MY145225A - Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp - Google Patents

Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp

Info

Publication number
MY145225A
MY145225A MYPI20062536A MYPI20062536A MY145225A MY 145225 A MY145225 A MY 145225A MY PI20062536 A MYPI20062536 A MY PI20062536A MY PI20062536 A MYPI20062536 A MY PI20062536A MY 145225 A MY145225 A MY 145225A
Authority
MY
Malaysia
Prior art keywords
features
transfer
present
adhesion
methods
Prior art date
Application number
MYPI20062536A
Inventor
Ralph G Nuzzo
John A Rogers
Etienne Menard
Keon Jae Lee
Dahl-Young Khang
Yugang Sun
Matthew Meitl
Zhengtao Zhu
Original Assignee
Univ Illinois
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/145,574 external-priority patent/US7622367B1/en
Application filed by Univ Illinois filed Critical Univ Illinois
Publication of MY145225A publication Critical patent/MY145225A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Thin Film Transistor (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PATTERN TRANSFER PRINTING BY KINETIC CONTROL OF ADHESION TO AN ELASTOMERIC STAMP THE PRESENT INVENTION PROVIDES METHODS, SYSTEMS AND SYSTEM COMPONENTS FOR 5 TRANSFERRING, ASSEMBLING AND INTEGRATING FEATURES AND ARRAYS OF FEATURES HAVING SELECTED NANOSIZED AND/OR MICROSIZED PHYSICAL DIMENSIONS, SHAPES AND SPATIAL ORIENTATIONS. METHODS OF THE PRESENT INVENTION UTILIZE PRINCIPLES OF 'SOFT ADHESION'TO GUIDE THE TRANSFER, ASSEMBLY AND/OR INTEGRATION OF FEATURES, SUCH AS PRINTABLE SEMICONDUCTOR ELEMENTS OR OTHER COMPONENTS OF ELECTRONIC DEVICES. METHODS OF THE PRESENT INVENTION ARE USEFUL FOR 10 TRANSFERRING FEATURES FROM A DONOR SUBSTRATE TO THE TRANSFER SURFACE OF AN ELASTOMERIC TRANSFER DEVICE AND, OPTIONALLY, FROM THE TRANSFER SURFACE OF AN ELASTOMERIC TRANSFER DEVICE TO THE RECEIVING SURFACE OF A RECEIVING SUBSTRATE. THE PRESENT METHODS AND SYSTEMS PROVIDE HIGHLY EFFICIENT, REGISTERED TRANSFER OF FEATURES AND ARRAYS OF FEATURES, SUCH AS PRINTABLE SEMICONDUCTOR ELEMENT, IN A CONCERTED MANNER THAT MAINTAINS THE 15 RELATIVE SPATIAL ORIENTATIONS OF TRANSFERRED FEATURES. DOOG)OI/06/&
MYPI20062536A 2005-06-02 2006-06-01 Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp MY145225A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/145,574 US7622367B1 (en) 2004-06-04 2005-06-02 Methods and devices for fabricating and assembling printable semiconductor elements
PCT/US2005/019354 WO2005122285A2 (en) 2004-06-04 2005-06-02 Methods and devices for fabricating and assembling printable semiconductor elements
US11/145,542 US7557367B2 (en) 2004-06-04 2005-06-02 Stretchable semiconductor elements and stretchable electrical circuits

Publications (1)

Publication Number Publication Date
MY145225A true MY145225A (en) 2012-01-13

Family

ID=41576388

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20062536A MY145225A (en) 2005-06-02 2006-06-01 Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp

Country Status (3)

