TW200639921A - Method for forming patterned material layer - Google Patents

Method for forming patterned material layer

Info

Publication number
TW200639921A
TW200639921A TW094114349A TW94114349A TW200639921A TW 200639921 A TW200639921 A TW 200639921A TW 094114349 A TW094114349 A TW 094114349A TW 94114349 A TW94114349 A TW 94114349A TW 200639921 A TW200639921 A TW 200639921A
Authority
TW
Taiwan
Prior art keywords
material layer
patterned material
forming patterned
positive photoresist
patterned
Prior art date
Application number
TW094114349A
Other languages
Chinese (zh)
Other versions
TWI246718B (en
Inventor
Chuan-Yi Wu
Jin-Long Chen
Yung-Chia Kuan
Original Assignee
Chunghwa Picture Tubes Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chunghwa Picture Tubes Ltd filed Critical Chunghwa Picture Tubes Ltd
Priority to TW94114349A priority Critical patent/TWI246718B/en
Application granted granted Critical
Publication of TWI246718B publication Critical patent/TWI246718B/en
Publication of TW200639921A publication Critical patent/TW200639921A/en

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  • Drying Of Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

A method for forming a patterned material layer is provided. First, a material layer is formed on a substrate, and then a patterned positive photoresist layer is formed thereon. Next, the material layer is etched by using the patterned positive photoresist layer as a mask. Afterward, a developing process is performed to remove the patterned positive photoresist layer. As mentioned above, the cost can be reduced.
TW94114349A 2005-05-04 2005-05-04 Method for forming patterned material layer TWI246718B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94114349A TWI246718B (en) 2005-05-04 2005-05-04 Method for forming patterned material layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94114349A TWI246718B (en) 2005-05-04 2005-05-04 Method for forming patterned material layer

Publications (2)

Publication Number Publication Date
TWI246718B TWI246718B (en) 2006-01-01
TW200639921A true TW200639921A (en) 2006-11-16

Family

ID=37193809

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94114349A TWI246718B (en) 2005-05-04 2005-05-04 Method for forming patterned material layer

Country Status (1)

Country Link
TW (1) TWI246718B (en)

Also Published As

Publication number Publication date
TWI246718B (en) 2006-01-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees