TW200641370A - Defect detection method - Google Patents
Defect detection methodInfo
- Publication number
- TW200641370A TW200641370A TW094117536A TW94117536A TW200641370A TW 200641370 A TW200641370 A TW 200641370A TW 094117536 A TW094117536 A TW 094117536A TW 94117536 A TW94117536 A TW 94117536A TW 200641370 A TW200641370 A TW 200641370A
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor sample
- detection method
- utilizing
- defect detection
- defect
- Prior art date
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
A defect detection method is disclosed, in which the method including: providing a semiconductor sample, wherein the semiconductor sample comprises at least one defect; utilizing a failure analysis for detecting at least one suspected area on the backside the semiconductor sample; utilizing a physical energy for forming a plurality of reference marks around the suspected area on the backside of the semiconductor sample; and utilizing the reference marks for determining the relative location of the defect on the front side of the semiconductor sample.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94117536A TWI276818B (en) | 2005-05-27 | 2005-05-27 | Defect detection method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW94117536A TWI276818B (en) | 2005-05-27 | 2005-05-27 | Defect detection method |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200641370A true TW200641370A (en) | 2006-12-01 |
TWI276818B TWI276818B (en) | 2007-03-21 |
Family
ID=38646362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW94117536A TWI276818B (en) | 2005-05-27 | 2005-05-27 | Defect detection method |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI276818B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111370347A (en) * | 2020-03-24 | 2020-07-03 | 上海华虹宏力半导体制造有限公司 | Failure analysis method of power device |
CN111553875A (en) * | 2020-03-03 | 2020-08-18 | 上海华力集成电路制造有限公司 | Method and system for searching wafer production abnormal equipment |
TWI746680B (en) * | 2017-01-19 | 2021-11-21 | 日商濱松赫德尼古斯股份有限公司 | Inspection method, inspection device, and mark forming method |
-
2005
- 2005-05-27 TW TW94117536A patent/TWI276818B/en active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI746680B (en) * | 2017-01-19 | 2021-11-21 | 日商濱松赫德尼古斯股份有限公司 | Inspection method, inspection device, and mark forming method |
TWI802125B (en) * | 2017-01-19 | 2023-05-11 | 日商濱松赫德尼古斯股份有限公司 | Inspection method, inspection device, and mark forming method |
CN111553875A (en) * | 2020-03-03 | 2020-08-18 | 上海华力集成电路制造有限公司 | Method and system for searching wafer production abnormal equipment |
CN111370347A (en) * | 2020-03-24 | 2020-07-03 | 上海华虹宏力半导体制造有限公司 | Failure analysis method of power device |
Also Published As
Publication number | Publication date |
---|---|
TWI276818B (en) | 2007-03-21 |
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