TW200635687A - Method and device for cutting fragile material plate - Google Patents
Method and device for cutting fragile material plateInfo
- Publication number
- TW200635687A TW200635687A TW095106167A TW95106167A TW200635687A TW 200635687 A TW200635687 A TW 200635687A TW 095106167 A TW095106167 A TW 095106167A TW 95106167 A TW95106167 A TW 95106167A TW 200635687 A TW200635687 A TW 200635687A
- Authority
- TW
- Taiwan
- Prior art keywords
- plate member
- fragile material
- material plate
- upper plate
- lower plate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005046365 | 2005-02-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200635687A true TW200635687A (en) | 2006-10-16 |
Family
ID=36927274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095106167A TW200635687A (en) | 2005-02-23 | 2006-02-23 | Method and device for cutting fragile material plate |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4884370B2 (ko) |
KR (1) | KR20070106714A (ko) |
CN (1) | CN101128294B (ko) |
TW (1) | TW200635687A (ko) |
WO (1) | WO2006090632A1 (ko) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4884370B2 (ja) * | 2005-02-23 | 2012-02-29 | 東レエンジニアリング株式会社 | 脆性材料製板切断方法およびその装置 |
JP2011131229A (ja) * | 2009-12-24 | 2011-07-07 | Hitachi High-Technologies Corp | レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法 |
KR101395054B1 (ko) * | 2012-08-08 | 2014-05-14 | 삼성코닝정밀소재 주식회사 | 강화유리 커팅 방법 및 강화유리 커팅용 스테이지 |
KR101457445B1 (ko) * | 2013-05-09 | 2014-11-06 | 주식회사 케이엔제이 | 커버글라스 제조방법 및 커버글라스 커팅장치 |
WO2015098598A1 (ja) * | 2013-12-27 | 2015-07-02 | 旭硝子株式会社 | 脆性板の加工方法、および脆性板の加工装置 |
CN105643819B (zh) * | 2016-03-18 | 2017-10-03 | 武汉华工激光工程有限责任公司 | 基于激光划线加工工艺的蓝宝石晶圆裂片装置及方法 |
KR102394243B1 (ko) * | 2021-12-15 | 2022-05-03 | 이성준 | 세라믹판 직교 절단 시스템 |
CN114473245A (zh) * | 2022-03-18 | 2022-05-13 | 无锡革新幕墙装饰工程有限公司 | 一种曲面幕墙生产用切割装置 |
KR102506881B1 (ko) * | 2022-10-24 | 2023-03-07 | 주식회사 조호레이저 | 레이저 절단방법 |
CN116393842A (zh) * | 2023-05-26 | 2023-07-07 | 深圳铭创智能装备有限公司 | 一种曲面玻璃边缘膜切割装置及其使用方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS603990A (ja) * | 1983-06-22 | 1985-01-10 | Hitachi Ltd | レ−ザ加工方法 |
JPH08175837A (ja) * | 1994-12-26 | 1996-07-09 | Asahi Glass Co Ltd | ガラス板の割断方法およびそのための装置 |
JPH10244387A (ja) * | 1997-03-04 | 1998-09-14 | Toshiba Corp | 多層断熱材の切断装置および切断方法 |
DE10041519C1 (de) * | 2000-08-24 | 2001-11-22 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchschneiden einer Flachglasplatte in mehrere Rechteckplatten |
JP4884370B2 (ja) * | 2005-02-23 | 2012-02-29 | 東レエンジニアリング株式会社 | 脆性材料製板切断方法およびその装置 |
-
2006
- 2006-02-16 JP JP2007504679A patent/JP4884370B2/ja not_active Expired - Fee Related
- 2006-02-16 KR KR1020077018209A patent/KR20070106714A/ko not_active Application Discontinuation
- 2006-02-16 CN CN2006800057198A patent/CN101128294B/zh not_active Expired - Fee Related
- 2006-02-16 WO PCT/JP2006/302714 patent/WO2006090632A1/ja active Application Filing
- 2006-02-23 TW TW095106167A patent/TW200635687A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20070106714A (ko) | 2007-11-05 |
JP4884370B2 (ja) | 2012-02-29 |
JPWO2006090632A1 (ja) | 2008-07-24 |
WO2006090632A1 (ja) | 2006-08-31 |
CN101128294A (zh) | 2008-02-20 |
CN101128294B (zh) | 2011-12-07 |
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