TW200700730A - Probe card with stacked substrate - Google Patents
Probe card with stacked substrateInfo
- Publication number
- TW200700730A TW200700730A TW095106587A TW95106587A TW200700730A TW 200700730 A TW200700730 A TW 200700730A TW 095106587 A TW095106587 A TW 095106587A TW 95106587 A TW95106587 A TW 95106587A TW 200700730 A TW200700730 A TW 200700730A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- probe card
- stacked substrate
- contact
- conductive wires
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US65748705P | 2005-03-01 | 2005-03-01 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200700730A true TW200700730A (en) | 2007-01-01 |
Family
ID=36498996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095106587A TW200700730A (en) | 2005-03-01 | 2006-02-27 | Probe card with stacked substrate |
Country Status (7)
Country | Link |
---|---|
US (1) | US7898276B2 (zh) |
EP (1) | EP1943528A1 (zh) |
JP (1) | JP2008532042A (zh) |
KR (1) | KR20080002793A (zh) |
CN (1) | CN101189524A (zh) |
TW (1) | TW200700730A (zh) |
WO (1) | WO2006093704A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI471969B (zh) * | 2012-06-30 | 2015-02-01 | Semes Co Ltd | 插入件組合及包含該組合之電子元件收容裝置 |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1817598A2 (en) * | 2004-12-02 | 2007-08-15 | K & S Interconnect, Inc. | Probe card with segmented substrate |
KR100806736B1 (ko) * | 2007-05-11 | 2008-02-27 | 주식회사 에이엠에스티 | 프로브 카드 및 그 제조방법 |
US7692436B2 (en) * | 2008-03-20 | 2010-04-06 | Touchdown Technologies, Inc. | Probe card substrate with bonded via |
WO2010096714A2 (en) * | 2009-02-19 | 2010-08-26 | Touchdown Technologies, Inc. | Probe head for a microelectronic contactor assembly, the probe head having smt electronic components thereon |
JP5798435B2 (ja) | 2011-03-07 | 2015-10-21 | 日本特殊陶業株式会社 | 電子部品検査装置用配線基板およびその製造方法 |
JP5777997B2 (ja) * | 2011-03-07 | 2015-09-16 | 日本特殊陶業株式会社 | 電子部品検査装置用配線基板およびその製造方法 |
CN103369826A (zh) * | 2012-03-30 | 2013-10-23 | 涌德电子股份有限公司 | 讯号滤波模块焊接的线路板焊盘布局结构 |
US9523713B2 (en) * | 2013-05-28 | 2016-12-20 | Intel Corporation | Interconnects including liquid metal |
US10739381B2 (en) | 2017-05-26 | 2020-08-11 | Tektronix, Inc. | Component attachment technique using a UV-cure conductive adhesive |
US11698390B1 (en) | 2017-12-08 | 2023-07-11 | Signal Microwave, LLC | High-frequency data differential testing probe |
US10852322B1 (en) * | 2017-12-08 | 2020-12-01 | Signal Microwave, LLC | High-frequency data differential testing probe |
KR102581387B1 (ko) * | 2018-09-11 | 2023-09-21 | 삼성전자주식회사 | 프로브 및 이를 포함하는 프로브 카드 |
TWI767803B (zh) * | 2021-07-26 | 2022-06-11 | 旭光科國際有限公司 | Ic測試插座之植針方法及其治具 |
CN113920885B (zh) * | 2021-09-07 | 2022-10-04 | 深圳市科伦特电子有限公司 | Micro LED显示屏及其制造方法、Micro LED显示设备 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6336269B1 (en) * | 1993-11-16 | 2002-01-08 | Benjamin N. Eldridge | Method of fabricating an interconnection element |
JPH11125645A (ja) * | 1997-10-21 | 1999-05-11 | Mitsubishi Electric Corp | 垂直針型プローブカードおよびその製造方法 |
US6705876B2 (en) * | 1998-07-13 | 2004-03-16 | Formfactor, Inc. | Electrical interconnect assemblies and methods |
USRE41515E1 (en) | 1998-08-12 | 2010-08-17 | Tokyo Electron Limited | Contactor and production method for contactor |
US6552555B1 (en) * | 1998-11-19 | 2003-04-22 | Custom One Design, Inc. | Integrated circuit testing apparatus |
US6420884B1 (en) * | 1999-01-29 | 2002-07-16 | Advantest Corp. | Contact structure formed by photolithography process |
US6521479B1 (en) * | 2001-12-28 | 2003-02-18 | Texas Instruments Incorporated | Repackaging semiconductor IC devices for failure analysis |
JP4391717B2 (ja) * | 2002-01-09 | 2009-12-24 | 富士通マイクロエレクトロニクス株式会社 | コンタクタ及びその製造方法並びにコンタクト方法 |
US6707311B2 (en) * | 2002-07-09 | 2004-03-16 | Advantest Corp. | Contact structure with flexible cable and probe contact assembly using same |
US6917102B2 (en) | 2002-10-10 | 2005-07-12 | Advantest Corp. | Contact structure and production method thereof and probe contact assembly using same |
US7459795B2 (en) * | 2004-08-19 | 2008-12-02 | Formfactor, Inc. | Method to build a wirebond probe card in a many at a time fashion |
-
2006
- 2006-02-21 KR KR1020077022339A patent/KR20080002793A/ko not_active Application Discontinuation
- 2006-02-21 CN CNA2006800069424A patent/CN101189524A/zh active Pending
- 2006-02-21 US US11/885,479 patent/US7898276B2/en not_active Expired - Fee Related
- 2006-02-21 JP JP2007558051A patent/JP2008532042A/ja not_active Withdrawn
- 2006-02-21 WO PCT/US2006/005865 patent/WO2006093704A1/en active Application Filing
- 2006-02-21 EP EP06735497A patent/EP1943528A1/en not_active Withdrawn
- 2006-02-27 TW TW095106587A patent/TW200700730A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI471969B (zh) * | 2012-06-30 | 2015-02-01 | Semes Co Ltd | 插入件組合及包含該組合之電子元件收容裝置 |
Also Published As
Publication number | Publication date |
---|---|
EP1943528A1 (en) | 2008-07-16 |
JP2008532042A (ja) | 2008-08-14 |
US7898276B2 (en) | 2011-03-01 |
WO2006093704A1 (en) | 2006-09-08 |
CN101189524A (zh) | 2008-05-28 |
KR20080002793A (ko) | 2008-01-04 |
US20080246501A1 (en) | 2008-10-09 |
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