TW200704476A - Abrasive pad - Google Patents

Abrasive pad

Info

Publication number
TW200704476A
TW200704476A TW095107274A TW95107274A TW200704476A TW 200704476 A TW200704476 A TW 200704476A TW 095107274 A TW095107274 A TW 095107274A TW 95107274 A TW95107274 A TW 95107274A TW 200704476 A TW200704476 A TW 200704476A
Authority
TW
Taiwan
Prior art keywords
psi
pad body
abrasive
elasticity
primary pad
Prior art date
Application number
TW095107274A
Other languages
English (en)
Inventor
Toshihiro Kobayashi
Toshihiro Izumi
Jun Tamura
Takuya Nagamine
Takashi Arahata
Original Assignee
Nippon Micro Coating Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Micro Coating Kk filed Critical Nippon Micro Coating Kk
Publication of TW200704476A publication Critical patent/TW200704476A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
TW095107274A 2005-03-07 2006-03-03 Abrasive pad TW200704476A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005061735A JP2006245445A (ja) 2005-03-07 2005-03-07 研磨パッド

Publications (1)

Publication Number Publication Date
TW200704476A true TW200704476A (en) 2007-02-01

Family

ID=36953243

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107274A TW200704476A (en) 2005-03-07 2006-03-03 Abrasive pad

Country Status (6)

Country Link
US (1) US20070264919A1 (zh)
EP (1) EP1863073A1 (zh)
JP (1) JP2006245445A (zh)
KR (1) KR20070108850A (zh)
TW (1) TW200704476A (zh)
WO (1) WO2006095643A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5687118B2 (ja) 2011-04-15 2015-03-18 富士紡ホールディングス株式会社 研磨パッド及びその製造方法
KR102066002B1 (ko) * 2013-06-10 2020-02-11 삼성전자주식회사 연마 패드 조성물
USD785339S1 (en) * 2014-10-23 2017-05-02 Griot's Garage, Inc. Hand applicator buffing pad
EP3887093A4 (en) * 2018-11-27 2022-08-17 3M Innovative Properties Company POLISHING PADS, AND SYSTEMS AND METHODS OF MAKING AND USE THEREOF

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991014538A1 (en) * 1990-03-22 1991-10-03 Westech Systems, Inc. Apparatus for interlayer planarization of semiconductor material
US5197999A (en) * 1991-09-30 1993-03-30 National Semiconductor Corporation Polishing pad for planarization
JPH08132342A (ja) * 1994-11-08 1996-05-28 Hitachi Ltd 半導体集積回路装置の製造装置
JP3890786B2 (ja) * 1998-11-09 2007-03-07 東レ株式会社 研磨装置および研磨パッド
US7252582B2 (en) * 2004-08-25 2007-08-07 Jh Rhodes Company, Inc. Optimized grooving structure for a CMP polishing pad
US7189156B2 (en) * 2004-08-25 2007-03-13 Jh Rhodes Company, Inc. Stacked polyurethane polishing pad and method of producing the same

Also Published As

Publication number Publication date
EP1863073A1 (en) 2007-12-05
WO2006095643A1 (ja) 2006-09-14
JP2006245445A (ja) 2006-09-14
US20070264919A1 (en) 2007-11-15
KR20070108850A (ko) 2007-11-13

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