TW200708894A - Photosensitive resin composition comprising organic and inorganic compounds - Google Patents

Photosensitive resin composition comprising organic and inorganic compounds

Info

Publication number
TW200708894A
TW200708894A TW095126177A TW95126177A TW200708894A TW 200708894 A TW200708894 A TW 200708894A TW 095126177 A TW095126177 A TW 095126177A TW 95126177 A TW95126177 A TW 95126177A TW 200708894 A TW200708894 A TW 200708894A
Authority
TW
Taiwan
Prior art keywords
film
resin
organic
compounds
resin composition
Prior art date
Application number
TW095126177A
Other languages
Chinese (zh)
Inventor
Joo-Pyo Yun
Byung-Uk Kim
Hyoc-Min Youn
Ki-Hyuk Koo
Tae-Hoon Yeo
Ui-Cheol Jeong
Dong-Myung Kim
Sang-Gak Choi
Ho-Jin Lee
Hong-Dae Shin
Dong-Hyuk Lee
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of TW200708894A publication Critical patent/TW200708894A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0044—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists involving an interaction between the metallic and non-metallic component, e.g. photodope systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Abstract

The purpose of this invention is to provide a photosensitive resin composition. It comprises organic and inorganic compounds. This resin possesses the characteristics of excellent adhesive, heat-resistant, insulated, flat, and chemical-resistant, etc. This resin is the material suitable for forming the pattern of a LCD component. Especially, since the resin becomes the organic insulating film of the aforementioned LCD component, the film has an outstanding dielectric value, uniformity, sensitivity, film residual ratio, and UV transparency. Therefore, this film is not only suitable for the organic insulating film of a gate. At the same time, it is also utilized as the corrosion-resisting resin of a protecting film, a black array, a pillar spacer, or a color filter. Further, the resin increases the sensitivity, and film residual ratio. In addition, the photosensitive resin composition organic compounds and inorganic compounds comprises: (A) The metal oxide groups of the metal oxides related to the III, IV, V, or XIII groups, or the metal oxides related to transition elements. (B) (a) Propylene series compounds. (b) Optical trigger. (c) Multifunctional monomers of ethylene unsaturated bond (d) Silicon series compounds of epoxide group or amino group, and (e) Solvent.
TW095126177A 2005-07-19 2006-07-18 Photosensitive resin composition comprising organic and inorganic compounds TW200708894A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050065510A KR101221450B1 (en) 2005-07-19 2005-07-19 Photosensitive resin composition comprising organic and inorganic compound

Publications (1)

Publication Number Publication Date
TW200708894A true TW200708894A (en) 2007-03-01

Family

ID=37656735

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095126177A TW200708894A (en) 2005-07-19 2006-07-18 Photosensitive resin composition comprising organic and inorganic compounds

Country Status (4)

Country Link
JP (1) JP5194224B2 (en)
KR (1) KR101221450B1 (en)
CN (1) CN1900821B (en)
TW (1) TW200708894A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI392909B (en) * 2007-07-16 2013-04-11 Korea Electrotech Res Inst Organic-inorganic hybrid photosensitive resin composition and liquid crystal display comprising cured body thereof