Country Link
CN (2) CN102176465B (en)
MY (1) MY145225A (en)
TW (1) TWI420237B (en)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI438827B (en) 2006-09-20 2014-05-21 Univ Illinois Release strategies for making printable semiconductor structures, devices and device components
US7927976B2 (en) 2008-07-23 2011-04-19 Semprius, Inc. Reinforced composite stamp for dry transfer printing of semiconductor elements
US8506867B2 (en) 2008-11-19 2013-08-13 Semprius, Inc. Printing semiconductor elements by shear-assisted elastomeric stamp transfer
US8261660B2 (en) 2009-07-22 2012-09-11 Semprius, Inc. Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
CN101924173A (en) * 2010-05-28 2010-12-22 孙文红 High lighting effect pattern substrate and manufacturing method thereof
TWI415284B (en) * 2011-03-10 2013-11-11 Gintech Energy Corp Solar cell electrode manufacturing equipment and method thereof
WO2012158709A1 (en) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing
US9824851B2 (en) * 2013-01-20 2017-11-21 William M. Tong Charge drain coating for electron-optical MEMS
CN103873011A (en) * 2014-03-05 2014-06-18 随州泰华电子科技有限公司 Automatic folding device of tuning fork chip
TWI652796B (en) * 2014-06-18 2019-03-01 愛爾蘭商艾克斯瑟樂普林特有限公司 Multilayer printed capacitor
US11472171B2 (en) * 2014-07-20 2022-10-18 X Display Company Technology Limited Apparatus and methods for micro-transfer-printing
US20160093600A1 (en) * 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
CN105140227B (en) * 2015-07-01 2017-12-05 东南大学 The NAND gate of gallium nitride base low-leakage current cantilever beam
CN105024688B (en) * 2015-07-01 2017-09-15 东南大学 The NAND gate of gallium nitride base low-leakage current clamped beam
CN105161490B (en) * 2015-07-01 2018-02-06 东南大学 Gallium nitride base low-leakage current cantilever beam field-effect transistor phase inverter and preparation method
CN105049033B (en) * 2015-07-01 2017-11-24 东南大学 Nor gate based on GaAs base low-leakage current double cantilever beam switch
CN104967410B (en) * 2015-07-01 2017-11-07 东南大学 Silicon substrate low-leakage current clamped beam grid field effect transistor difference amplifier
CN105304499A (en) * 2015-10-20 2016-02-03 上海集成电路研发中心有限公司 Preparation method for flexible carbon-nanotube field effect transistor
CN105355563A (en) * 2015-11-26 2016-02-24 上海集成电路研发中心有限公司 Preparation method of flexible semiconductor device
CN109690757B (en) 2016-10-04 2023-02-28 维耶尔公司 Micro device placement in donor substrate
CN106383403B (en) * 2016-12-08 2020-11-10 中国科学院光电技术研究所 Super-surface color display device capable of stretching and deforming
CN108231534A (en) * 2016-12-15 2018-06-29 上海新微技术研发中心有限公司 Method for manufacturing flexible film
FR3063854B1 (en) * 2017-03-13 2021-08-27 Commissariat Energie Atomique SAW RESONATOR WITH PARASITE WAVE ATTENUATION LAYERS
CN109103090B (en) * 2017-06-21 2020-12-04 清华大学 Preparation method of nanobelt
CN109103101B (en) * 2017-06-21 2020-09-29 清华大学 Preparation method of nano-microstructure
CN110890309B (en) * 2018-09-10 2023-09-08 桦榆国际有限公司 Graphite disc repairing method
CN109342325B (en) * 2018-10-30 2023-12-19 南开大学 Low-dimensional material anisotropic microscopic imaging method and device
CN111622996B (en) * 2020-04-27 2022-05-24 江苏科技大学 Heterogeneous multi-valve parallel drive electro-hydraulic servo system and control method
CN111934071B (en) * 2020-06-19 2021-10-22 西安理工大学 TSV-based ridged substrate integrated waveguide band-pass filter
CN111947794B (en) * 2020-07-31 2023-01-31 电子科技大学 Preparation method of superconducting nanowire single photon detector
CN112526660B (en) * 2020-11-11 2022-12-09 歌尔股份有限公司 Method for manufacturing nano-grating on curved surface, optical device and electronic equipment
US11747555B2 (en) 2021-10-04 2023-09-05 Eagle Technology, Llc Optical assembly having commonly-shaped optical modules and associated methods

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4766670A (en) * 1987-02-02 1988-08-30 International Business Machines Corporation Full panel electronic packaging structure and method of making same
US6060723A (en) * 1997-07-18 2000-05-09 Hitachi, Ltd. Controllable conduction device
KR100275730B1 (en) * 1998-05-11 2000-12-15 윤종용 Trench isolating method
US6373092B1 (en) * 1998-09-29 2002-04-16 Texas Instruments Incorporated Staggered-edge capacitor electrode
US6403397B1 (en) * 2000-06-28 2002-06-11 Agere Systems Guardian Corp. Process for fabricating organic semiconductor device involving selective patterning
JP4092914B2 (en) * 2001-01-26 2008-05-28 セイコーエプソン株式会社 MASK MANUFACTURING METHOD, ORGANIC ELECTROLUMINESCENT DEVICE MANUFACTURING METHOD
KR100391984B1 (en) * 2001-08-08 2003-07-22 삼성전자주식회사 Semiconductor memory device having multiple tunnel junction layer pattern and method of fabricating the same
US20060057469A1 (en) * 2003-02-03 2006-03-16 Mitsuhiro Kureishi Photomask blank, photomask, and pattern transfer method using photomask
TWI273019B (en) * 2003-07-25 2007-02-11 Hon Hai Prec Ind Co Ltd A method of transfer pattern

Also Published As

Publication number Publication date
TWI420237B (en) 2013-12-21
CN102176465A (en) 2011-09-07
CN101632156A (en) 2010-01-20
CN101632156B (en) 2012-06-20
CN102176465B (en) 2014-05-07
TW200710562A (en) 2007-03-16

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