TW200704792A - Method of ZrCN physical sputtering of magnetron and non-balanced magnetron for micro drill under 0.25 mm - Google Patents

Method of ZrCN physical sputtering of magnetron and non-balanced magnetron for micro drill under 0.25 mm

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Publication number
TW200704792A
TW200704792A TW094125714A TW94125714A TW200704792A TW 200704792 A TW200704792 A TW 200704792A TW 094125714 A TW094125714 A TW 094125714A TW 94125714 A TW94125714 A TW 94125714A TW 200704792 A TW200704792 A TW 200704792A
Authority
TW
Taiwan
Prior art keywords
magnetron
micro drill
zrcn
physical sputtering
balanced
Prior art date
Application number
TW094125714A
Other languages
Chinese (zh)
Other versions
TWI287585B (en
Inventor
zi-wang Zhang
Original Assignee
Raycomm Microwave Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raycomm Microwave Technologies Corp filed Critical Raycomm Microwave Technologies Corp
Priority to TW94125714A priority Critical patent/TWI287585B/en
Publication of TW200704792A publication Critical patent/TW200704792A/en
Application granted granted Critical
Publication of TWI287585B publication Critical patent/TWI287585B/en

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  • Physical Vapour Deposition (AREA)

Abstract

The invention provides a method of ZrCN physical sputtering of magnetron and non-balanced magnetron for a micro drill under 0.25 mm. The method is to use ZrCN physical sputtering of magnetron and non-balanced magnetron to well control the temperature, the bias, the surface cleanness, the flow rate of the introduced gas in a furnace to sputter super-hard ZrCN film on the micro drill with a diameter smaller than 0.25 mm is to enhance strength, wear-resistance, and surface smoothness of the micro drill so that the service life of the micro drill can be extended, the chip removal capability can be enhanced and thus improved quality of the micro drill can be obtained.
TW94125714A 2005-07-29 2005-07-29 Method of ZrCN physical sputtering of magnetron and non-balanced magnetron for micro drill under 0.25 mm TWI287585B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94125714A TWI287585B (en) 2005-07-29 2005-07-29 Method of ZrCN physical sputtering of magnetron and non-balanced magnetron for micro drill under 0.25 mm

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94125714A TWI287585B (en) 2005-07-29 2005-07-29 Method of ZrCN physical sputtering of magnetron and non-balanced magnetron for micro drill under 0.25 mm

Publications (2)

Publication Number Publication Date
TW200704792A true TW200704792A (en) 2007-02-01
TWI287585B TWI287585B (en) 2007-10-01

Family

ID=39201698

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94125714A TWI287585B (en) 2005-07-29 2005-07-29 Method of ZrCN physical sputtering of magnetron and non-balanced magnetron for micro drill under 0.25 mm

Country Status (1)

Country Link
TW (1) TWI287585B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102345094A (en) * 2010-08-04 2012-02-08 鸿富锦精密工业（深圳）有限公司 Coating, coated member with coating, and preparation method of coated member
CN114277351A (en) * 2022-03-03 2022-04-05 中南大学湘雅医院 Coating material and application thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104556149B (en) * 2013-10-22 2017-07-28 华北理工大学 A kind of Zr2CN synthetic method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102345094A (en) * 2010-08-04 2012-02-08 鸿富锦精密工业（深圳）有限公司 Coating, coated member with coating, and preparation method of coated member
CN114277351A (en) * 2022-03-03 2022-04-05 中南大学湘雅医院 Coating material and application thereof

Also Published As

Publication number Publication date
TWI287585B (en) 2007-10-01

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