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KR101305528B1 (en) * 2006-02-03 2013-09-05 주식회사 동진쎄미켐 Organic-inorganic composite photosensitive resin composition, liquid crystal display having that curing product, method of forming a pattern of liquid crystal display using the same
KR101482552B1 (en) * 2008-04-30 2015-01-21 주식회사 동진쎄미켐 Negative photosensitive resin composition
KR101316397B1 (en) 2008-09-30 2013-10-10 코오롱인더스트리 주식회사 Photosensitive resin composition for organic insulator
WO2011030580A1 (en) * 2009-09-10 2011-03-17 積水化学工業株式会社 Photosensitive composition and printed wiring board
JP5540689B2 (en) * 2009-12-18 2014-07-02 Ｊｓｒ株式会社 Radiation-sensitive composition, cured film and method for forming the same
CN103038705B (en) * 2010-05-03 2016-04-20 巴斯夫欧洲公司 For the color filter of cryogenic applications
TW201213420A (en) * 2010-06-02 2012-04-01 Sumitomo Chemical Co Curable resin composition
JP4924776B2 (en) * 2010-06-07 2012-04-25 日立化成工業株式会社 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING THE SAME, METHOD FOR FORMING PARTICLE OF IMAGE DISPLAY DEVICE, METHOD FOR PRODUCING IMAGE DISPLAY DEVICE, AND IMAGE DISPLAY DEVICE
KR20120021488A (en) * 2010-08-03 2012-03-09 주식회사 동진쎄미켐 Negative photosensitive resin composition
KR20120118600A (en) * 2011-04-19 2012-10-29 삼성디스플레이 주식회사 Photosensitive composition and method of manufacturing a substrate for a display device using the photosensitive composition
JP5699096B2 (en) * 2012-01-26 2015-04-08 東京応化工業株式会社 Photosensitive composition, pattern and display device having pattern
JP6171677B2 (en) * 2013-07-26 2017-08-02 東洋インキＳｃホールディングス株式会社 Photocurable resin composition
JP6255806B2 (en) * 2013-09-04 2018-01-10 Jsr株式会社 Gate insulating film, radiation sensitive resin composition, cured film, method for forming gate insulating film, semiconductor element, and display device
KR102142648B1 (en) * 2013-12-16 2020-08-10 삼성디스플레이 주식회사 Photo-sensitive resin composition, method for manufacturing organic layer using the composition, and display device comprising the organic layer
JP6764636B2 (en) * 2014-10-08 2020-10-07 東京応化工業株式会社 Radiation-sensitive resin composition, pattern manufacturing method, transparent insulating film, and display device
JPWO2017169440A1 (en) * 2016-03-28 2019-02-14 Jsr株式会社 Radiation-sensitive composition and pattern forming method
CN107586387B (en) * 2017-08-25 2021-01-26 无锡龙驰氟硅新材料有限公司 UV photoinitiator compound for fluorosilicone resin and preparation method thereof
CN110894367A (en) * 2019-11-28 2020-03-20 江苏胜帆电子科技有限公司 Preparation method of high-strength LCP composite material
CN117210141B (en) * 2023-11-07 2024-01-26 明士(北京)新材料开发有限公司 Development-resistant photosensitive adhesive film and preparation and application thereof

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JP3870463B2 (en) * 1996-12-11 2007-01-17 東レ株式会社 Photosensitive green sheet and plasma display manufacturing method
JP4175591B2 (en) 1999-11-26 2008-11-05 日本化薬株式会社 Photosensitive resin composition and photosensitive film using the same
DE60043239D1 (en) * 2000-06-12 2009-12-10 Lg Chemical Ltd COMPOSITION ON TRIAZINE BASE WITH FUNCTIONALIZED ALKYLTHIOGRUPPES AND PHOTOPOLYMERIZATION INITIATOR
CN1226752C (en) * 2001-01-29 2005-11-09 捷时雅株式会社 Composite particle for dielectrics, ultramicro particulate composite resin particle, composition for forming dielectrics and use thereof
JP2003316000A (en) * 2002-04-24 2003-11-06 Toray Ind Inc Photosensitive ceramic composition
KR100995451B1 (en) 2003-07-03 2010-11-18 삼성전자주식회사 Organic Thin Film Transistor comprising Gate Insulator having Multi-layered Structure
JP4292985B2 (en) * 2003-12-25 2009-07-08 Ｊｓｒ株式会社 Radiation-sensitive composition, microlens and method for forming the same, and liquid crystal display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI392909B (en) * 2007-07-16 2013-04-11 Korea Electrotech Res Inst Organic-inorganic hybrid photosensitive resin composition and liquid crystal display comprising cured body thereof

Also Published As

Publication number Publication date
CN1900821B (en) 2011-08-31
KR101221450B1 (en) 2013-01-11
CN1900821A (en) 2007-01-24
JP5194224B2 (en) 2013-05-08
JP2007025678A (en) 2007-02-01
KR20070010712A (en) 2007-01-24

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