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Application filed by Chiuan Yan Technology Co LtdfiledCriticalChiuan Yan Technology Co Ltd
Priority to TW094108961ApriorityCriticalpatent/TW200635487A/en
Publication of TW200635487ApublicationCriticalpatent/TW200635487A/en
Cooling Or The Like Of Semiconductors Or Solid State Devices
(AREA)
Cooling Or The Like Of Electrical Apparatus
(AREA)
Abstract
A heat sink is disclosed, comprising an integrally formed substrate, plural heat dissipating fins extended from one side of the substrate, and plural connected notches spread on a side of the substrate different to the one for heat dissipating fins. In the notches, there are disposed with high conductors. When being in use, the side with high conductors is attached onto the electronic component to absorb the heat of the electronic component. The high heat conductive efficiency of the high conductors is used as well as the alternative disposition to quickly conduct the heat to the whole substrate and the heat dissipating fins for being dissipated by the heat dissipating fan, so as to enhance the heat dissipating efficiency and extend the service life of the electronic component.