TW200715451A - Transfer device and transfer method - Google Patents

Transfer device and transfer method

Info

Publication number
TW200715451A
TW200715451A TW095134636A TW95134636A TW200715451A TW 200715451 A TW200715451 A TW 200715451A TW 095134636 A TW095134636 A TW 095134636A TW 95134636 A TW95134636 A TW 95134636A TW 200715451 A TW200715451 A TW 200715451A
Authority
TW
Taiwan
Prior art keywords
transfer
transfer device
chip
sheet
support
Prior art date
Application number
TW095134636A
Other languages
Chinese (zh)
Inventor
Masahisa Otsuka
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200715451A publication Critical patent/TW200715451A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Abstract

A transfer device (10) comprising a first support (11) for supporting chips (C) segmented by dicing a semiconductor wafer, and a second support (12) including a sheet (S) to which the chip (C) is to be transferred. The transfer device (10) is further provided with an expander (44) for radically expanding a dicing tape (DT), a camera (37) for detecting a gap between the chips (C) formed by expansion, and a section (17) for transferring each chip (C) to the sheet (S) on condition that the gap reached a set dimension.
TW095134636A 2005-10-04 2006-09-19 Transfer device and transfer method TW200715451A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005291134A JP5005904B2 (en) 2005-10-04 2005-10-04 Transfer device and transfer method

Publications (1)

Publication Number Publication Date
TW200715451A true TW200715451A (en) 2007-04-16

Family

ID=37906076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095134636A TW200715451A (en) 2005-10-04 2006-09-19 Transfer device and transfer method

Country Status (3)

Country Link
JP (1) JP5005904B2 (en)
TW (1) TW200715451A (en)
WO (1) WO2007040032A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5912274B2 (en) * 2011-03-28 2016-04-27 株式会社東京精密 Chip dividing / separating device and chip dividing / separating method
US9714462B2 (en) * 2014-10-08 2017-07-25 Applied Materials, Inc. Vacuum pre-wetting apparatus and methods
CN112908929B (en) * 2019-06-26 2022-09-20 青岛航天半导体研究所有限公司 Chip tightening manual picking method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54161882A (en) * 1978-06-12 1979-12-21 Matsushita Electronics Corp Manufacture of semiconductor device
JPH07105404B2 (en) * 1986-03-25 1995-11-13 株式会社東芝 Die bonding machine
JPH0729855A (en) * 1993-07-12 1995-01-31 Sumitomo Electric Ind Ltd Expanding method of semiconductor wafer
JP3064979B2 (en) * 1997-08-19 2000-07-12 日本電気株式会社 Dicing method for semiconductor wafer
JP2001110757A (en) * 1999-10-06 2001-04-20 Toshiba Corp Manufacturing method of semiconductor device
JP2001118860A (en) * 1999-10-20 2001-04-27 Matsushita Electric Ind Co Ltd Method and device for recognizing semiconductor element, method and device for picking up thereby, and method and device for transfer
JP4197874B2 (en) * 2002-02-14 2008-12-17 ヒューグルエレクトロニクス株式会社 Low expansion rate expander and expansion film sheet fixing method
WO2004105109A1 (en) * 2003-05-22 2004-12-02 Tokyo Seimitsu Co., Ltd. Dicing device
JP2005251986A (en) * 2004-03-04 2005-09-15 Disco Abrasive Syst Ltd Wafer separation detecting method and apparatus thereof

Also Published As

Publication number Publication date
JP2007103644A (en) 2007-04-19
JP5005904B2 (en) 2012-08-22
WO2007040032A1 (en) 2007-04-12

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