TW200707626A - Method and device for displacing a group of components ordered in a matrix structure - Google Patents

Method and device for displacing a group of components ordered in a matrix structure

Info

Publication number
TW200707626A
TW200707626A TW095123499A TW95123499A TW200707626A TW 200707626 A TW200707626 A TW 200707626A TW 095123499 A TW095123499 A TW 095123499A TW 95123499 A TW95123499 A TW 95123499A TW 200707626 A TW200707626 A TW 200707626A
Authority
TW
Taiwan
Prior art keywords
components
matrix structure
placing
group
ordered
Prior art date
Application number
TW095123499A
Other languages
English (en)
Inventor
Willem Antonie Hennekes
Gerardus Hermanus Johannes Reulink
Original Assignee
Fico Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv filed Critical Fico Bv
Publication of TW200707626A publication Critical patent/TW200707626A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0478—Simultaneously mounting of different components
    • H05K13/0482—Simultaneously mounting of different components using templates; using magazines, the configuration of which corresponds to the sites on the boards where the components have to be attached
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supply And Installment Of Electrical Components (AREA)
TW095123499A 2005-07-21 2006-06-29 Method and device for displacing a group of components ordered in a matrix structure TW200707626A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL1029576A NL1029576C2 (nl) 2005-07-21 2005-07-21 Werkwijze en inrichting voor het verplaatsen van een in een matrixstructuur gerangschikte groep componenten.

Publications (1)

Publication Number Publication Date
TW200707626A true TW200707626A (en) 2007-02-16

Family

ID=35918207

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095123499A TW200707626A (en) 2005-07-21 2006-06-29 Method and device for displacing a group of components ordered in a matrix structure

Country Status (5)

Country Link
EP (1) EP1911336A2 (zh)
CN (1) CN101228815A (zh)
NL (1) NL1029576C2 (zh)
TW (1) TW200707626A (zh)
WO (1) WO2007011218A2 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8903541B2 (en) 2010-06-30 2014-12-02 KLA—Tencor Corporation Method and arrangement for positioning electronic devices into compartments of an input medium and output medium
NL2008290C2 (nl) * 2012-02-14 2013-08-19 Fico Bv Werkwijze en inrichting voor het uiteenplaatsen van in een matrixstructuur gerangschikte elektronische componenten.
KR101872764B1 (ko) * 2017-03-02 2018-06-29 주식회사 코엠에스 디스플레이용 엘이디칩 픽킹 배열 장치
JP2022027096A (ja) * 2020-07-31 2022-02-10 日亜化学工業株式会社 発光モジュールの製造方法
NL2031053B1 (en) 2022-02-23 2023-09-06 Besi Netherlands Bv Gripper head, device, and method for handling and varying the spacing of electronic components arranged in a matrix structure

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970007078Y1 (en) * 1994-06-03 1997-07-15 Lg Semicon Co Ltd Devices feeding apparatus
US6289579B1 (en) * 1999-03-23 2001-09-18 Motorola, Inc. Component alignment and transfer apparatus

Also Published As

Publication number Publication date
CN101228815A (zh) 2008-07-23
NL1029576C2 (nl) 2007-01-23
EP1911336A2 (en) 2008-04-16
WO2007011218A2 (en) 2007-01-25
WO2007011218A3 (en) 2007-07-12

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