TW200707511A - Substrate Processing method and substrate processing apparatus - Google Patents

Substrate Processing method and substrate processing apparatus

Info

Publication number
TW200707511A
TW200707511A TW095122478A TW95122478A TW200707511A TW 200707511 A TW200707511 A TW 200707511A TW 095122478 A TW095122478 A TW 095122478A TW 95122478 A TW95122478 A TW 95122478A TW 200707511 A TW200707511 A TW 200707511A
Authority
TW
Taiwan
Prior art keywords
substrate
substrate processing
fluid
process liquid
processing apparatus
Prior art date
Application number
TW095122478A
Other languages
English (en)
Chinese (zh)
Other versions
TWI311336B (https=
Inventor
Kenji Sekiguchi
Noritaka Uchida
Satoru Tanaka
Hiroki Ohno
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200707511A publication Critical patent/TW200707511A/zh
Application granted granted Critical
Publication of TWI311336B publication Critical patent/TWI311336B/zh

Links

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  • Cleaning Or Drying Semiconductors (AREA)
TW095122478A 2005-06-23 2006-06-22 Substrate Processing method and substrate processing apparatus TW200707511A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005183549 2005-06-23

Publications (2)

Publication Number Publication Date
TW200707511A true TW200707511A (en) 2007-02-16
TWI311336B TWI311336B (https=) 2009-06-21

Family

ID=45072406

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095122478A TW200707511A (en) 2005-06-23 2006-06-22 Substrate Processing method and substrate processing apparatus

Country Status (1)

Country Link
TW (1) TW200707511A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409876B (zh) * 2007-02-23 2013-09-21 積水化學工業股份有限公司 Etching method and device
TWI607487B (zh) * 2015-06-10 2017-12-01 思可林集團股份有限公司 基板處理方法及基板處理裝置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI409876B (zh) * 2007-02-23 2013-09-21 積水化學工業股份有限公司 Etching method and device
TWI607487B (zh) * 2015-06-10 2017-12-01 思可林集團股份有限公司 基板處理方法及基板處理裝置

Also Published As

Publication number Publication date
TWI311336B (https=) 2009-06-21

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