TW200641479A - Spread illuminating apparatus - Google Patents

Spread illuminating apparatus

Info

Publication number
TW200641479A
TW200641479A TW095102901A TW95102901A TW200641479A TW 200641479 A TW200641479 A TW 200641479A TW 095102901 A TW095102901 A TW 095102901A TW 95102901 A TW95102901 A TW 95102901A TW 200641479 A TW200641479 A TW 200641479A
Authority
TW
Taiwan
Prior art keywords
point
light source
recess
frame
mounting
Prior art date
Application number
TW095102901A
Other languages
Chinese (zh)
Inventor
Hiroshi Jomen
Makoto Sato
Original Assignee
Minebea Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minebea Co Ltd filed Critical Minebea Co Ltd
Publication of TW200641479A publication Critical patent/TW200641479A/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086—Positioning aspects
    • G02B6/009—Positioning aspects of the light source in the package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Planar Illumination Modules (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Liquid Crystal (AREA)

Abstract

A planar illuminating device in which heat from a point-like light source is effectively radiated taking full advantage of heat conductivity of a metal material and that can prevent positional displacement of the point-like light source. The planar illuminating device (11) has a light guiding plate (2), a point-like light source (3) provided on a light incident surface (2a) of the light guiding plate (2), a circuit board (4) for mounting the point-like light source (3), and a frame (6) for mounting these elements. A recess (10) having a through- hole provided in its bottom surface is formed on one surface (8a) side of a side wall (8), made of a metal material, of the frame (6). The point-like light source (3) is received in the recess (10), with a part of the mounting surface (3b) made to be in contact with the bottom surface of the recess (10), and is connected through the through-hole of the recess (10) to the circuit board (4) provided along the surface (8b) opposite the one surface of the side wall (8). By this, heat produced by the point-like light source (3) can be efficiently transmitted to the frame (6) and radiated.
TW095102901A 2005-01-28 2006-01-25 Spread illuminating apparatus TW200641479A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005021673A JP2006210183A (en) 2005-01-28 2005-01-28 Planar lighting equipment

Publications (1)

Publication Number Publication Date
TW200641479A true TW200641479A (en) 2006-12-01

Family

ID=36740232

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102901A TW200641479A (en) 2005-01-28 2006-01-25 Spread illuminating apparatus

Country Status (3)

Country Link
JP (1) JP2006210183A (en)
TW (1) TW200641479A (en)
WO (1) WO2006080198A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101340437B1 (en) * 2006-09-25 2013-12-11 삼성디스플레이 주식회사 Back cover used in display device, back light assembly and display device having the same
KR101284053B1 (en) 2006-10-26 2013-07-10 삼성디스플레이 주식회사 Back-light assembly and display apparatus having the same
KR101303892B1 (en) 2006-11-03 2013-09-05 삼성디스플레이 주식회사 Backlight assembly and liquid crystal display having the same
KR101367132B1 (en) * 2006-12-05 2014-02-25 삼성디스플레이 주식회사 Light source unit, light emission device and display device provided with the same
JP4973213B2 (en) 2007-01-31 2012-07-11 三菱電機株式会社 Light source device, planar light source device, and display device
JP2010122330A (en) * 2008-11-18 2010-06-03 Hitachi Displays Ltd Liquid crystal display device
KR101055023B1 (en) * 2010-01-15 2011-08-05 엘지이노텍 주식회사 Backlight unit and display device using same
US9563008B2 (en) 2010-09-17 2017-02-07 Lg Innotek Co., Ltd. Lighting module and lighting apparatus including the same
EP2431654B1 (en) * 2010-09-17 2018-11-14 LG Innotek Co., Ltd. Lighting module and lighting apparatus including the same
KR20120095625A (en) * 2011-02-21 2012-08-29 삼성전자주식회사 Display module and display apparatus having the same
EP2527890A1 (en) * 2011-05-25 2012-11-28 Kocam International Co., Ltd. Backlight module with three-dimensional circuit structure
JP6026606B1 (en) * 2015-08-25 2016-11-16 コンクラフト ホールディング コーポレーション エルティーデーＣｏｎｃｒａｆｔ Ｈｏｌｄｉｎｇ Ｃｏ．， Ｌｔｄ． Light guiding structure of fingerprint authentication panel

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10154830A (en) * 1996-09-27 1998-06-09 Nichia Chem Ind Ltd Light emitting device and display device using the same
JP2002278481A (en) * 2001-03-21 2002-09-27 Nippon Signal Co Ltd:The Led display unit and method for manufacturing the same
JP3965929B2 (en) * 2001-04-02 2007-08-29 日亜化学工業株式会社 LED lighting device
WO2003056636A1 (en) * 2001-12-29 2003-07-10 Hangzhou Fuyang Xinying Dianzi Ltd. A led and led lamp

Also Published As

Publication number Publication date
WO2006080198A1 (en) 2006-08-03
JP2006210183A (en) 2006-08-10

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