TW200641370A - Defect detection method - Google Patents

Defect detection method

Info

Publication number
TW200641370A
TW200641370A TW094117536A TW94117536A TW200641370A TW 200641370 A TW200641370 A TW 200641370A TW 094117536 A TW094117536 A TW 094117536A TW 94117536 A TW94117536 A TW 94117536A TW 200641370 A TW200641370 A TW 200641370A
Authority
TW
Taiwan
Prior art keywords
semiconductor sample
detection method
utilizing
defect detection
defect
Prior art date
Application number
TW094117536A
Other languages
Chinese (zh)
Other versions
TWI276818B (en
Inventor
Kun Lin
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW94117536A priority Critical patent/TWI276818B/en
Publication of TW200641370A publication Critical patent/TW200641370A/en
Application granted granted Critical
Publication of TWI276818B publication Critical patent/TWI276818B/en

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

A defect detection method is disclosed, in which the method including: providing a semiconductor sample, wherein the semiconductor sample comprises at least one defect; utilizing a failure analysis for detecting at least one suspected area on the backside the semiconductor sample; utilizing a physical energy for forming a plurality of reference marks around the suspected area on the backside of the semiconductor sample; and utilizing the reference marks for determining the relative location of the defect on the front side of the semiconductor sample.
TW94117536A 2005-05-27 2005-05-27 Defect detection method TWI276818B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94117536A TWI276818B (en) 2005-05-27 2005-05-27 Defect detection method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94117536A TWI276818B (en) 2005-05-27 2005-05-27 Defect detection method

Publications (2)

Publication Number Publication Date
TW200641370A true TW200641370A (en) 2006-12-01
TWI276818B TWI276818B (en) 2007-03-21

Family

ID=38646362

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94117536A TWI276818B (en) 2005-05-27 2005-05-27 Defect detection method

Country Status (1)

Country Link
TW (1) TWI276818B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111370347A (en) * 2020-03-24 2020-07-03 上海华虹宏力半导体制造有限公司 Failure analysis method of power device
CN111553875A (en) * 2020-03-03 2020-08-18 上海华力集成电路制造有限公司 Method and system for searching wafer production abnormal equipment
TWI746680B (en) * 2017-01-19 2021-11-21 日商濱松赫德尼古斯股份有限公司 Inspection method, inspection device, and mark forming method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI746680B (en) * 2017-01-19 2021-11-21 日商濱松赫德尼古斯股份有限公司 Inspection method, inspection device, and mark forming method
TWI802125B (en) * 2017-01-19 2023-05-11 日商濱松赫德尼古斯股份有限公司 Inspection method, inspection device, and mark forming method
CN111553875A (en) * 2020-03-03 2020-08-18 上海华力集成电路制造有限公司 Method and system for searching wafer production abnormal equipment
CN111370347A (en) * 2020-03-24 2020-07-03 上海华虹宏力半导体制造有限公司 Failure analysis method of power device

Also Published As

Publication number Publication date
TWI276818B (en) 2007-03-21

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