TW200706677A - Sputter source, sputter device - Google Patents

Sputter source, sputter device

Info

Publication number
TW200706677A
TW200706677A TW095108460A TW95108460A TW200706677A TW 200706677 A TW200706677 A TW 200706677A TW 095108460 A TW095108460 A TW 095108460A TW 95108460 A TW95108460 A TW 95108460A TW 200706677 A TW200706677 A TW 200706677A
Authority
TW
Taiwan
Prior art keywords
organic thin
thin film
sputter
film
particle passage
Prior art date
Application number
TW095108460A
Other languages
Chinese (zh)
Other versions
TWI390068B (en
Inventor
Toshio Negishi
Masahiro Ito
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of TW200706677A publication Critical patent/TW200706677A/en
Application granted granted Critical
Publication of TWI390068B publication Critical patent/TWI390068B/en

Links

Classifications

    • AHUMAN NECESSITIES
    • A63SPORTS; GAMES; AMUSEMENTS
    • A63FCARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
    • A63F13/00Video games, i.e. games using an electronically generated display having two or more dimensions
    • A63F13/30Interconnection arrangements between game servers and game devices; Interconnection arrangements between game devices; Interconnection arrangements between game servers
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06QINFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q20/00Payment architectures, schemes or protocols
    • G06Q20/08Payment architectures
    • G06Q20/18Payment architectures involving self-service terminals [SST], vending machines, kiosks or multimedia terminals
    • GPHYSICS
    • G07CHECKING-DEVICES
    • G07FCOIN-FREED OR LIKE APPARATUS
    • G07F17/00Coin-freed apparatus for hiring articles; Coin-freed facilities or services
    • G07F17/32Coin-freed apparatus for hiring articles; Coin-freed facilities or services for games, toys, sports, or amusements
    • G07F17/3244Payment aspects of a gaming system, e.g. payment schemes, setting payout ratio, bonus or consolation prizes

Landscapes

  • Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Accounting & Taxation (AREA)
  • Strategic Management (AREA)
  • General Business, Economics & Management (AREA)
  • Finance (AREA)
  • Theoretical Computer Science (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

To form a sputtered film on the surface of an organic thin film without causing any damage. A particle passage 130a is arranged at the opening of a cylindrical side wall 103 on which a target 113a is arranged, first and second trap magnets 121a, 122a are arranged on both the sides thereof, so as to form the magnetic line of force at the particle passage 130. Among sputtering particles to pass through the particle passage 130a, only neutral particles can go straight on, thus a sputtered film is formed on the surface of the organic thin film in an object for film formation. Since the flying direction of charged particles and electrons is bent by the magnetic line of force, and can not reach the surface of the organic thin film, damage to the organic thin film is reduced.
TW095108460A 2005-03-17 2006-03-13 Sputter source, sputter device TWI390068B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005076677A JP4531599B2 (en) 2005-03-17 2005-03-17 Sputtering source, sputtering equipment

Publications (2)

Publication Number Publication Date
TW200706677A true TW200706677A (en) 2007-02-16
TWI390068B TWI390068B (en) 2013-03-21

Family

ID=37002180

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095108460A TWI390068B (en) 2005-03-17 2006-03-13 Sputter source, sputter device

Country Status (4)

Country Link
JP (1) JP4531599B2 (en)
KR (1) KR101191073B1 (en)
CN (1) CN1834285B (en)
TW (1) TWI390068B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101363880B1 (en) * 2011-12-15 2014-02-18 주식회사 테스 Sputtering apparatus
GB201713385D0 (en) * 2017-08-21 2017-10-04 Gencoa Ltd Ion-enhanced deposition
CN110128029A (en) * 2019-05-08 2019-08-16 江西沃格光电股份有限公司 The preparation method and display panel of polychrome film
CN110306161B (en) * 2019-07-01 2021-11-12 北京北方华创微电子装备有限公司 Semiconductor processing chamber and semiconductor processing equipment

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0285365A (en) * 1988-09-19 1990-03-26 Toyobo Co Ltd Method and device for sputtering
CN1033100C (en) * 1993-06-22 1996-10-23 电子科技大学 Magnetically controlled sputtering source with symmetric magnet
JPH111770A (en) * 1997-06-06 1999-01-06 Anelva Corp Sputtering apparatus and sputtering method
JP2000080470A (en) * 1998-09-03 2000-03-21 Ulvac Japan Ltd Sputtering device having deflecting system
JP3686540B2 (en) * 1998-12-22 2005-08-24 株式会社ルネサステクノロジ Manufacturing method of electronic device
US6183614B1 (en) * 1999-02-12 2001-02-06 Applied Materials, Inc. Rotating sputter magnetron assembly
JP2000313958A (en) * 1999-04-28 2000-11-14 Canon Inc Thin film deposition system and thin film deposition
CN100557071C (en) * 2004-12-28 2009-11-04 株式会社爱发科 The manufacture method of sputtering source, sputtering apparatus, film

Also Published As

Publication number Publication date
KR101191073B1 (en) 2012-10-15
TWI390068B (en) 2013-03-21
CN1834285B (en) 2010-10-06
KR20060101292A (en) 2006-09-22
CN1834285A (en) 2006-09-20
JP2006257498A (en) 2006-09-28
JP4531599B2 (en) 2010-08-25

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