TW200709745A - Method of fabricating printed circuit boards - Google Patents
Method of fabricating printed circuit boardsInfo
- Publication number
- TW200709745A TW200709745A TW094127856A TW94127856A TW200709745A TW 200709745 A TW200709745 A TW 200709745A TW 094127856 A TW094127856 A TW 094127856A TW 94127856 A TW94127856 A TW 94127856A TW 200709745 A TW200709745 A TW 200709745A
- Authority
- TW
- Taiwan
- Prior art keywords
- printed circuit
- circuit boards
- carrier
- adhesive
- wiring
- Prior art date
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a method for fabricating printed circuit boards, wherein the wiring pattern of a printed circuit board is printed on a carrier with the use of adhesive as printing material. After printing the adhesive on the carrier, a main film having releasing metallic film is bonded onto the adhesive so that the metallic wiring can be formed on the carrier where the adhesive part of the carrier is adhered to the metallic film, while the non-adhesive part is not adhered to the metallic film. The method of the present invention can simplify the production process of printed circuit boards, and the fabrication of wiring can be performed with relatively high speed, thereby largely increasing the efficiency of the production and reducing the production costs.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94127856A TWI269615B (en) | 2005-08-16 | 2005-08-16 | Method of fabricating printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94127856A TWI269615B (en) | 2005-08-16 | 2005-08-16 | Method of fabricating printed circuit boards |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI269615B TWI269615B (en) | 2006-12-21 |
TW200709745A true TW200709745A (en) | 2007-03-01 |
Family
ID=38291617
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94127856A TWI269615B (en) | 2005-08-16 | 2005-08-16 | Method of fabricating printed circuit boards |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI269615B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9876160B2 (en) | 2012-03-21 | 2018-01-23 | Parker-Hannifin Corporation | Roll-to-roll manufacturing processes for producing self-healing electroactive polymer devices |
EP2837043B1 (en) | 2012-04-12 | 2017-11-22 | Parker-Hannifin Corporation | Eap transducers with improved performance |
KR20150031285A (en) | 2012-06-18 | 2015-03-23 | 바이엘 인텔렉쳐 프로퍼티 게엠베하 | Stretch frame for stretching process |
-
2005
- 2005-08-16 TW TW94127856A patent/TWI269615B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TWI269615B (en) | 2006-12-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |