TW200706677A - Sputter source, sputter device - Google Patents
Sputter source, sputter deviceInfo
- Publication number
- TW200706677A TW200706677A TW095108460A TW95108460A TW200706677A TW 200706677 A TW200706677 A TW 200706677A TW 095108460 A TW095108460 A TW 095108460A TW 95108460 A TW95108460 A TW 95108460A TW 200706677 A TW200706677 A TW 200706677A
- Authority
- TW
- Taiwan
- Prior art keywords
- organic thin
- thin film
- sputter
- film
- particle passage
- Prior art date
Links
Classifications
-
- A—HUMAN NECESSITIES
- A63—SPORTS; GAMES; AMUSEMENTS
- A63F—CARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
- A63F13/00—Video games, i.e. games using an electronically generated display having two or more dimensions
- A63F13/30—Interconnection arrangements between game servers and game devices; Interconnection arrangements between game devices; Interconnection arrangements between game servers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q20/00—Payment architectures, schemes or protocols
- G06Q20/08—Payment architectures
- G06Q20/18—Payment architectures involving self-service terminals [SST], vending machines, kiosks or multimedia terminals
-
- G—PHYSICS
- G07—CHECKING-DEVICES
- G07F—COIN-FREED OR LIKE APPARATUS
- G07F17/00—Coin-freed apparatus for hiring articles; Coin-freed facilities or services
- G07F17/32—Coin-freed apparatus for hiring articles; Coin-freed facilities or services for games, toys, sports, or amusements
- G07F17/3244—Payment aspects of a gaming system, e.g. payment schemes, setting payout ratio, bonus or consolation prizes
Landscapes
- Engineering & Computer Science (AREA)
- Business, Economics & Management (AREA)
- Multimedia (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Accounting & Taxation (AREA)
- Strategic Management (AREA)
- General Business, Economics & Management (AREA)
- Finance (AREA)
- Theoretical Computer Science (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
To form a sputtered film on the surface of an organic thin film without causing any damage. A particle passage 130a is arranged at the opening of a cylindrical side wall 103 on which a target 113a is arranged, first and second trap magnets 121a, 122a are arranged on both the sides thereof, so as to form the magnetic line of force at the particle passage 130. Among sputtering particles to pass through the particle passage 130a, only neutral particles can go straight on, thus a sputtered film is formed on the surface of the organic thin film in an object for film formation. Since the flying direction of charged particles and electrons is bent by the magnetic line of force, and can not reach the surface of the organic thin film, damage to the organic thin film is reduced.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005076677A JP4531599B2 (en) | 2005-03-17 | 2005-03-17 | Sputtering source, sputtering equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200706677A true TW200706677A (en) | 2007-02-16 |
TWI390068B TWI390068B (en) | 2013-03-21 |
Family
ID=37002180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095108460A TWI390068B (en) | 2005-03-17 | 2006-03-13 | Sputter source, sputter device |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4531599B2 (en) |
KR (1) | KR101191073B1 (en) |
CN (1) | CN1834285B (en) |
TW (1) | TWI390068B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101363880B1 (en) * | 2011-12-15 | 2014-02-18 | 주식회사 테스 | Sputtering apparatus |
GB201713385D0 (en) * | 2017-08-21 | 2017-10-04 | Gencoa Ltd | Ion-enhanced deposition |
CN110128029A (en) * | 2019-05-08 | 2019-08-16 | 江西沃格光电股份有限公司 | The preparation method and display panel of polychrome film |
CN110306161B (en) * | 2019-07-01 | 2021-11-12 | 北京北方华创微电子装备有限公司 | Semiconductor processing chamber and semiconductor processing equipment |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0285365A (en) * | 1988-09-19 | 1990-03-26 | Toyobo Co Ltd | Method and device for sputtering |
CN1033100C (en) * | 1993-06-22 | 1996-10-23 | 电子科技大学 | Magnetically controlled sputtering source with symmetric magnet |
JPH111770A (en) * | 1997-06-06 | 1999-01-06 | Anelva Corp | Sputtering apparatus and sputtering method |
JP2000080470A (en) * | 1998-09-03 | 2000-03-21 | Ulvac Japan Ltd | Sputtering device having deflecting system |
JP3686540B2 (en) * | 1998-12-22 | 2005-08-24 | 株式会社ルネサステクノロジ | Manufacturing method of electronic device |
US6183614B1 (en) * | 1999-02-12 | 2001-02-06 | Applied Materials, Inc. | Rotating sputter magnetron assembly |
JP2000313958A (en) * | 1999-04-28 | 2000-11-14 | Canon Inc | Thin film deposition system and thin film deposition |
CN100557071C (en) * | 2004-12-28 | 2009-11-04 | 株式会社爱发科 | The manufacture method of sputtering source, sputtering apparatus, film |
-
2005
- 2005-03-17 JP JP2005076677A patent/JP4531599B2/en active Active
-
2006
- 2006-03-13 TW TW095108460A patent/TWI390068B/en active
- 2006-03-15 KR KR1020060023887A patent/KR101191073B1/en active IP Right Grant
- 2006-03-17 CN CN2006100596710A patent/CN1834285B/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR101191073B1 (en) | 2012-10-15 |
TWI390068B (en) | 2013-03-21 |
CN1834285B (en) | 2010-10-06 |
KR20060101292A (en) | 2006-09-22 |
CN1834285A (en) | 2006-09-20 |
JP2006257498A (en) | 2006-09-28 |
JP4531599B2 (en) | 2010-08-25 |
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