TW200712799A - Stacked alignment mark and alignment method of photolithography process - Google Patents
Stacked alignment mark and alignment method of photolithography processInfo
- Publication number
- TW200712799A TW200712799A TW094130644A TW94130644A TW200712799A TW 200712799 A TW200712799 A TW 200712799A TW 094130644 A TW094130644 A TW 094130644A TW 94130644 A TW94130644 A TW 94130644A TW 200712799 A TW200712799 A TW 200712799A
- Authority
- TW
- Taiwan
- Prior art keywords
- alignment mark
- stacked
- alignment
- photolithography process
- layer
- Prior art date
Links
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Structure Of Printed Boards (AREA)
- Liquid Crystal (AREA)
Abstract
A stacked alignment mark is described. The stacked alignment mark includes a first alignment mark and a second alignment mark. The first alignment mark which is constituted of a plurality of conductive lines is disposed in a first layer. The second alignment mark is disposed in a second layer, and the second layer is disposed under the first layer. The first alignment mark and the second alignment mark are formed on the corresponding region, and the second alignment mark at least includes the region of corresponding space of adjacent two conductive lines.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94130644A TWI299441B (en) | 2005-09-07 | 2005-09-07 | Stacked alignment mark and alignment method of photolithography process |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94130644A TWI299441B (en) | 2005-09-07 | 2005-09-07 | Stacked alignment mark and alignment method of photolithography process |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200712799A true TW200712799A (en) | 2007-04-01 |
TWI299441B TWI299441B (en) | 2008-08-01 |
Family
ID=45069683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94130644A TWI299441B (en) | 2005-09-07 | 2005-09-07 | Stacked alignment mark and alignment method of photolithography process |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI299441B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI602035B (en) * | 2014-04-11 | 2017-10-11 | 聯華電子股份有限公司 | Overlap mark set and method for selecting recipe of measuring overlap error |
TWI833216B (en) * | 2022-03-03 | 2024-02-21 | 南亞科技股份有限公司 | Semiconductor device with decoupling unit |
-
2005
- 2005-09-07 TW TW94130644A patent/TWI299441B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI602035B (en) * | 2014-04-11 | 2017-10-11 | 聯華電子股份有限公司 | Overlap mark set and method for selecting recipe of measuring overlap error |
TWI833216B (en) * | 2022-03-03 | 2024-02-21 | 南亞科技股份有限公司 | Semiconductor device with decoupling unit |
Also Published As
Publication number | Publication date |
---|---|
TWI299441B (en) | 2008-08-01 |
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