TW200707791A - Method for mounting chip of light-emitting diode and structure thereof - Google Patents

Method for mounting chip of light-emitting diode and structure thereof

Info

Publication number
TW200707791A
TW200707791A TW094126998A TW94126998A TW200707791A TW 200707791 A TW200707791 A TW 200707791A TW 094126998 A TW094126998 A TW 094126998A TW 94126998 A TW94126998 A TW 94126998A TW 200707791 A TW200707791 A TW 200707791A
Authority
TW
Taiwan
Prior art keywords
light
emitting diode
mounting chip
chip
mounting
Prior art date
Application number
TW094126998A
Other languages
Chinese (zh)
Other versions
TWI266437B (en
Inventor
Way-Jze Wen
Yi-Fong Lin
Shyi-Ming Pan
Fen-Ren Chien
Original Assignee
Formosa Epitaxy Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formosa Epitaxy Inc filed Critical Formosa Epitaxy Inc
Priority to TW94126998A priority Critical patent/TWI266437B/en
Application granted granted Critical
Publication of TWI266437B publication Critical patent/TWI266437B/en
Publication of TW200707791A publication Critical patent/TW200707791A/en

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  • Led Device Packages (AREA)

Abstract

The present invention provides a method for mounting a chip of light-emitting diode and a structure thereof, wherein in bonding a light-emitting diode chip and a substrate, ultrasonic wave is employed to ionize the surfaces of two soldering materials so that the light-emitting diode chip is bonded to the substrate under a condition of lower temperature condition, thereby providing an improved heat dissipation structure.
TW94126998A 2005-08-09 2005-08-09 Method for mounting chip of light-emitting diode and structure thereof TWI266437B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94126998A TWI266437B (en) 2005-08-09 2005-08-09 Method for mounting chip of light-emitting diode and structure thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94126998A TWI266437B (en) 2005-08-09 2005-08-09 Method for mounting chip of light-emitting diode and structure thereof

Publications (2)

Publication Number Publication Date
TWI266437B TWI266437B (en) 2006-11-11
TW200707791A true TW200707791A (en) 2007-02-16

Family

ID=38191576

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94126998A TWI266437B (en) 2005-08-09 2005-08-09 Method for mounting chip of light-emitting diode and structure thereof

Country Status (1)

Country Link
TW (1) TWI266437B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381562B (en) * 2009-06-26 2013-01-01 Ind Tech Res Inst Method for manufacturing reflective led die bonding structure at low temperature

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381562B (en) * 2009-06-26 2013-01-01 Ind Tech Res Inst Method for manufacturing reflective led die bonding structure at low temperature

Also Published As

Publication number Publication date
TWI266437B (en) 2006-11-11

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