TW200705576A - Brittle member treatment apparatus - Google Patents

Brittle member treatment apparatus

Info

Publication number
TW200705576A
TW200705576A TW095114956A TW95114956A TW200705576A TW 200705576 A TW200705576 A TW 200705576A TW 095114956 A TW095114956 A TW 095114956A TW 95114956 A TW95114956 A TW 95114956A TW 200705576 A TW200705576 A TW 200705576A
Authority
TW
Taiwan
Prior art keywords
adhered
tape
treatment apparatus
glass plate
brittle member
Prior art date
Application number
TW095114956A
Other languages
Chinese (zh)
Inventor
Takeshi Akechi
Original Assignee
Lintec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of TW200705576A publication Critical patent/TW200705576A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)

Abstract

In an object (A) to be processed, a semiconductor wafer (W) is adhered to a glass plate (P) through a two-sided adhesive tape (S). The semiconductor wafer (W) is transferred and adhered by peeling the glass plate (P), after being adhered to a dicing tape (DT) adhered on a ring frame (RF). On an outer plane side of the dicing tape (DT), a reinforcing tape (RT) is adhered, and the reinforcing tape (RT) prevents the dicing tape (DT) from stretching at the time of peeling the glass plate (P).
TW095114956A 2005-05-16 2006-04-26 Brittle member treatment apparatus TW200705576A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005142246A JP2006319233A (en) 2005-05-16 2005-05-16 Brittle member treatment apparatus

Publications (1)

Publication Number Publication Date
TW200705576A true TW200705576A (en) 2007-02-01

Family

ID=37431087

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095114956A TW200705576A (en) 2005-05-16 2006-04-26 Brittle member treatment apparatus

Country Status (3)

Country Link
JP (1) JP2006319233A (en)
TW (1) TW200705576A (en)
WO (1) WO2006123508A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008055155A1 (en) * 2008-12-23 2010-07-01 Thin Materials Ag Separation method for a layer system comprising a wafer
JP5996347B2 (en) * 2012-09-24 2016-09-21 リンテック株式会社 Sheet peeling apparatus and peeling method, and sheet pasting apparatus and pasting method
JP5589045B2 (en) 2012-10-23 2014-09-10 日東電工株式会社 Semiconductor wafer mounting method and semiconductor wafer mounting apparatus
JP2015225881A (en) * 2014-05-26 2015-12-14 株式会社ディスコ Sticking method of tape
JP6401009B2 (en) * 2014-10-15 2018-10-03 株式会社ディスコ Wafer processing method

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4757442B2 (en) * 1997-02-10 2011-08-24 リンテック株式会社 Chip body adhesive sheet
JP4312419B2 (en) * 2002-05-09 2009-08-12 リンテック株式会社 Semiconductor wafer processing method

Also Published As

Publication number Publication date
WO2006123508A1 (en) 2006-11-23
JP2006319233A (en) 2006-11-24

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