TW200641535A - Compound for resist and radiation-sensitive composition - Google Patents

Compound for resist and radiation-sensitive composition

Info

Publication number
TW200641535A
TW200641535A TW095103285A TW95103285A TW200641535A TW 200641535 A TW200641535 A TW 200641535A TW 095103285 A TW095103285 A TW 095103285A TW 95103285 A TW95103285 A TW 95103285A TW 200641535 A TW200641535 A TW 200641535A
Authority
TW
Taiwan
Prior art keywords
resist
compound
radiation
sensitive
sensitive composition
Prior art date
Application number
TW095103285A
Other languages
Chinese (zh)
Inventor
Dai Oguro
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Publication of TW200641535A publication Critical patent/TW200641535A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C49/00—Ketones; Ketenes; Dimeric ketenes; Ketonic chelates
    • C07C49/587—Unsaturated compounds containing a keto groups being part of a ring
    • C07C49/753—Unsaturated compounds containing a keto groups being part of a ring containing ether groups, groups, groups, or groups
    • C07C49/755—Unsaturated compounds containing a keto groups being part of a ring containing ether groups, groups, groups, or groups a keto group being part of a condensed ring system with two or three rings, at least one ring being a six-membered aromatic ring
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/66—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety
    • C07C69/73—Esters of carboxylic acids having esterified carboxylic groups bound to acyclic carbon atoms and having any of the groups OH, O—metal, —CHO, keto, ether, acyloxy, groups, groups, or in the acid moiety of unsaturated acids
    • C07C69/738—Esters of keto-carboxylic acids or aldehydo-carboxylic acids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Materials For Photolithography (AREA)

Abstract

A compound represented by the following formula (1): wherein R1, R2, R3, m0, n0, m1, n1, m2, n2, m3 and n3 are as defined in the specification. A composition comprising at least one compound of the formula (1) and an acid-generating agent forms a non-macromolecule system radiation-sensitive resist of high sensitivity, high resolution, high heat resistance, and solvent solubility by a simple production process, said resist being sensitive to radiations such as excimer laser light, such as KrF, electronic rays, extreme ultraviolet rays (EUV), and an X-ray.
TW095103285A 2005-02-03 2006-01-27 Compound for resist and radiation-sensitive composition TW200641535A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005027731 2005-02-03

Publications (1)

Publication Number Publication Date
TW200641535A true TW200641535A (en) 2006-12-01

Family

ID=36777180

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103285A TW200641535A (en) 2005-02-03 2006-01-27 Compound for resist and radiation-sensitive composition

Country Status (2)

Country Link
TW (1) TW200641535A (en)
WO (1) WO2006082796A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109799680A (en) * 2017-11-16 2019-05-24 奇美实业股份有限公司 Chemical amplification positive photosensitive resin composition and its application

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11143065A (en) * 1997-11-06 1999-05-28 Mitsui Chem Inc Radiation sensitive resin composition
JP4187934B2 (en) * 2000-02-18 2008-11-26 富士フイルム株式会社 Positive resist composition
JP2002099088A (en) * 2000-09-26 2002-04-05 Yasuhiko Shirota Radiation sensitive composition
EP1739485B1 (en) * 2004-04-15 2016-08-31 Mitsubishi Gas Chemical Company, Inc. Resist composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109799680A (en) * 2017-11-16 2019-05-24 奇美实业股份有限公司 Chemical amplification positive photosensitive resin composition and its application
CN109799680B (en) * 2017-11-16 2023-03-10 奇美实业股份有限公司 Chemically amplified positive photosensitive resin composition and use thereof

Also Published As

Publication number Publication date
WO2006082796A1 (en) 2006-08-10

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