TW200711804A - Perforation appratus and perforating method - Google Patents

Perforation appratus and perforating method

Info

Publication number
TW200711804A
TW200711804A TW095136413A TW95136413A TW200711804A TW 200711804 A TW200711804 A TW 200711804A TW 095136413 A TW095136413 A TW 095136413A TW 95136413 A TW95136413 A TW 95136413A TW 200711804 A TW200711804 A TW 200711804A
Authority
TW
Taiwan
Prior art keywords
perforation
mould
base
worked article
appratus
Prior art date
Application number
TW095136413A
Other languages
Chinese (zh)
Other versions
TWI303600B (en
Inventor
Kazuhiko Kato
Original Assignee
Beac Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beac Co Ltd filed Critical Beac Co Ltd
Publication of TW200711804A publication Critical patent/TW200711804A/en
Application granted granted Critical
Publication of TWI303600B publication Critical patent/TWI303600B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00Shaping by press-cutting; Perforating
    • B21D28/24Perforating, i.e. punching holes
    • B21D28/26Perforating, i.e. punching holes in sheets or flat parts
    • B21D28/265Perforating, i.e. punching holes in sheets or flat parts with relative movement of sheet and tools enabling the punching of holes in predetermined locations of the sheet, e.g. holes punching with template
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005Punching of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Details Of Cutting Devices (AREA)
  • Delivering By Means Of Belts And Rollers (AREA)

Abstract

A perforation apparatus is characterized in comprising a base 110, two pairs of worked article transmission devices 210 and 220 located on the base 110 and having upper roller 212, 222 and lower roller 214, 224 separately for allowing a sheet-shaped worked article W to move horizontally along worked article transmission direction (hereinafter one direction) as controlling positioning of W, and a perforation device 400, wherein the perforation device 400 has a mould for perforation 500 having a mould for die 510 and a mould for punching 520 and the mould for perforation 500 is located between two pairs of worked article transmission devices 210 and 220, and wherein the perforation device 400 can move horizontally along a direction perpendicular to the one direction with respect to the base 110 and further can move slightly along the one direction with respect to the base 110. Therefore, it becomes possible to perforate the sheet-shaped worked article in whole area with high productivity.
TW095136413A 2005-09-30 2006-09-29 Perforation appratus and perforating method TWI303600B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/018202 WO2007043126A1 (en) 2005-09-30 2005-09-30 Hole punching device and hole punching method

Publications (2)

Publication Number Publication Date
TW200711804A true TW200711804A (en) 2007-04-01
TWI303600B TWI303600B (en) 2008-12-01

Family

ID=37942396

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136413A TWI303600B (en) 2005-09-30 2006-09-29 Perforation appratus and perforating method

Country Status (3)

Country Link
JP (1) JPWO2007043126A1 (en)
TW (1) TWI303600B (en)
WO (1) WO2007043126A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101961749B (en) * 2010-08-18 2012-02-22 宁波向阳坦科斯特电子有限公司 Punching device for loudspeaker magnetic conduction slice

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794982U (en) * 1980-12-01 1982-06-11
JPH0214813Y2 (en) * 1984-12-20 1990-04-23
JPS6241410U (en) * 1985-08-28 1987-03-12
JPH03113350U (en) * 1990-03-05 1991-11-19
JP2925029B2 (en) * 1990-08-06 1999-07-26 株式会社アマダ Punch press
US5140879A (en) * 1990-12-12 1992-08-25 International Business Machines Corporation Variable array punch
JP2564228Y2 (en) * 1991-07-31 1998-03-04 株式会社アマダ Plate processing machine with storage
JP2591914B2 (en) * 1994-09-22 1997-03-19 ユーエイチティー株式会社 Perforator
JP3612123B2 (en) * 1995-11-22 2005-01-19 富士写真フイルム株式会社 Running hole drilling device
JP2000246566A (en) * 1999-02-24 2000-09-12 Amada Eng Center Co Ltd Moving table device for supporting work
JP4609870B2 (en) * 2000-05-31 2011-01-12 ヤマハファインテック株式会社 Roll sheet punching device
JP2002137022A (en) * 2000-10-30 2002-05-14 Mitsui High Tec Inc Punching method
JP2004268175A (en) * 2003-03-06 2004-09-30 Sony Chem Corp Press device
WO2004110665A1 (en) * 2003-06-10 2004-12-23 Beac Co., Ltd. Device, die, and method of punching, and method of positioning and fixing punching die

Also Published As

Publication number Publication date
JPWO2007043126A1 (en) 2009-04-16
TWI303600B (en) 2008-12-01
WO2007043126A1 (en) 2007-04-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees