TW200703425A - Circuit board and method for fabricating the same - Google Patents

Abstract

A circuit board and method for fabricating the same are provided with following steps. First, a core sheet, a first composite metal layer, a second composite metal layer, a first dielectric layer and a second dielectric layer are provided. Wherein, a first patterned circuit layer and a second patterned circuit layer is disposed respectively on the upper and lower surface of the core sheet, and the first dielectric layer and the second dielectric layer possess a plurality of through holes. Then, the first composite metal layer and the second composite metal layer are patterned to form a plurality of fist bumps and the second bumps, respectively. After that, compress the first composite metal layer, the second composite metal layer, the first dielectric layer, the second dielectric layer and the core sheet together. Next, the metal layers of the surfaces of the first composite metal layer and the second composite metal layer are patterned to form a third circuit layer and fourth circuit layer, respectively. Wherein, the third circuit layer is electrically connected to the first circuit layer through the first bumps, and the fourth circuit layer is electrically connected to the second circuit layer through the second bumps.