TW200713618A - Semiconductor package for improving chip shift during molding - Google Patents

Semiconductor package for improving chip shift during molding

Info

Publication number
TW200713618A
TW200713618A TW094133400A TW94133400A TW200713618A TW 200713618 A TW200713618 A TW 200713618A TW 094133400 A TW094133400 A TW 094133400A TW 94133400 A TW94133400 A TW 94133400A TW 200713618 A TW200713618 A TW 200713618A
Authority
TW
Taiwan
Prior art keywords
leads
semiconductor package
tilted
during molding
shift during
Prior art date
Application number
TW094133400A
Other languages
Chinese (zh)
Other versions
TWI261366B (en
Inventor
Yu-Tang Pan
Shih-Wen Chou
Cheng-Ting Wu
Original Assignee
Chipmos Technologies Inc
Chipmos Technologies Bermuda
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc, Chipmos Technologies Bermuda filed Critical Chipmos Technologies Inc
Priority to TW94133400A priority Critical patent/TWI261366B/en
Application granted granted Critical
Publication of TWI261366B publication Critical patent/TWI261366B/en
Publication of TW200713618A publication Critical patent/TW200713618A/en

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

A semiconductor package mainly includes a plurality of leads of the leadframe, a chip and a molding compound. The leads from out of peripheries of the molding compound to inside are divided into a plurality of first horizontal leads, a plurality of tilted leads and a plurality of second horizontal leads. A first bending line is formed between the tilted leads and the first horizontal leads, adjacent a side of the molding compound. A second bending line is formed between the tilted leads and the second horizontal leads, adjacent or in a side surface of the chip. Therefore, the tilted leads are long enough to disperse the vertical molding pressure difference to improve the vertical shift problem of the chip during molding.
TW94133400A 2005-09-26 2005-09-26 Semiconductor package for improving chip shift during molding TWI261366B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94133400A TWI261366B (en) 2005-09-26 2005-09-26 Semiconductor package for improving chip shift during molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94133400A TWI261366B (en) 2005-09-26 2005-09-26 Semiconductor package for improving chip shift during molding

Publications (2)

Publication Number Publication Date
TWI261366B TWI261366B (en) 2006-09-01
TW200713618A true TW200713618A (en) 2007-04-01

Family

ID=37876164

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94133400A TWI261366B (en) 2005-09-26 2005-09-26 Semiconductor package for improving chip shift during molding

Country Status (1)

Country Link
TW (1) TWI261366B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469276B (en) * 2008-01-04 2015-01-11 Powertech Technology Inc Leadframe and semiconductor package having downset spoilers

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI469276B (en) * 2008-01-04 2015-01-11 Powertech Technology Inc Leadframe and semiconductor package having downset spoilers

Also Published As

Publication number Publication date
TWI261366B (en) 2006-09-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees