TW200714391A - Method of making sputtering target and target - Google Patents
Method of making sputtering target and targetInfo
- Publication number
- TW200714391A TW200714391A TW095132730A TW95132730A TW200714391A TW 200714391 A TW200714391 A TW 200714391A TW 095132730 A TW095132730 A TW 095132730A TW 95132730 A TW95132730 A TW 95132730A TW 200714391 A TW200714391 A TW 200714391A
- Authority
- TW
- Taiwan
- Prior art keywords
- target
- sputtering target
- produce
- sputtering
- microstructure
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D27/00—Treating the metal in the mould while it is molten or ductile ; Pressure or vacuum casting
- B22D27/04—Influencing the temperature of the metal, e.g. by heating or cooling the mould
- B22D27/045—Directionally solidified castings
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/06—Alloys based on chromium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C38/00—Ferrous alloys, e.g. steel alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71467005P | 2005-09-07 | 2005-09-07 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200714391A true TW200714391A (en) | 2007-04-16 |
Family
ID=37836360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095132730A TW200714391A (en) | 2005-09-07 | 2006-09-05 | Method of making sputtering target and target |
Country Status (3)
Country | Link |
---|---|
US (1) | US20070051623A1 (zh) |
TW (1) | TW200714391A (zh) |
WO (1) | WO2007030406A2 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070062804A1 (en) * | 2005-09-20 | 2007-03-22 | Cp Technologies, Inc. | Device and method of manufacturing sputtering targets |
US20070062803A1 (en) * | 2005-09-20 | 2007-03-22 | Cp Technologies, Inc. | Device and method of manufacturing sputtering targets |
US20070074970A1 (en) * | 2005-09-20 | 2007-04-05 | Cp Technologies, Inc. | Device and method of manufacturing sputtering targets |
US20070169853A1 (en) * | 2006-01-23 | 2007-07-26 | Heraeus, Inc. | Magnetic sputter targets manufactured using directional solidification |
US20080105542A1 (en) * | 2006-11-08 | 2008-05-08 | Purdy Clifford C | System and method of manufacturing sputtering targets |
WO2008134516A2 (en) * | 2007-04-27 | 2008-11-06 | Honeywell International Inc. | Novel manufacturing design and processing methods and apparatus for sputtering targets |
DE102010021856A1 (de) * | 2010-05-28 | 2011-12-01 | Eto Magnetic Gmbh | Verfahren zur Herstellung eines Einkristall-MSM-Körpers |
US8551193B2 (en) | 2011-07-21 | 2013-10-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Nickel alloy target including a secondary metal |
CN103502505B (zh) * | 2011-08-29 | 2015-09-30 | 吉坤日矿日石金属株式会社 | Cu-Ga合金溅射靶及其制造方法 |
CN117127119B (zh) * | 2023-10-24 | 2024-01-23 | 成都先进金属材料产业技术研究院股份有限公司 | 一种模具钢坯及其连铸方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3630809A (en) * | 1965-01-04 | 1971-12-28 | Monsanto Co | Pellucid laminates |
US3700023A (en) * | 1970-08-12 | 1972-10-24 | United Aircraft Corp | Casting of directionally solidified articles |
US4190094A (en) * | 1978-10-25 | 1980-02-26 | United Technologies Corporation | Rate controlled directional solidification method |
US5163498A (en) * | 1989-11-07 | 1992-11-17 | Lanxide Technology Company, Lp | Method of forming metal matrix composite bodies having complex shapes by a self-generated vacuum process, and products produced therefrom |
US5309976A (en) * | 1993-03-16 | 1994-05-10 | Howmet Corporation | Continuous pour directional solidification method |
JP3769761B2 (ja) * | 1994-04-28 | 2006-04-26 | 住友化学株式会社 | アルミニウム合金単結晶ターゲットおよびその製造方法 |
US5592984A (en) * | 1995-02-23 | 1997-01-14 | Howmet Corporation | Investment casting with improved filling |
JP2001505175A (ja) * | 1996-06-05 | 2001-04-17 | ゼネラル エレクトリック カンパニイ | 方向性凝固鋳物を作るための方法と装置 |
US6148899A (en) * | 1998-01-29 | 2000-11-21 | Metal Matrix Cast Composites, Inc. | Methods of high throughput pressure infiltration casting |
US6875324B2 (en) * | 1998-06-17 | 2005-04-05 | Tanaka Kikinzoku Kogyo K.K. | Sputtering target material |
US6276432B1 (en) * | 1999-06-10 | 2001-08-21 | Howmet Research Corporation | Directional solidification method and apparatus |
US6190516B1 (en) * | 1999-10-06 | 2001-02-20 | Praxair S.T. Technology, Inc. | High magnetic flux sputter targets with varied magnetic permeability in selected regions |
US6878250B1 (en) * | 1999-12-16 | 2005-04-12 | Honeywell International Inc. | Sputtering targets formed from cast materials |
US6402912B1 (en) * | 2000-11-09 | 2002-06-11 | Honeywell International Inc. | Sputtering target assembly |
DE10063383C1 (de) * | 2000-12-19 | 2002-03-14 | Heraeus Gmbh W C | Verfahren zur Herstellung eines Rohrtargets und Verwendung |
US8241560B2 (en) * | 2003-04-28 | 2012-08-14 | Howmet Corporation | Nickel base superalloy and single crystal castings |
US20050155677A1 (en) * | 2004-01-08 | 2005-07-21 | Wickersham Charles E.Jr. | Tantalum and other metals with (110) orientation |
US20050183797A1 (en) * | 2004-02-23 | 2005-08-25 | Ranjan Ray | Fine grained sputtering targets of cobalt and nickel base alloys made via casting in metal molds followed by hot forging and annealing and methods of making same |
-
2006
- 2006-08-31 US US11/513,822 patent/US20070051623A1/en not_active Abandoned
- 2006-09-05 WO PCT/US2006/034372 patent/WO2007030406A2/en active Application Filing
- 2006-09-05 TW TW095132730A patent/TW200714391A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
US20070051623A1 (en) | 2007-03-08 |
WO2007030406A3 (en) | 2007-12-06 |
WO2007030406A2 (en) | 2007-03-15 |
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