TW200710562A - Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp - Google Patents

Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp

Info

Publication number
TW200710562A
TW200710562A TW095119788A TW95119788A TW200710562A TW 200710562 A TW200710562 A TW 200710562A TW 095119788 A TW095119788 A TW 095119788A TW 95119788 A TW95119788 A TW 95119788A TW 200710562 A TW200710562 A TW 200710562A
Authority
TW
Taiwan
Prior art keywords
features
present
transfer
methods
adhesion
Prior art date
Application number
TW095119788A
Other languages
English (en)
Other versions
TWI420237B (zh
Inventor
Ralph G Nuzzo
John A Rogers
Etienne Menard
Keon-Jae Lee
Dahl-Young Khang
Yugang Sun
Matthew Meitl
Zhengtao Zhu
Original Assignee
Univ Illinois
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/US2005/019354 external-priority patent/WO2005122285A2/en
Application filed by Univ Illinois filed Critical Univ Illinois
Publication of TW200710562A publication Critical patent/TW200710562A/zh
Application granted granted Critical
Publication of TWI420237B publication Critical patent/TWI420237B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Thin Film Transistor (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Weting (AREA)
TW095119788A 2005-06-02 2006-06-01 藉由對彈性印模之黏著性動力控制之圖案轉印印刷 TWI420237B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/US2005/019354 WO2005122285A2 (en) 2004-06-04 2005-06-02 Methods and devices for fabricating and assembling printable semiconductor elements
US11/145,574 US7622367B1 (en) 2004-06-04 2005-06-02 Methods and devices for fabricating and assembling printable semiconductor elements
US11/145,542 US7557367B2 (en) 2004-06-04 2005-06-02 Stretchable semiconductor elements and stretchable electrical circuits

Publications (2)

Publication Number Publication Date
TW200710562A true TW200710562A (en) 2007-03-16
TWI420237B TWI420237B (zh) 2013-12-21

Family

ID=41576388

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095119788A TWI420237B (zh) 2005-06-02 2006-06-01 藉由對彈性印模之黏著性動力控制之圖案轉印印刷

Country Status (3)

Country Link
CN (2) CN101632156B (zh)
MY (1) MY145225A (zh)
TW (1) TWI420237B (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7927976B2 (en) 2008-07-23 2011-04-19 Semprius, Inc. Reinforced composite stamp for dry transfer printing of semiconductor elements
US7932123B2 (en) 2006-09-20 2011-04-26 The Board Of Trustees Of The University Of Illinois Release strategies for making transferable semiconductor structures, devices and device components
US8261660B2 (en) 2009-07-22 2012-09-11 Semprius, Inc. Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
US8506867B2 (en) 2008-11-19 2013-08-13 Semprius, Inc. Printing semiconductor elements by shear-assisted elastomeric stamp transfer
TWI415284B (zh) * 2011-03-10 2013-11-11 Gintech Energy Corp 太陽能電池電極製作設備及其方法
US9765934B2 (en) 2011-05-16 2017-09-19 The Board Of Trustees Of The University Of Illinois Thermally managed LED arrays assembled by printing
TWI785315B (zh) * 2013-01-20 2022-12-01 美商克萊譚克公司 用於電光微機電系統(mems)之電荷排放塗層

