TW200709745A - Method of fabricating printed circuit boards - Google Patents

Method of fabricating printed circuit boards

Info

Publication number
TW200709745A
TW200709745A TW094127856A TW94127856A TW200709745A TW 200709745 A TW200709745 A TW 200709745A TW 094127856 A TW094127856 A TW 094127856A TW 94127856 A TW94127856 A TW 94127856A TW 200709745 A TW200709745 A TW 200709745A
Authority
TW
Taiwan
Prior art keywords
printed circuit
circuit boards
carrier
adhesive
wiring
Prior art date
Application number
TW094127856A
Other languages
Chinese (zh)
Other versions
TWI269615B (en
Inventor
Tom Ku
Original Assignee
K Laser Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by K Laser Technology Inc filed Critical K Laser Technology Inc
Priority to TW94127856A priority Critical patent/TWI269615B/en
Application granted granted Critical
Publication of TWI269615B publication Critical patent/TWI269615B/en
Publication of TW200709745A publication Critical patent/TW200709745A/en

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention relates to a method for fabricating printed circuit boards, wherein the wiring pattern of a printed circuit board is printed on a carrier with the use of adhesive as printing material. After printing the adhesive on the carrier, a main film having releasing metallic film is bonded onto the adhesive so that the metallic wiring can be formed on the carrier where the adhesive part of the carrier is adhered to the metallic film, while the non-adhesive part is not adhered to the metallic film. The method of the present invention can simplify the production process of printed circuit boards, and the fabrication of wiring can be performed with relatively high speed, thereby largely increasing the efficiency of the production and reducing the production costs.
TW94127856A 2005-08-16 2005-08-16 Method of fabricating printed circuit boards TWI269615B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94127856A TWI269615B (en) 2005-08-16 2005-08-16 Method of fabricating printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94127856A TWI269615B (en) 2005-08-16 2005-08-16 Method of fabricating printed circuit boards

Publications (2)

Publication Number Publication Date
TWI269615B TWI269615B (en) 2006-12-21
TW200709745A true TW200709745A (en) 2007-03-01

Family

ID=38291617

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94127856A TWI269615B (en) 2005-08-16 2005-08-16 Method of fabricating printed circuit boards

Country Status (1)

Country Link
TW (1) TWI269615B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9876160B2 (en) 2012-03-21 2018-01-23 Parker-Hannifin Corporation Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices
EP2837043B1 (en) 2012-04-12 2017-11-22 Parker-Hannifin Corporation Eap transducers with improved performance
KR20150031285A (en) 2012-06-18 2015-03-23 바이엘 인텔렉쳐 프로퍼티 게엠베하 Stretch frame for stretching process

Also Published As

Publication number Publication date
TWI269615B (en) 2006-12-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees