TW200635465A - Method of fabricating a device-containing substrate - Google Patents

Method of fabricating a device-containing substrate

Info

Publication number
TW200635465A
TW200635465A TW094110141A TW94110141A TW200635465A TW 200635465 A TW200635465 A TW 200635465A TW 094110141 A TW094110141 A TW 094110141A TW 94110141 A TW94110141 A TW 94110141A TW 200635465 A TW200635465 A TW 200635465A
Authority
TW
Taiwan
Prior art keywords
core
insulating layer
fabricating
containing substrate
circuit
Prior art date
Application number
TW094110141A
Other languages
Chinese (zh)
Other versions
TWI260189B (en
Inventor
Yung-Hui Wang
Ching-Fu Hung
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW94110141A priority Critical patent/TWI260189B/en
Application granted granted Critical
Publication of TWI260189B publication Critical patent/TWI260189B/en
Publication of TW200635465A publication Critical patent/TW200635465A/en

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Abstract

A method of fabricating a device-containing substrate is disclosed. First, a core having an interlayer circuit on two sides is provided, and a receiving space is created within the core. Then, the device is embedded into the receiving space, and an insulating layer is formed to encapsulate the device, core and interlayer circuit on the core. Several notches are formed on the insulating layer to expose the electrodes of the device. Then, several through holes are formed to open through the insulating layer and core. Next, a conductive film is formed on the surface of the insulating layer and the sidewalls of the through holes. A conductive layer is grown on the conductive film. Then, an outside circuit is formed by patterning the conductive layer. Finally, a solder mask is formed to cover the outside circuit.
TW94110141A 2005-03-30 2005-03-30 Method of fabricating a device-containing substrate TWI260189B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW94110141A TWI260189B (en) 2005-03-30 2005-03-30 Method of fabricating a device-containing substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW94110141A TWI260189B (en) 2005-03-30 2005-03-30 Method of fabricating a device-containing substrate

Publications (2)

Publication Number Publication Date
TWI260189B TWI260189B (en) 2006-08-11
TW200635465A true TW200635465A (en) 2006-10-01

Family

ID=37872651

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94110141A TWI260189B (en) 2005-03-30 2005-03-30 Method of fabricating a device-containing substrate

Country Status (1)

Country Link
TW (1) TWI260189B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103929895A (en) * 2013-01-15 2014-07-16 宏启胜精密电子(秦皇岛)有限公司 Circuit board with embedded element and manufacturing method of circuit board with embedded element and packaging structure of circuit board with embedded element

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101855056B1 (en) 2008-08-22 2018-05-04 히타치가세이가부시끼가이샤 Photosensitive conductive film, method for forming conductive film, method for forming conductive pattern, and conductive film substrate
TWI399140B (en) 2009-06-12 2013-06-11 Unimicron Technology Corp Fabricating method of embedded package structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103929895A (en) * 2013-01-15 2014-07-16 宏启胜精密电子(秦皇岛)有限公司 Circuit board with embedded element and manufacturing method of circuit board with embedded element and packaging structure of circuit board with embedded element

Also Published As

Publication number Publication date
TWI260189B (en) 2006-08-11

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