TW200706822A - Heat sinking substrate and heat sinking structure applying the same - Google Patents
Heat sinking substrate and heat sinking structure applying the sameInfo
- Publication number
- TW200706822A TW200706822A TW094127687A TW94127687A TW200706822A TW 200706822 A TW200706822 A TW 200706822A TW 094127687 A TW094127687 A TW 094127687A TW 94127687 A TW94127687 A TW 94127687A TW 200706822 A TW200706822 A TW 200706822A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- heat sinking
- substrate
- graphite
- semi
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a heat sinking substrate and a heat sinking structure applying the same. The heat sinking substrate is composed by a graphite layer and a heat conductive metal layer provided on the graphite layer. When the heat sinking substrate is disposed on a heat source, the heat generated by the heat source can be rapidly conducted by the graphite layer because graphite has a faster heat conductivity at a certain direction than conventional heat conductive metal materials. Not only the fast conductivity of graphite due to anisoropic but also the increased structural strength and formation convenience and the non-anisotropic heat sinking features of the metal layer for rapidly diffusing heat to external atmosphere. The heat sinking substrate can be further punched to form plural through holes or semi-punched holes. The semi-punched holes have a certain tilt angle so that not only the area is increased for facilitating heat sinking, but also the arrangement and the size of the semi-punches holes can be used to alter the air flow direction for facilitating cooling.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094127687A TW200706822A (en) | 2005-08-15 | 2005-08-15 | Heat sinking substrate and heat sinking structure applying the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094127687A TW200706822A (en) | 2005-08-15 | 2005-08-15 | Heat sinking substrate and heat sinking structure applying the same |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200706822A true TW200706822A (en) | 2007-02-16 |
Family
ID=57910779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094127687A TW200706822A (en) | 2005-08-15 | 2005-08-15 | Heat sinking substrate and heat sinking structure applying the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200706822A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9447959B2 (en) | 2013-09-14 | 2016-09-20 | Lextar Electronics Corporation | Heat sink for electrical elements and light-emitting device containing thereof |
TWI781718B (en) * | 2021-08-06 | 2022-10-21 | 陳桂芳 | One-piece formed metal heat dissipation plate and heat dissipation device using thereof |
-
2005
- 2005-08-15 TW TW094127687A patent/TW200706822A/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9447959B2 (en) | 2013-09-14 | 2016-09-20 | Lextar Electronics Corporation | Heat sink for electrical elements and light-emitting device containing thereof |
TWI551814B (en) * | 2013-09-14 | 2016-10-01 | 隆達電子股份有限公司 | Heat sink for electrical elements and light-emitting device containing thereof |
TWI781718B (en) * | 2021-08-06 | 2022-10-21 | 陳桂芳 | One-piece formed metal heat dissipation plate and heat dissipation device using thereof |
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