TW200715505A - Method for recycling and regenerating a substrate chuck - Google Patents

Method for recycling and regenerating a substrate chuck

Info

Publication number
TW200715505A
TW200715505A TW094135134A TW94135134A TW200715505A TW 200715505 A TW200715505 A TW 200715505A TW 094135134 A TW094135134 A TW 094135134A TW 94135134 A TW94135134 A TW 94135134A TW 200715505 A TW200715505 A TW 200715505A
Authority
TW
Taiwan
Prior art keywords
metal
connector
substrate chuck
grounding hole
hole
Prior art date
Application number
TW094135134A
Other languages
Chinese (zh)
Inventor
David Tu
Charlie Chang
Chih-Hao Chen
Kuo-Ming Lin
Original Assignee
Duratek Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Duratek Inc filed Critical Duratek Inc
Priority to TW094135134A priority Critical patent/TW200715505A/en
Publication of TW200715505A publication Critical patent/TW200715505A/en

Links

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

A method for recycling and regenerating a substrate chuck is disclosed. A recycled substrate chuck includes a ceramic plate and a first metal connector for ground wiring. The first metal connector is removed to expose a grounding hole in the substrate chuck. Next, the grounding hole is masked by acid/alkaline-resistant material, it is good to perform a chemical cleaning of the ceramic plate. Finally, a metal plug/second metal connector is brazed to be connected in the grounding hole, wherein the second metal connector may be the same as or different from the first metal connector. Moreover, the metal plug/second metal connector has an internal thread for screwing a ground wiring or screwing another connector soldering a ground wiring. Accordingly, the method can recycle and regenerate the substrate chuck. Preferably, a hole-enlarging step may be preformed prior to the chemical cleaning, which destroys the internal thread of the grounding hole such that a metal plug, having an internal thread with a same hole diameter as that of the original grounding hole, can be brazed in the enlarged grounding hole for screwing another first connector. Accordingly, the connection relationship between the first connector and the ceramic plate is improved from brazing to metal-to-metal screwing. In next time of recycling, a brazing step will not be required.
TW094135134A 2005-10-07 2005-10-07 Method for recycling and regenerating a substrate chuck TW200715505A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094135134A TW200715505A (en) 2005-10-07 2005-10-07 Method for recycling and regenerating a substrate chuck

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094135134A TW200715505A (en) 2005-10-07 2005-10-07 Method for recycling and regenerating a substrate chuck

Publications (1)

Publication Number Publication Date
TW200715505A true TW200715505A (en) 2007-04-16

Family

ID=57911588

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094135134A TW200715505A (en) 2005-10-07 2005-10-07 Method for recycling and regenerating a substrate chuck

Country Status (1)

Country Link
TW (1) TW200715505A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481314B (en) * 2012-12-25 2015-04-11 Takigen Mfg Co Grounding terminal block

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI481314B (en) * 2012-12-25 2015-04-11 Takigen Mfg Co Grounding terminal block

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