TW200729564A - Mask apparatus for divided deposition of substrate and patterning method using the same - Google Patents

Mask apparatus for divided deposition of substrate and patterning method using the same

Info

Publication number
TW200729564A
TW200729564A TW095147549A TW95147549A TW200729564A TW 200729564 A TW200729564 A TW 200729564A TW 095147549 A TW095147549 A TW 095147549A TW 95147549 A TW95147549 A TW 95147549A TW 200729564 A TW200729564 A TW 200729564A
Authority
TW
Taiwan
Prior art keywords
substrate
mask
same
patterning method
mask apparatus
Prior art date
Application number
TW095147549A
Other languages
Chinese (zh)
Other versions
TWI331410B (en
Inventor
Taek-Sang Kang
Kyoung-Ook Lee
Dae-Soo Lee
Seung-Han Kim
Original Assignee
Doosan Dnd Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR20050125503A external-priority patent/KR100767006B1/en
Priority claimed from KR1020050127438A external-priority patent/KR100784665B1/en
Application filed by Doosan Dnd Co Ltd filed Critical Doosan Dnd Co Ltd
Publication of TW200729564A publication Critical patent/TW200729564A/en
Application granted granted Critical
Publication of TWI331410B publication Critical patent/TWI331410B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Photovoltaic Devices (AREA)

Abstract

The present invention relates to a mask apparatus for divided deposition of a substrate and a patterning method using the same. With a mask apparatus for forming a pattern on a substrate according to the present invention, the substrate is imaginarily divided into two or more regions and the regions are sequentially patterned. Thus, there is an advantage in that technical and economical problems in manufacturing a large-sized mask can be avoided. In addition, since welding burrs do not come into contact with the substrate when the substrate is in close contact with the mask, the present invention has advantages in that it is possible to prevent damage to the substrate and to allow the substrate to be in closer contact with the mask.
TW095147549A 2005-12-19 2006-12-19 Mask apparatus for divided deposition of substrate and patterning method using the same TWI331410B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20050125503A KR100767006B1 (en) 2005-12-19 2005-12-19 Mask apparatus for deposition
KR1020050127438A KR100784665B1 (en) 2005-12-22 2005-12-22 Mask apparatus for pattern formation of substrate and pattern formation method using the same

Publications (2)

Publication Number Publication Date
TW200729564A true TW200729564A (en) 2007-08-01
TWI331410B TWI331410B (en) 2010-10-01

Family

ID=38188795

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147549A TWI331410B (en) 2005-12-19 2006-12-19 Mask apparatus for divided deposition of substrate and patterning method using the same

Country Status (2)

Country Link
TW (1) TWI331410B (en)
WO (1) WO2007073072A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101041138B1 (en) 2009-03-03 2011-06-13 삼성모바일디스플레이주식회사 Mask for deposition
KR102322010B1 (en) * 2014-10-24 2021-11-05 삼성디스플레이 주식회사 Mask frame assembly, manufacturing method of the same and manufacturing method of organic light emitting display device there used
KR102082784B1 (en) * 2014-12-11 2020-03-02 삼성디스플레이 주식회사 Mask frame assembly, manufacturing method of the same and manufacturing method of organic light emitting display device there used
CN108977760B (en) * 2017-06-02 2020-12-08 京东方科技集团股份有限公司 Mask plate and preparation method and use method thereof
JP7112680B2 (en) * 2017-09-05 2022-08-04 大日本印刷株式会社 Evaporation mask device manufacturing method and deposition mask device manufacturing apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0294427A (en) * 1988-09-30 1990-04-05 Canon Inc X-ray mask structure
JPH0294424A (en) * 1988-09-30 1990-04-05 Canon Inc X-ray mask structure
JPH02144535A (en) * 1988-11-26 1990-06-04 Dainippon Printing Co Ltd Manufacture of mask pattern
JPH0845823A (en) * 1994-08-03 1996-02-16 Sony Corp Exposure device and its method
KR100534580B1 (en) * 2003-03-27 2005-12-07 삼성에스디아이 주식회사 Deposition mask for display device and Method for fabricating the same

Also Published As

Publication number Publication date
WO2007073072A1 (en) 2007-06-28
TWI331410B (en) 2010-10-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees