TW200706822A - Heat sinking substrate and heat sinking structure applying the same - Google Patents

Heat sinking substrate and heat sinking structure applying the same

Info

Publication number
TW200706822A
TW200706822A TW094127687A TW94127687A TW200706822A TW 200706822 A TW200706822 A TW 200706822A TW 094127687 A TW094127687 A TW 094127687A TW 94127687 A TW94127687 A TW 94127687A TW 200706822 A TW200706822 A TW 200706822A
Authority
TW
Taiwan
Prior art keywords
heat
heat sinking
substrate
graphite
semi
Prior art date
Application number
TW094127687A
Other languages
Chinese (zh)
Inventor
pei-zhi Yao
Original Assignee
Grand Power Sources Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Grand Power Sources Inc filed Critical Grand Power Sources Inc
Priority to TW094127687A priority Critical patent/TW200706822A/en
Publication of TW200706822A publication Critical patent/TW200706822A/en

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention relates to a heat sinking substrate and a heat sinking structure applying the same. The heat sinking substrate is composed by a graphite layer and a heat conductive metal layer provided on the graphite layer. When the heat sinking substrate is disposed on a heat source, the heat generated by the heat source can be rapidly conducted by the graphite layer because graphite has a faster heat conductivity at a certain direction than conventional heat conductive metal materials. Not only the fast conductivity of graphite due to anisoropic but also the increased structural strength and formation convenience and the non-anisotropic heat sinking features of the metal layer for rapidly diffusing heat to external atmosphere. The heat sinking substrate can be further punched to form plural through holes or semi-punched holes. The semi-punched holes have a certain tilt angle so that not only the area is increased for facilitating heat sinking, but also the arrangement and the size of the semi-punches holes can be used to alter the air flow direction for facilitating cooling.
TW094127687A 2005-08-15 2005-08-15 Heat sinking substrate and heat sinking structure applying the same TW200706822A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094127687A TW200706822A (en) 2005-08-15 2005-08-15 Heat sinking substrate and heat sinking structure applying the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094127687A TW200706822A (en) 2005-08-15 2005-08-15 Heat sinking substrate and heat sinking structure applying the same

Publications (1)

Publication Number Publication Date
TW200706822A true TW200706822A (en) 2007-02-16

Family

ID=57910779

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127687A TW200706822A (en) 2005-08-15 2005-08-15 Heat sinking substrate and heat sinking structure applying the same

Country Status (1)

Country Link
TW (1) TW200706822A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9447959B2 (en) 2013-09-14 2016-09-20 Lextar Electronics Corporation Heat sink for electrical elements and light-emitting device containing thereof
TWI781718B (en) * 2021-08-06 2022-10-21 陳桂芳 One-piece formed metal heat dissipation plate and heat dissipation device using thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9447959B2 (en) 2013-09-14 2016-09-20 Lextar Electronics Corporation Heat sink for electrical elements and light-emitting device containing thereof
TWI551814B (en) * 2013-09-14 2016-10-01 隆達電子股份有限公司 Heat sink for electrical elements and light-emitting device containing thereof
TWI781718B (en) * 2021-08-06 2022-10-21 陳桂芳 One-piece formed metal heat dissipation plate and heat dissipation device using thereof

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