TW200714159A - Circuit board structure and method for fabricating the same - Google Patents
Circuit board structure and method for fabricating the sameInfo
- Publication number
- TW200714159A TW200714159A TW094132953A TW94132953A TW200714159A TW 200714159 A TW200714159 A TW 200714159A TW 094132953 A TW094132953 A TW 094132953A TW 94132953 A TW94132953 A TW 94132953A TW 200714159 A TW200714159 A TW 200714159A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal layer
- openings
- layer
- fabricating
- circuit board
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
A circuit board structure and a method for fabricating the same are proposed. A core board with a first metal layer and a second metal layer opposed to the first metal layer is provided. A plurality of first openings are formed on the first metal layer and a plurality of second openings corresponding to the first openings are formed on the second metal layer. A through hole is formed and through the first and second openings. A conductive layer is formed on the first metal layer, the second metal layer and the surface of the through hole. A thickened metal layer is formed on the conductive layer, and a conductive via is formed by sealing the second opening. The thickened metal layer is patterned to form a first and a second circuit layers on the top and bottom surfaces of the core board respectively, and the first and the second circuit layers are electrically connected by the conductive via, wherein the second circuit layer located at the bottom of conductive via has a electrically connected pad formed thereon. Therefore, the drawbacks of prior processes are avoided, the reliability is improved, and cost is reduced because specified machines are not used.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94132953A TWI302429B (en) | 2005-09-23 | 2005-09-23 | Circuit board structure and method for fabricating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94132953A TWI302429B (en) | 2005-09-23 | 2005-09-23 | Circuit board structure and method for fabricating the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200714159A true TW200714159A (en) | 2007-04-01 |
TWI302429B TWI302429B (en) | 2008-10-21 |
Family
ID=45070483
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94132953A TWI302429B (en) | 2005-09-23 | 2005-09-23 | Circuit board structure and method for fabricating the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI302429B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111163582A (en) * | 2020-01-02 | 2020-05-15 | 上海航天电子通讯设备研究所 | Vertical interconnection substrate based on laser nano-machining technology and manufacturing method thereof |
-
2005
- 2005-09-23 TW TW94132953A patent/TWI302429B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111163582A (en) * | 2020-01-02 | 2020-05-15 | 上海航天电子通讯设备研究所 | Vertical interconnection substrate based on laser nano-machining technology and manufacturing method thereof |
CN111163582B (en) * | 2020-01-02 | 2022-01-25 | 上海航天电子通讯设备研究所 | Vertical interconnection substrate based on laser nano-machining technology and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TWI302429B (en) | 2008-10-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |