TW200701484A - Method for preventing the encapsulant flow-out - Google Patents
Method for preventing the encapsulant flow-outInfo
- Publication number
- TW200701484A TW200701484A TW094120263A TW94120263A TW200701484A TW 200701484 A TW200701484 A TW 200701484A TW 094120263 A TW094120263 A TW 094120263A TW 94120263 A TW94120263 A TW 94120263A TW 200701484 A TW200701484 A TW 200701484A
- Authority
- TW
- Taiwan
- Prior art keywords
- preventing
- encapsulant flow
- thimble
- substrate
- encapsulant
- Prior art date
Links
- 239000008393 encapsulating agent Substances 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 abstract 2
- 239000011800 void material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14336—Coating a portion of the article, e.g. the edge of the article
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14065—Positioning or centering articles in the mould
- B29C2045/14131—Positioning or centering articles in the mould using positioning or centering means forming part of the insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/1418—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the inserts being deformed or preformed, e.g. by the injection pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094120263A TW200701484A (en) | 2005-06-17 | 2005-06-17 | Method for preventing the encapsulant flow-out |
US11/192,651 US20060284340A1 (en) | 2005-06-17 | 2005-07-29 | Method for preventing the overflowing of molding compound during fabricating package device |
KR1020050072187A KR20060132428A (ko) | 2005-06-17 | 2005-08-08 | 패키지 디바이스 제조시 몰딩 화합물의 넘침을 방지하는방법 |
JP2005240291A JP2006352056A (ja) | 2005-06-17 | 2005-08-22 | パッケージ装置の封止樹脂溢出防止方法 |
KR1020070026279A KR100801608B1 (ko) | 2005-06-17 | 2007-03-16 | 패키지 디바이스 제조시 몰딩 화합물의 넘침을 방지하는방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094120263A TW200701484A (en) | 2005-06-17 | 2005-06-17 | Method for preventing the encapsulant flow-out |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200701484A true TW200701484A (en) | 2007-01-01 |
Family
ID=37572621
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094120263A TW200701484A (en) | 2005-06-17 | 2005-06-17 | Method for preventing the encapsulant flow-out |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060284340A1 (zh) |
JP (1) | JP2006352056A (zh) |
KR (2) | KR20060132428A (zh) |
TW (1) | TW200701484A (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI355068B (en) * | 2008-02-18 | 2011-12-21 | Cyntec Co Ltd | Electronic package structure |
US8824165B2 (en) | 2008-02-18 | 2014-09-02 | Cyntec Co. Ltd | Electronic package structure |
US11664340B2 (en) * | 2020-07-13 | 2023-05-30 | Analog Devices, Inc. | Negative fillet for mounting an integrated device die to a carrier |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5420752A (en) * | 1993-08-18 | 1995-05-30 | Lsi Logic Corporation | GPT system for encapsulating an integrated circuit package |
US5744084A (en) * | 1995-07-24 | 1998-04-28 | Lsi Logic Corporation | Method of improving molding of an overmolded package body on a substrate |
KR100230520B1 (ko) * | 1997-07-26 | 1999-11-15 | 김훈 | 반도체 소자 패키지 베이스의 제조방법 |
US6635209B2 (en) * | 2000-12-15 | 2003-10-21 | Siliconware Precision Industries Co., Ltd. | Method of encapsulating a substrate-based package assembly without causing mold flash |
JP2003234442A (ja) * | 2002-02-06 | 2003-08-22 | Hitachi Ltd | 半導体装置及びその製造方法 |
US6989122B1 (en) * | 2002-10-17 | 2006-01-24 | National Semiconductor Corporation | Techniques for manufacturing flash-free contacts on a semiconductor package |
-
2005
- 2005-06-17 TW TW094120263A patent/TW200701484A/zh unknown
- 2005-07-29 US US11/192,651 patent/US20060284340A1/en not_active Abandoned
- 2005-08-08 KR KR1020050072187A patent/KR20060132428A/ko active Search and Examination
- 2005-08-22 JP JP2005240291A patent/JP2006352056A/ja active Pending
-
2007
- 2007-03-16 KR KR1020070026279A patent/KR100801608B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20070046802A (ko) | 2007-05-03 |
KR100801608B1 (ko) | 2008-02-05 |
JP2006352056A (ja) | 2006-12-28 |
US20060284340A1 (en) | 2006-12-21 |
KR20060132428A (ko) | 2006-12-21 |
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