TW200710882A - Conductor composition for use in LTCC photosensitive tape on substrate applications - Google Patents

Conductor composition for use in LTCC photosensitive tape on substrate applications

Info

Publication number
TW200710882A
TW200710882A TW095127484A TW95127484A TW200710882A TW 200710882 A TW200710882 A TW 200710882A TW 095127484 A TW095127484 A TW 095127484A TW 95127484 A TW95127484 A TW 95127484A TW 200710882 A TW200710882 A TW 200710882A
Authority
TW
Taiwan
Prior art keywords
conductor composition
composition
ltcc
weight percent
substrate applications
Prior art date
Application number
TW095127484A
Other languages
Chinese (zh)
Inventor
Kumaran Manikantan Nair
Mark Frederick Mccombs
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200710882A publication Critical patent/TW200710882A/en

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Inorganic Insulating Materials (AREA)
  • Glass Compositions (AREA)

Abstract

The present invention is directed to a thick film conductor composition comprising: (a) 70 to 98 weight percent of one or more electrically functional powders: (b) 0.5 to 10 weight percent glass frit; (c) 0.5 to 6 weight percent inorganic borides; dispersed in (d) organic medium, based on total thick film composition. The composition is useful as a via fill and/or innerlayer conductor composition in PTOS applications.
TW095127484A 2005-07-28 2006-07-27 Conductor composition for use in LTCC photosensitive tape on substrate applications TW200710882A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US70353005P 2005-07-28 2005-07-28

Publications (1)

Publication Number Publication Date
TW200710882A true TW200710882A (en) 2007-03-16

Family

ID=37674024

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127484A TW200710882A (en) 2005-07-28 2006-07-27 Conductor composition for use in LTCC photosensitive tape on substrate applications

Country Status (2)

Country Link
CN (1) CN1904733A (en)
TW (1) TW200710882A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI587320B (en) * 2014-09-12 2017-06-11 Shoei Chemical Ind Co Resistance composition

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101377966B (en) * 2008-09-27 2012-05-09 彩虹集团公司 Method for preparing leadless silver electrode slurry for glass substrates
CN104952507A (en) * 2014-03-27 2015-09-30 浙江德汇电子陶瓷有限公司 Conductive composition, conductive slurry, circuit board and method for manufacturing circuit board
CN104387800A (en) * 2014-09-28 2015-03-04 安徽省温禾木业有限公司 Environmental-friendly modified calcium carbonate with delicate fragrance and preparation method thereof
CN104312212A (en) * 2014-09-28 2015-01-28 安徽盛佳彩印包装有限公司 Corrosion-resistant modified calcium carbonate with good comprehensive properties and preparation method of modified calcium carbonate
US10524365B2 (en) * 2015-01-13 2019-12-31 Ngk Spark Plug Co., Ltd. Ceramic substrate
CN106211379A (en) * 2016-06-30 2016-12-07 东莞珂洛赫慕电子材料科技有限公司 A kind of carborundum ruthenium resistance slurry and preparation method thereof
CN116102340A (en) * 2023-01-03 2023-05-12 北京航天微电科技有限公司 Low-temperature co-fired raw ceramic, preparation method and ceramic substrate

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI587320B (en) * 2014-09-12 2017-06-11 Shoei Chemical Ind Co Resistance composition
US9805839B2 (en) 2014-09-12 2017-10-31 Shoei Chemical Inc. Resistive composition
US10446290B2 (en) 2014-09-12 2019-10-15 Shoei Chemical Inc. Resistive composition

Also Published As

Publication number Publication date
CN1904733A (en) 2007-01-31

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