TW200712099A - Adhesive film and semiconductor device using the same - Google Patents
Adhesive film and semiconductor device using the sameInfo
- Publication number
- TW200712099A TW200712099A TW095128696A TW95128696A TW200712099A TW 200712099 A TW200712099 A TW 200712099A TW 095128696 A TW095128696 A TW 095128696A TW 95128696 A TW95128696 A TW 95128696A TW 200712099 A TW200712099 A TW 200712099A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive film
- polyimide resin
- same
- semiconductor device
- formula
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/02—Polycondensates containing more than one epoxy group per molecule
- C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
- C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
- C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
- C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Die Bonding (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Disclosed is an adhesive film containing a polyimide resin (A) and a thermosetting resin (B), which is characterized in that the polyimide resin (A) contains a polyimide resin having a repeating unit represented by the formula (I) below and the storage modulus at 250 DEG C after being heat treated at 150-230 DEG C for 0.3-5 hours is not less than 0.2 Mpa. (I) (In the formula, m-number of R1's independently represent a divalent organic group and k-number of organic groups selected from -CH2-, -CHR- and -CR2- (wherein R represents a non-cyclic alkyl group having 1-5 carbon atoms) are included in total in the m-number of R1's; m is an integer of not less than 8, and m and k satisfy the relation of k/m ≥ 0.85; and R2 represents a residue of a tetracarboxylic acid.)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005228101 | 2005-08-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200712099A true TW200712099A (en) | 2007-04-01 |
TWI326695B TWI326695B (en) | 2010-07-01 |
Family
ID=37727305
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW95128696A TWI326695B (en) | 2005-08-05 | 2006-08-04 | Adhesive film and semiconductor device using same |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100167073A1 (en) |
EP (1) | EP1918341A4 (en) |
JP (1) | JPWO2007018120A1 (en) |
KR (1) | KR100970798B1 (en) |
CN (1) | CN101238188A (en) |
TW (1) | TWI326695B (en) |
WO (1) | WO2007018120A1 (en) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101557171B1 (en) * | 2007-11-08 | 2015-10-02 | 히타치가세이가부시끼가이샤 | Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor |
KR100922226B1 (en) * | 2007-12-10 | 2009-10-20 | 주식회사 엘지화학 | Adhesive film, dicing die bonding film and semiconductor device using the same |
KR101284978B1 (en) | 2008-04-21 | 2013-07-10 | 주식회사 엘지화학 | Adhesive compositons, adhesive films, dicing die bonding films, semiconductor wafers and semiconductor devices comprising the same |
JP2010097070A (en) * | 2008-10-17 | 2010-04-30 | Nitto Denko Corp | Transparent pressure-sensitive adhesive sheet for flat panel display, and flat panel display |
KR101075192B1 (en) * | 2009-03-03 | 2011-10-21 | 도레이첨단소재 주식회사 | Adhesive tape for manufacturing electronic component |
US8288466B2 (en) * | 2009-05-13 | 2012-10-16 | E I Du Pont De Nemours And Company | Composite of a polymer and surface modified hexagonal boron nitride particles |
CN101847396B (en) * | 2010-01-08 | 2012-11-21 | 中国音乐学院 | Substitute boa skin of folk music instrument and manufacturing method thereof |
KR101555741B1 (en) * | 2010-04-19 | 2015-09-25 | 닛토덴코 가부시키가이샤 | Film for back surface of flip-chip semiconductor |
KR101351621B1 (en) * | 2010-12-29 | 2014-01-15 | 제일모직주식회사 | Adhesive Composition and Optical Member Using the Same |
CN102363718A (en) * | 2011-08-09 | 2012-02-29 | 常熟市长江胶带有限公司 | High-temperature masking tape |
JP5639280B2 (en) * | 2012-08-10 | 2014-12-10 | 積水化学工業株式会社 | Wafer processing method |
JP2014177558A (en) * | 2013-03-15 | 2014-09-25 | Ube Ind Ltd | Resin composition, and laminate using the same |
JP2014177559A (en) * | 2013-03-15 | 2014-09-25 | Ube Ind Ltd | Thermally conductive resin composition, and laminate using the same |
JP6322026B2 (en) * | 2014-03-31 | 2018-05-09 | 日東電工株式会社 | Die bond film, die bond film with dicing sheet, semiconductor device, and method for manufacturing semiconductor device |
JP6005313B1 (en) * | 2016-02-10 | 2016-10-12 | 古河電気工業株式会社 | Conductive adhesive film and dicing die bonding film using the same |
JP5972490B1 (en) | 2016-02-10 | 2016-08-17 | 古河電気工業株式会社 | Conductive adhesive composition, and conductive adhesive film and dicing / die bonding film using the same |
JP5972489B1 (en) | 2016-02-10 | 2016-08-17 | 古河電気工業株式会社 | Conductive adhesive film and dicing die bonding film using the same |
JP5989928B1 (en) | 2016-02-10 | 2016-09-07 | 古河電気工業株式会社 | Conductive adhesive film and dicing die bonding film using the same |
JP6005312B1 (en) | 2016-02-10 | 2016-10-12 | 古河電気工業株式会社 | Conductive adhesive film and dicing die bonding film using the same |
WO2018139558A1 (en) | 2017-01-27 | 2018-08-02 | 積水化学工業株式会社 | Curable resin composition, adhesive, imide oligomer, imide oligomer composition, and curing agent |
KR102501343B1 (en) | 2017-01-27 | 2023-02-17 | 세키스이가가쿠 고교가부시키가이샤 | Curable resin composition, cured product, adhesive, adhesive film, coverlay film, flexible copper-clad laminate, and circuit board |
CN107230740B (en) * | 2017-04-26 | 2019-09-03 | 安徽欧瑞特照明有限公司 | A kind of LED die bond technique |
US20210009749A1 (en) * | 2018-03-28 | 2021-01-14 | Sekisui Chemical Co., Ltd. | Curable resin composition, adhesive agent, adhesive film, circuit substrate, interlayer insulating material, and printed wiring board |
JP7383971B2 (en) | 2018-10-11 | 2023-11-21 | 三菱ケミカル株式会社 | Resin compositions, cured resin products and composite molded bodies |
US20220319918A1 (en) * | 2019-06-03 | 2022-10-06 | Mitsui Chemicals Tohcello, Inc. | Method for manufacturing electronic device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3777021B2 (en) * | 1997-05-28 | 2006-05-24 | 日立化成工業株式会社 | Adhesive film |
JP3482946B2 (en) * | 2000-06-28 | 2004-01-06 | 日立化成工業株式会社 | Adhesive film and semiconductor device |
JP4839505B2 (en) * | 2000-10-16 | 2011-12-21 | 日立化成工業株式会社 | Adhesive film, manufacturing method thereof, and semiconductor device with adhesive film |
JP4120156B2 (en) * | 2000-11-20 | 2008-07-16 | 日立化成工業株式会社 | Die bonding material and semiconductor device |
JP2002155262A (en) * | 2000-11-20 | 2002-05-28 | Hitachi Chem Co Ltd | Adhesive composition and semiconductor device |
JP5134747B2 (en) * | 2000-11-28 | 2013-01-30 | 日立化成工業株式会社 | Adhesive film and semiconductor device |
WO2003018703A1 (en) * | 2001-08-27 | 2003-03-06 | Hitachi Chemical Co., Ltd. | Adhesive sheet and semiconductor device and process for producing the same |
JP4284922B2 (en) * | 2002-05-13 | 2009-06-24 | 日立化成工業株式会社 | Adhesive sheet, semiconductor device and manufacturing method thereof |
JP2004292821A (en) * | 2002-06-26 | 2004-10-21 | Hitachi Chem Co Ltd | Film adhesive, adhesive sheet, and semiconductor device |
JP2004211053A (en) * | 2002-06-26 | 2004-07-29 | Hitachi Chem Co Ltd | Filmy adhesive, adhesive sheet, and semiconductor device |
MY142246A (en) * | 2003-06-10 | 2010-11-15 | Hitachi Chemical Co Ltd | Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device |
-
2006
- 2006-08-03 KR KR1020087003168A patent/KR100970798B1/en not_active IP Right Cessation
- 2006-08-03 EP EP06782259A patent/EP1918341A4/en not_active Withdrawn
- 2006-08-03 CN CNA2006800284774A patent/CN101238188A/en active Pending
- 2006-08-03 WO PCT/JP2006/315399 patent/WO2007018120A1/en active Application Filing
- 2006-08-03 JP JP2007529529A patent/JPWO2007018120A1/en active Pending
- 2006-08-03 US US11/997,928 patent/US20100167073A1/en not_active Abandoned
- 2006-08-04 TW TW95128696A patent/TWI326695B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN101238188A (en) | 2008-08-06 |
KR20080035610A (en) | 2008-04-23 |
KR100970798B1 (en) | 2010-07-16 |
EP1918341A4 (en) | 2012-08-15 |
WO2007018120A9 (en) | 2008-02-14 |
WO2007018120A1 (en) | 2007-02-15 |
EP1918341A1 (en) | 2008-05-07 |
TWI326695B (en) | 2010-07-01 |
JPWO2007018120A1 (en) | 2009-02-19 |
US20100167073A1 (en) | 2010-07-01 |
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