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Application filed by Advanced Semiconductor EngfiledCriticalAdvanced Semiconductor Eng
Priority to TW94126910ApriorityCriticalpatent/TWI269457B/en
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Publication of TWI269457BpublicationCriticalpatent/TWI269457B/en
Publication of TW200707773ApublicationCriticalpatent/TW200707773A/en
A flip-chip package-on-package structure comprises a first flip-chip package having a first substrate and a first semiconductor chip flip-chip mounted on the first substrate; and a second flip-chip package having a second substrate and a second semiconductor chip flip-chip mounted on the second substrate; wherein the first semiconductor chip and the second semiconductor chip are oppositely connected to each other by a plurality of metal bumps such that the first/second flip-chip package is oppositely stacked on the first/second flip-chip package, whereby forming a flip-chip package-on-package structure with low profile. The present invention also provides a method for making the flip-chip package-on-package structure.
TW94126910A2005-08-092005-08-09Flip-chip package-on-package structure and method for making the same
TWI269457B
(en)
Method for producing a plurality of optoelectronic semiconductor components in combination, semiconductor component produced in such a way, and use of said semiconductor component
Semiconductor constructions having interconnect structures, methods of forming interconnect structures, and methods of forming semiconductor constructions