TW200714726A - Process for producing izo sputtering target - Google Patents

Process for producing izo sputtering target

Info

Publication number
TW200714726A
TW200714726A TW095123888A TW95123888A TW200714726A TW 200714726 A TW200714726 A TW 200714726A TW 095123888 A TW095123888 A TW 095123888A TW 95123888 A TW95123888 A TW 95123888A TW 200714726 A TW200714726 A TW 200714726A
Authority
TW
Taiwan
Prior art keywords
sputtering target
izo sputtering
molding
producing
production
Prior art date
Application number
TW095123888A
Other languages
Chinese (zh)
Other versions
TWI422699B (en
Inventor
Kazuyoshi Inoue
Akira Kaijo
Masato Matsubara
Original Assignee
Idemitsu Kosan Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005193504A external-priority patent/JP4758697B2/en
Priority claimed from JP2005193505A external-priority patent/JP4755453B2/en
Application filed by Idemitsu Kosan Co filed Critical Idemitsu Kosan Co
Publication of TW200714726A publication Critical patent/TW200714726A/en
Application granted granted Critical
Publication of TWI422699B publication Critical patent/TWI422699B/en

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Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/453Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/62605Treating the starting powders individually or as mixtures
    • C04B35/62645Thermal treatment of powders or mixtures thereof other than sintering
    • C04B35/62655Drying, e.g. freeze-drying, spray-drying, microwave or supercritical drying
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    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/64Burning or sintering processes
    • C04B35/645Pressure sintering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08Oxides
    • C23C14/086Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3286Gallium oxides, gallates, indium oxides, indates, thallium oxides, thallates or oxide forming salts thereof, e.g. zinc gallate
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54Particle size related information
    • C04B2235/5409Particle size related information expressed by specific surface values
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54Particle size related information
    • C04B2235/5418Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5436Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54Particle size related information
    • C04B2235/5418Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5445Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54Particle size related information
    • C04B2235/5418Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5454Particle size related information expressed by the size of the particles or aggregates thereof nanometer sized, i.e. below 100 nm
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/604Pressing at temperatures other than sintering temperatures
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658Atmosphere during thermal treatment
    • C04B2235/6583Oxygen containing atmosphere, e.g. with changing oxygen pressures
    • C04B2235/6585Oxygen containing atmosphere, e.g. with changing oxygen pressures at an oxygen percentage above that of air
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    • C04B2235/00Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/74Physical characteristics
    • C04B2235/77Density

Abstract

A process for IZO sputtering target production in which the number of steps can be reduced while maintaining properties required of an IZO sputtering target to thereby attain an improvement in productivity and a reduction in production cost. Also provided is the production process in which a reduced sintering temperature can be used to thereby attain an improvement in productivity and a reduction in production cost. The process for producing an IZO sputtering target is characterized by comprising: a mixing/pulverization step in which either an indium oxide powder and zinc oxide power each having specific properties or a raw powder comprising these powders as major components is mixed and pulverized to obtain a fine powder; a molding step in which the fine powder is molded to obtain a molding; and a sintering step in which the molding is sintered at 1,250-1,450 DEG C in an oxygenous atmosphere or sintered at 1,100-1,250 DEG C in an oxygenous atmosphere with pressurizing to thereby obtain a sinter.
TW095123888A 2005-07-01 2006-06-30 IZO sputtering target manufacturing method TWI422699B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005193504A JP4758697B2 (en) 2005-07-01 2005-07-01 Manufacturing method of IZO sputtering target
JP2005193505A JP4755453B2 (en) 2005-07-01 2005-07-01 Manufacturing method of IZO sputtering target

Publications (2)

Publication Number Publication Date
TW200714726A true TW200714726A (en) 2007-04-16
TWI422699B TWI422699B (en) 2014-01-11

Family

ID=37604342

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123888A TWI422699B (en) 2005-07-01 2006-06-30 IZO sputtering target manufacturing method

Country Status (4)

Country Link
KR (1) KR101317080B1 (en)
CN (1) CN104710163A (en)
TW (1) TWI422699B (en)
WO (1) WO2007004473A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102367568B (en) * 2011-10-20 2014-04-23 宁波江丰电子材料有限公司 Preparation method of high-purity tantalum target material
KR101434318B1 (en) * 2013-01-22 2014-08-29 국립대학법인 울산과학기술대학교 산학협력단 Method for manufacturing of nitride-based led
JP6078189B1 (en) * 2016-03-31 2017-02-08 Jx金属株式会社 IZO sintered compact sputtering target and manufacturing method thereof
CN113149612A (en) * 2021-05-17 2021-07-23 先导薄膜材料(广东)有限公司 Method for recycling IZO target material
CN113402261B (en) * 2021-06-04 2022-06-21 长沙壹纳光电材料有限公司 IZO target precursor and preparation method and application thereof
CN115745573A (en) * 2022-10-31 2023-03-07 芜湖映日科技股份有限公司 Preparation method of fine-grain IZO target material
CN116768604A (en) * 2023-06-16 2023-09-19 芜湖映日科技股份有限公司 Preparation method of high-density IZTO target

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0570943A (en) * 1991-09-11 1993-03-23 Mitsubishi Materials Corp High density sintered target material for forming electric conductive transparent thin film by sputtering
JP3746094B2 (en) * 1995-06-28 2006-02-15 出光興産株式会社 Target and manufacturing method thereof
WO2000012445A1 (en) * 1998-08-31 2000-03-09 Idemitsu Kosan Co., Ltd. Target for transparent electroconductive film, transparent electroconductive material, transparent electroconductive glass and transparent electroconductive film
JP3721080B2 (en) * 1999-05-10 2005-11-30 株式会社日鉱マテリアルズ Sputtering target and manufacturing method thereof
JP3628566B2 (en) * 1999-11-09 2005-03-16 株式会社日鉱マテリアルズ Sputtering target and manufacturing method thereof
JP3915965B2 (en) * 2001-05-30 2007-05-16 日鉱金属株式会社 Manufacturing method of IZO sputtering target
KR100744017B1 (en) * 2001-06-26 2007-07-30 미츠이 긴조쿠 고교 가부시키가이샤 Sputtering target for forming transparent conductive film of high electric resistance and method for producing transparent conductive film of high electric resistance
KR101902048B1 (en) * 2001-07-17 2018-09-27 이데미쓰 고산 가부시키가이샤 Sputtering target and transparent conductive film

Also Published As

Publication number Publication date
KR101317080B1 (en) 2013-10-11
TWI422699B (en) 2014-01-11
CN104710163A (en) 2015-06-17
KR20080031873A (en) 2008-04-11
WO2007004473A1 (en) 2007-01-11

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