TW200643232A - Copper clad laminate - Google Patents
Copper clad laminateInfo
- Publication number
- TW200643232A TW200643232A TW095108094A TW95108094A TW200643232A TW 200643232 A TW200643232 A TW 200643232A TW 095108094 A TW095108094 A TW 095108094A TW 95108094 A TW95108094 A TW 95108094A TW 200643232 A TW200643232 A TW 200643232A
- Authority
- TW
- Taiwan
- Prior art keywords
- copper foil
- insulating layer
- clad laminate
- copper clad
- treatment
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides a copper clad laminate exhibiting excellent heat-resistance, noncombustibility, and dimension stability as well as capable of high density packaging, and having excellent adhesion and adhesive strength preservation ability. The copper clad laminate includes an insulating layer formed on a copper foil, wherein a surface of the copper foil contacting with the insulating layer has a Rz of 0.3 to 1.0 μm. The surface of the copper foil contains metal elements of 1 to 15 μg/cm<SP>2</SP> of Ni, 0.1 to 10 μg/cm<SP>2</SP> of Zn, and 1.5-30 μg/cm<SP>2</SP> of Co, when measured with a high frequency induced coupled plasma (ICP) spectroscopy. Furthermore, the surface of the copper foil is performed with a metal extracting treatment, and a treatment using a coupling agent, the metal extracting treatment being used to extract the metals such that a ratio of Co which is indicated by Co/(Ni+Zn+Co) is greater than 0.4. The insulating layer is formed of an aromatic polyimide resin having 205 to 390 equivalent of methyl group, the aromatic polyimide resin being obtained by polymerizing a methyl group containing monomer of one of a diamine or an anhydride.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005070642 | 2005-03-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200643232A true TW200643232A (en) | 2006-12-16 |
TWI406977B TWI406977B (en) | 2013-09-01 |
Family
ID=37631251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095108094A TWI406977B (en) | 2005-03-14 | 2006-03-10 | Copper clad laminate |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR101195090B1 (en) |
TW (1) | TWI406977B (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3906347B2 (en) * | 1998-06-11 | 2007-04-18 | 三井金属鉱業株式会社 | Copper foil for printed circuit |
JP2001270036A (en) * | 2000-03-28 | 2001-10-02 | Ube Ind Ltd | Flexible metal foil laminate |
TWI298988B (en) * | 2002-07-19 | 2008-07-11 | Ube Industries | Copper-clad laminate |
JP2005041049A (en) * | 2003-07-25 | 2005-02-17 | Ube Ind Ltd | Wide copper clad laminated board |
JP4172704B2 (en) | 2003-07-31 | 2008-10-29 | 日鉱金属株式会社 | Surface-treated copper foil and substrate using the same |
-
2006
- 2006-03-10 TW TW095108094A patent/TWI406977B/en not_active IP Right Cessation
- 2006-03-14 KR KR1020060023387A patent/KR101195090B1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20060100203A (en) | 2006-09-20 |
TWI406977B (en) | 2013-09-01 |
KR101195090B1 (en) | 2012-10-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |