TW200703697A - Identical/symmetrical metal shielding - Google Patents
Identical/symmetrical metal shieldingInfo
- Publication number
- TW200703697A TW200703697A TW095119248A TW95119248A TW200703697A TW 200703697 A TW200703697 A TW 200703697A TW 095119248 A TW095119248 A TW 095119248A TW 95119248 A TW95119248 A TW 95119248A TW 200703697 A TW200703697 A TW 200703697A
- Authority
- TW
- Taiwan
- Prior art keywords
- photodetectors
- light
- shielding layers
- metal shielding
- subset
- Prior art date
Links
- 239000002184 metal Substances 0.000 title 1
- 230000003287 optical effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1463—Pixel isolation structures
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US68610505P | 2005-06-01 | 2005-06-01 | |
| US11/439,549 US20060273364A1 (en) | 2005-06-01 | 2006-05-24 | Identical/symmetrical metal shielding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200703697A true TW200703697A (en) | 2007-01-16 |
Family
ID=37493306
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095119248A TW200703697A (en) | 2005-06-01 | 2006-05-30 | Identical/symmetrical metal shielding |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20060273364A1 (zh) |
| EP (1) | EP1889295A1 (zh) |
| JP (1) | JP2008546202A (zh) |
| KR (1) | KR20080012321A (zh) |
| TW (1) | TW200703697A (zh) |
| WO (1) | WO2006130544A1 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9648711B2 (en) * | 2012-06-20 | 2017-05-09 | Koninklijke Philips N.V. | X-ray detector pixel layout |
| US10854648B2 (en) | 2018-12-14 | 2020-12-01 | Novatek Microelectronics Corp. | Image sensor of fingerprint |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0992809A (ja) * | 1995-09-27 | 1997-04-04 | Nikon Corp | 固体撮像装置 |
| JP3319419B2 (ja) * | 1999-02-24 | 2002-09-03 | 日本電気株式会社 | 固体撮像装置 |
| JP2004104203A (ja) * | 2002-09-05 | 2004-04-02 | Toshiba Corp | 固体撮像装置 |
| JP4508619B2 (ja) * | 2003-12-03 | 2010-07-21 | キヤノン株式会社 | 固体撮像装置の製造方法 |
-
2006
- 2006-05-24 US US11/439,549 patent/US20060273364A1/en not_active Abandoned
- 2006-05-30 TW TW095119248A patent/TW200703697A/zh unknown
- 2006-05-31 WO PCT/US2006/020715 patent/WO2006130544A1/en active Application Filing
- 2006-05-31 EP EP06771465A patent/EP1889295A1/en not_active Withdrawn
- 2006-05-31 JP JP2008514747A patent/JP2008546202A/ja not_active Withdrawn
- 2006-05-31 KR KR1020077027728A patent/KR20080012321A/ko not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080012321A (ko) | 2008-02-11 |
| US20060273364A1 (en) | 2006-12-07 |
| WO2006130544A1 (en) | 2006-12-07 |
| JP2008546202A (ja) | 2008-12-18 |
| EP1889295A1 (en) | 2008-02-20 |
| WO2006130544A8 (en) | 2007-06-21 |
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