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CN101924173A (zh) * 2010-05-28 2010-12-22 孙文红 高光效图形衬底及其制造方法
CN103873011A (zh) * 2014-03-05 2014-06-18 随州泰华电子科技有限公司 一种音叉晶片的自动折取装置
TWI677963B (zh) * 2014-06-18 2019-11-21 愛爾蘭商艾克斯瑟樂普林特有限公司 微組裝高頻裝置及陣列
JP6453437B2 (ja) * 2014-07-20 2019-01-16 エックス−セレプリント リミテッドＸ−Ｃｅｌｅｐｒｉｎｔ Ｌｉｍｉｔｅｄ マイクロ転写印刷のための装置および方法
US20160093600A1 (en) * 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
CN105140227B (zh) * 2015-07-01 2017-12-05 东南大学 氮化镓基低漏电流悬臂梁的与非门
CN105024688B (zh) * 2015-07-01 2017-09-15 东南大学 氮化镓基低漏电流固支梁的与非门
CN104967410B (zh) * 2015-07-01 2017-11-07 东南大学 硅基低漏电流固支梁栅场效应晶体管差分放大器
CN105049033B (zh) * 2015-07-01 2017-11-24 东南大学 基于砷化镓基低漏电流双悬臂梁开关的或非门
CN105161490B (zh) * 2015-07-01 2018-02-06 东南大学 氮化镓基低漏电流悬臂梁场效应晶体管倒相器及制备方法
CN105304499A (zh) * 2015-10-20 2016-02-03 上海集成电路研发中心有限公司 一种制备柔性碳纳米管场效应晶体管的方法
CN105355563A (zh) * 2015-11-26 2016-02-24 上海集成电路研发中心有限公司 一种柔性半导体器件的制备方法
KR102510934B1 (ko) * 2016-10-04 2023-03-16 뷰리얼 인크. 도너 기판 내의 마이크로 디바이스 배열
CN106383403B (zh) * 2016-12-08 2020-11-10 中国科学院光电技术研究所 一种可拉伸变形的超表面彩色显示器件
CN108231534A (zh) * 2016-12-15 2018-06-29 上海新微技术研发中心有限公司 柔性薄膜的制造方法
FR3063854B1 (fr) * 2017-03-13 2021-08-27 Commissariat Energie Atomique Resonateur saw a couches d'attenuation d'ondes parasites
CN109103101B (zh) * 2017-06-21 2020-09-29 清华大学 纳米微结构的制备方法
CN109103090B (zh) * 2017-06-21 2020-12-04 清华大学 纳米带的制备方法
CN110890309B (zh) * 2018-09-10 2023-09-08 桦榆国际有限公司 石墨盘修补方法
CN109342325B (zh) * 2018-10-30 2023-12-19 南开大学 一种低维材料各向异性显微的成像方法和装置
CN111622996B (zh) * 2020-04-27 2022-05-24 江苏科技大学 异构多阀并联驱动电液伺服系统及控制方法
CN111934071B (zh) * 2020-06-19 2021-10-22 西安理工大学 一种基于tsv的脊状基片集成波导带通滤波器
CN111947794B (zh) * 2020-07-31 2023-01-31 电子科技大学 一种超导纳米线单光子探测器的制备方法
CN112526660B (zh) * 2020-11-11 2022-12-09 歌尔股份有限公司 在弯曲表面上制造纳米光栅的方法、光学器件及电子设备
US11747555B2 (en) 2021-10-04 2023-09-05 Eagle Technology, Llc Optical assembly having commonly-shaped optical modules and associated methods

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
US4766670A (en) * 1987-02-02 1988-08-30 International Business Machines Corporation Full panel electronic packaging structure and method of making same
US6060723A (en) * 1997-07-18 2000-05-09 Hitachi, Ltd. Controllable conduction device
KR100275730B1 (ko) * 1998-05-11 2000-12-15 윤종용 트렌치 소자분리 방법
US6373092B1 (en) * 1998-09-29 2002-04-16 Texas Instruments Incorporated Staggered-edge capacitor electrode
US6403397B1 (en) * 2000-06-28 2002-06-11 Agere Systems Guardian Corp. Process for fabricating organic semiconductor device involving selective patterning
JP4092914B2 (ja) * 2001-01-26 2008-05-28 セイコーエプソン株式会社 マスクの製造方法、有機エレクトロルミネッセンス装置の製造方法
KR100391984B1 (ko) * 2001-08-08 2003-07-22 삼성전자주식회사 다층 터널접합층 패턴을 갖는 반도체 기억소자 및 그제조방법
WO2004070472A1 (ja) * 2003-02-03 2004-08-19 Hoya Corporation フォトマスクブランク及びフォトマスク、並びにフォトマスクを用いたパターン転写方法
TWI273019B (en) * 2003-07-25 2007-02-11 Hon Hai Prec Ind Co Ltd A method of transfer pattern

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7932123B2 (en) 2006-09-20 2011-04-26 The Board Of Trustees Of The University Of Illinois Release strategies for making transferable semiconductor structures, devices and device components
US8895406B2 (en) 2006-09-20 2014-11-25 The Board Of Trustees Of The University Of Illinois Release strategies for making transferable semiconductor structures, devices and device components
US7927976B2 (en) 2008-07-23 2011-04-19 Semprius, Inc. Reinforced composite stamp for dry transfer printing of semiconductor elements
US8506867B2 (en) 2008-11-19 2013-08-13 Semprius, Inc. Printing semiconductor elements by shear-assisted elastomeric stamp transfer
US8261660B2 (en) 2009-07-22 2012-09-11 Semprius, Inc. Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
TWI415284B (zh) * 2011-03-10 2013-11-11 Gintech Energy Corp 太陽能電池電極製作設備及其方法
US9765934B2 (en) 2011-05-16 2017-09-19 The Board Of Trustees Of The University Of Illinois Thermally managed LED arrays assembled by printing
TWI785315B (zh) * 2013-01-20 2022-12-01 美商克萊譚克公司 用於電光微機電系統(mems)之電荷排放塗層

Also Published As

Publication number Publication date
CN102176465B (zh) 2014-05-07
TWI420237B (zh) 2013-12-21
CN102176465A (zh) 2011-09-07
MY145225A (en) 2012-01-13
CN101632156A (zh) 2010-01-20
CN101632156B (zh) 2012-06-20

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