TW200715069A - Analysis method, exposure method, and method for manufacturing device - Google Patents

Analysis method, exposure method, and method for manufacturing device

Info

Publication number
TW200715069A
TW200715069A TW095133186A TW95133186A TW200715069A TW 200715069 A TW200715069 A TW 200715069A TW 095133186 A TW095133186 A TW 095133186A TW 95133186 A TW95133186 A TW 95133186A TW 200715069 A TW200715069 A TW 200715069A
Authority
TW
Taiwan
Prior art keywords
measuring
manufacturing device
exposure
analysis
substrate
Prior art date
Application number
TW095133186A
Other languages
Chinese (zh)
Other versions
TWI430040B (en
Inventor
Katsushi Nakano
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200715069A publication Critical patent/TW200715069A/en
Application granted granted Critical
Publication of TWI430040B publication Critical patent/TWI430040B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply

Abstract

An analysis method has a step (SA60) for developing a substrate, a first measuring step (SA50) for measuring an abnormality of the substrate before it is developed, a second measuring step (SA70) for measuring an abnormality of the substrate developed, and a step (SA80) for analyzing, based on the measurement results of the first measuring step (SA50) and the second measuring step (SA70), an exposure failure of the substrate exposed through liquid.
TW095133186A 2005-09-09 2006-09-08 Analytical method, exposure method and component manufacturing method TWI430040B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005261887 2005-09-09

Publications (2)

Publication Number Publication Date
TW200715069A true TW200715069A (en) 2007-04-16
TWI430040B TWI430040B (en) 2014-03-11

Family

ID=37835942

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095133186A TWI430040B (en) 2005-09-09 2006-09-08 Analytical method, exposure method and component manufacturing method

Country Status (3)

Country Link
JP (1) JP4992718B2 (en)
TW (1) TWI430040B (en)
WO (1) WO2007029828A1 (en)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003220830A1 (en) * 2002-03-12 2003-09-22 Olympus Corporation Semiconductor manufacturing method and device thereof
SG125926A1 (en) * 2002-11-01 2006-10-30 Asml Netherlands Bv Inspection method and device manufacturing method
US7403259B2 (en) * 2003-10-17 2008-07-22 Asml Netherlands B.V. Lithographic processing cell, lithographic apparatus, track and device manufacturing method
JP2006222284A (en) * 2005-02-10 2006-08-24 Toshiba Corp Pattern forming method and manufacturing method for semiconductor device
JP4524207B2 (en) * 2005-03-02 2010-08-11 富士フイルム株式会社 Positive resist composition for immersion exposure and pattern forming method using the same
JP4566035B2 (en) * 2005-03-11 2010-10-20 東京エレクトロン株式会社 Coating and developing apparatus and method thereof

Also Published As

Publication number Publication date
TWI430040B (en) 2014-03-11
JPWO2007029828A1 (en) 2009-03-19
WO2007029828A1 (en) 2007-03-15
JP4992718B2 (en) 2012-08-08

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees