公司 The production method of absolute humidity sensor, thermistor and thermistor

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI407587B (en) * 2009-01-21 2013-09-01 Lumitek Corp Method of grinding light emitting diode wafer
TW201234463A (en) * 2011-02-01 2012-08-16 Lextar Electronics Corp Semiconductor device and cutting method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104037278A (en) * 2014-06-27 2014-09-10 圆融光电科技有限公司 Method for manufacturing LED chip and LED chip
CN104037278B (en) * 2014-06-27 2017-01-18 圆融光电科技有限公司 Method for manufacturing LED chip and LED chip
CN108461237A (en) * 2017-12-31 2018-08-28 广州奥松电子有限公司 The production method of absolute humidity sensor, thermistor and thermistor

Also Published As

Publication number Publication date
TWI281275B (en) 2007-05-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees